Executive Summary
Table of Contents
Reverse Costing Methodology
1. Physical Analysis ........................................................................ 6
- Physical Analysis Methodology
- Component Electrical Characteristics
- Package Markings
- Package Opening
- Diode Die Overview
- Cross Section
- Leadframe & Back Side
- Anode Area
- Epitaxy Layer
- Guard Ring
- Diode Trench
- Control Gate Trench
- Diode Structure
2. Manufacturing Process ............................................................. 25
- Process Flow
- Front Side Process Flow
- Back Side Process Flow
- Wafer Fabrication Unit
3. Manufacturing Cost .................................................................... 32
- Economic Analysis
- Yields Explanation
- Unprobed Diode Wafer Cost
- Breakdown per Process Steps
- Breakdown per Equipments
- Breakdown per Consumables
- Probe Test Cost
- Dicing Cost & Package cost
- Final Test Cost
- Component Manufacturing Cost
- Yields synthesis
4. Average Selling Price ................................................................. 49
- Definitions of Prices
- Estimation of the Selling Price
Conclusion ..................................................................................... 53