The first complete report analyzing in detail the opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications
POLYMER USAGE WILL GROW BY 26% CAGR IN WAFER LEVEL APPLICATIONS OVER 5 YEARS
Polymeric semiconductor material market reached a value of $274M last year and its growth over the next 5 years of more than 26% CAGR will be fueled by the expansion of flip-chip wafer bumping, Fan-in WLCSP packages, 3D WLP, FO WLP packages, 2.5D Glass / Silicon interposers and 3DIC packages.
Yole analysts have gathered market data, technology information and analysis necessary to answer the following questions:
- What materials are being used in what applications ?
- What key properties do I need to understand before I make a material choice ?
- Who are the key supplies of these materials and what is their market share?
- What synergies do competitors have in their product lines ?
AN INCREASING NUMBER OF POLYMERS ARE USED FOR WLP APPLICATIONS
About half of the demand today for polymeric materials in 3DIC & WLP applications is driven by dielectric passivation resins which reached about $107M market value in 2011.
Polymide (PI) and BCB of DOW Chemical still account for > 70% of the total demand, historically by the growth flip-chip bumping an WLCSP passivation steps.
PBO, epoxies, WPR and AL-X recently entered the market thanks to the recent growth demand in 300mm WLCSP, FOWLP and emerging 3DIC applications.
.jpg)
This research will cover :
- Global materials market forecast
- Global forecast breakdown by application
- Global forecast breakdown by function
- Detailed market breakdown of permanent dielectrics by material, supplier, account
A WIDE RANGE OF POLYMERIC MATERIALS ARE USED TO SOLVE WLP ISSUES
There is a wide range of polymeric material available on the market. This study will feature:
- Chemistries and history of key microelectronic polymers
- Properties, pros & cons for each solution
- Applications by polymer type
- Processing considerations
NEW FUNCTIONS OF POLYMERIC MATERIALS ARE LEVERAGING BURGEONING WLP MARKET
Today demand is driven by FC wafer bumping, fan-in WLCSP and thin-film IPD. Tomorrow, significant demand will shift to FOWLP, 3DIC stacks, 3D WLP, and 2.5D interposer substrate platforms.
Types of polymeric materials covered:
- Permanent dielectric polymers
- Thick plating resists
- Temporary bonding & de-bonding adhesives
- Hard mask resist for DRIE etch
- Wafer-level underfills
- Wafer-level molding compounds
- Adhesive tape (BG/Dicing tape)
DETAILED MATERIAL SUPPLIER PROFILES
Corporate profiles detailing financials, employees, polymer products for wafer level packaging and selected properties of these products are compared and contrasted for: 3M, Ajinomoto, Asahi Glass, Asahi Kasei, Brewer Science, Cookson, Dow Chemical, Dow Corning, DuPont, HD Microsystems, Fujifilm, Hitachi Chemical, Henkel, JSR Micro, Lord, Namics, Nitto Denko, Nippon Kayaku, Shin Etsu, Silecs, Simitomo Bakeite, TOK and Toray.
RSS FEEDS
The first complete report analyzing in detail the opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications..jpg)
.jpg)
.jpg)