STMicro LIS331DLH triple-Axis Accelerometer
Reverse Costing Analysis

Yole Développement is pleased to publish a reverse costing report on the LIS331DLH high performance digital 3 axis accelerometer supplied by STMicroelectronics and targeting low-power consumer & industrial applications.

The LIS331DLH is an ultra-low power, digital three-axis accelerometer. The X and Y axis use interdigitated finger capacitors to sense the motion of a proof mass while the Z sensor uses a capacitor plate to sense vertical deflection of a proof mass. The circuit is vertically integrated with the ASIC die on top of the  MEMS die. Targeting low-power consumer market applications, the LIS331DLH can be found in the iPhone 3G.

Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the chip.

This report provides a reverse costing of the MEMS accelerometer with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

• Analyze the cost of projects at the R&D level
• Enhance the negotiation power of purchasing managers
• Benchmark competitor’s products

Glossary

Overview / Introduction

• Executive Summary
• Reverse Costing Methodology

STMicroelectronics Company Profile

• STMicroelectronics
• LIS331DLH Specifications & Block Diagram

Physical analysis

• Synthesis of the Physical Analysis
• Physical Analysis Methodology
• Package Characteristics & Markings
• Package Opening & Bonding Number
• Device Structure
• ASIC – Dimensions
• ASIC – Markings & Bond Pads
• ASIC – Functions
• ASIC Synthesis
• MEMS Sensor – Dimensions and Marking
• MEMS Sensor – X-Axis SEM Views
• MEMS Sensor – Y-Axis SEM Views
• MEMS Sensor – Z-Axis SEM Views
• MEMS Sensor – Capacitances electrodes
• Component Cross-Section
• MEMS Cross-Section
• Mobil Elements Cross-Section
• Physical Data Summary
• MEMS process characteristics

Manufacturing Process Flow

• Global Overview
• ASIC Process Flow
• Description of the ASIC Wafer Fabrication Unit
• MEMS Process Flow
• Description of the MEMS Wafer Fabrication Unit

Cost Analysis

• Synthesis of the Cost Analysis
• Main Steps of Economic Analysis
• Yields Explanation
• Die per wafer & Probe Test
• ASIC Wafer Front-End Cost
• ASIC Die Cost
• MEMS Wafer Front-End Cost
• MEMS Front-End Cost per Process Steps
• MEMS Front-End : Equipment Cost per Family
• MEMS Front-End : Material Cost per Family
• MEMS Back-End 0 : Probe Test & dicing
• MEMS Die Cost (Front End + Back End 0)
• Back-End 1 : Packaging, Final test, calibration
• LIS331DLH Component Cost (FE + BE 0 + BE 1)
• Yields Synthesis

Estimated Manufacturer Price Analysis

• Supply Chain Analysis
• Manufacturers ratios
• Estimated manufacturer Price

Conclusion