Yole Developpement is proud to publish the reverse costing report of the 3-Axis MEMS Gyroscope L3G4200D supplied by STMicroelectronics and featured in the Apple iPhone 4. The L3G4200D is the first 3-axis gyroscope integrated in a consumer smartphone. Based on a single driving mass manufactured using a surface micromachining process, this Tuning Fork MEMS Gyroscope achieves a dimension of 4x4x1.1mm when packaged in its LGA 16-pin package. The L3G4200D 3-axis MEMS gyroscope is suitable for consumer applications (Gaming, User interfaces, Image stabilization, Health and fitness and GPS navigation) and Industrial applications (Motion detection, User interfaces, Robotics). This report provides complete teardown of the geomagnetic sensor with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

This report provides complete teardown of the geomagnetic sensor with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

Glossary

Overview/Introduction..............................................p4

• Executive Summary

• Reverse Costing Methodology

STMicroelectronics Company Profile..................p6

iPhone 4 Teardown...................................................p12

Physical analysis.......................................................p15

•Synthesis of the Physical Analysis

•Physical Analysis Methodology

•Package Characteristics & Markings

•Package X-Ray

•Device Structure

•Package Opening

•ASIC – Dimensions

•ASIC – Markings

•ASIC – Bond Pads

•ASIC – Optical Views

•ASIC – Delayering

•ASIC – Cross-Section

•MEMS – Markings

•MEMS – Bond Pads

•MEMS – Dimensions

•MEMS – Cap Opening

•MEMS – Sensor Optical Views

•MEMS – Senor SEM Views

•MEMS – Cross-Section

•Process Characteristics

•Physical Data Summary

Manufacturing Process Flow..................................p58

•Global Overview

•ASIC Process Flow

•MEMS Process Overview

•MEMS Process Flow (Cap + Sensor + Bonding)

•Description of the Wafer Fabrication Units

Cost Analysis.............................................................p70

•Synthesis of the Cost Analysis

•Main Steps of Economic Analysis

•Yields Explanation

•Yields Hypotheses

•Die per wafer & Probe Test

•ASIC Front-End : Hypotheses

•ASIC Front-End Cost

•ASIC Back-End 0 : Probe Test, Backgrinding & Dicing

•MEMS Front-End : Hypotheses

•MEMS Front-End Cost

•MEMS Front-End Cost per Process Steps

•MEMS Front-End : Equipment Cost per Family

•MEMS Front-End : Material Cost per Family

•MEMS Back-End 0 : Probe Test & Dicing

•MEMS Die Cost (Front End + Back End 0)

•Back-End 1 : Packaging

•Back-End 1 : Final test & Calibration

•L3G4200D Component Cost (FE + BE 0 + BE 1)

 Estimated Manufacturer Price Analysis.............p96

 Conclusion................................................................p100