> Teardowns & Reverse Costing Analysis
LED : Philips Lumileds – Luxeon Rebel
 Teardown & Reverse Costing Report
PRICE (Multi user license) : 4190 €
Publication date : 1 May 2011
Philips Lumileds – Luxeon Rebel, Teardown & Reverse Costing Report
Physical Analysis of the Device Step by Step
Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
Yole Développement is proud to publish the reverse costing report of the Luxeon Rebel 100lm Cool White LED supplied by Philips Lumileds. Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.
- The Luxeon Rebel Cool White series have a maximum brightness of 100lm at 350mA with an efficiency of 95lm/W.
- The component is provided in a specific 2-pins package, compatible with SMT process.
- It can be used in a wide range of lighting applications, including color-changing lighting, portable and personal lighting, outdoor and indoor directional lighting, commercial lighting and emergency-vehicle lighting.
This report provides a complete teardown of the LED with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Glossary ………………………..………………….…...…3
1. Overview / Introduction……………………….…...…4
- Executive Summary
- Comparison of the Analyzed LEDs
- Reverse Costing Methodology
- GW5BTF27K00
2. Physical Analysis………………………………...……8
- About the Physical Analysis
- Physical Analysis Methodology
- Package Characteristics / Package X-Ray / Package Connection
- Dam and Fill
- Phosphor
- LEDs in the package
- Package synthesis
- Semiconductor Die
- Patterned Sapphire Substrate
- Epitaxial Structure
- Structure
- Passivation
- Cathode
- Anode
- Active Layers – GaN die
- Blue LED Structure
3. Manufacturing Process Flow…………….…………36
- LED Die Process Flow
- Description of the Wafer Fabrication Units
4. Cost Analysis……………………………………………..…..41
- Synthesis of the Cost Analysis
- Yields Explanation
- Yield Hypotheses
- LED Front-End Cost
- Front-End : Epitaxy Hypotheses
- Front-End : Epitaxy Cost / Cost per Steps
- Front-End : Other Front-End Cost
- Front-End : Other Front-End Cost per Steps
- Front-End Cost per Equipment Family
- Front-End Cost per Consumable Family
- Dies per Wafer & Probe Test
- Back-End 0 : Probe Cost
- Back-End 0 : Dicing Cost
- LED Wafer & Die Cost (FE + BE 0)
- Back-End 1 : Packaging Hypothesis
- Back-End 1 : Packaging Process Flow / Packaging Cost Details
- Back-End 1 : Final Test Cost
- Component Manufacturing Cost (FE+BE0+BE1)
- Cost Analysis Evolution
5. Estimated Manufacturer Price Analysis …………………62
- Price definitions
- Manufacturers financial ratios
- Binning Impact on Manufacturing Price
- Ideal manufacturer Price
- Manufacturing Price with Binning Yield
Conclusion ………………………………………………………68
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