TEARDOWN - REVERSE COSTING

Yole Développement is pleased to publish the reverse costing report of the 3-Axis MEMS  accelerometers LIS3DH and Apple A2L supplied by STMicroelectronics.

Available on STMicroelectronics portfolio, the LIS3DH is the first linear 3-axis accelerometer in the "nano" family. Packaged in a 3.0x3.0x1.0mm, the device features an ultra-low-power consumption that allows power saving functions in consumer applications.

Specifically made for Apple, the A2L 3-axis accelerometer shares the same silicon dies with the LIS3DH but is packaged in a smaller 2.0x2.0x1.0mm package. The A2L is featured in the Apple iPod Nano 6G.

Manufactured with the same THELMA process than the previous STM inertial sensors, the LIS3DH / A2L uses a new gold-gold thermocompression bonding process which allows the MEMS die area to be shrinked by a ratio of 2 compared to the previous linear 3-axis accelerometer (LIS331DLH). Cumulated with a shrinked ASIC die, the manufacturing cost of this new generation of "Nano" accelerometers has been seriously reduced to fit the price pressure of consumer applications.

CONTENT OF THE REPORT

This report provides complete teardown of the MEMS accelerometer with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

WHO SHOULD BUY THIS REPORT ?

Reverse costing reports contain exclusive information on technology and cost structure, they are useful to:

• Supply-Chain Executives
• Procurement Managers
• Product Line Managers
• Technologists

from

• OEM companies (consumer, telecom)
• MEMS manufacturers
• Semicon Equipment and Materials providers

WHO SHOULD BUY THIS REPORT ?

Reverse costing reports contain exclusive information on technology and cost structure, they are useful to:

• Supply-Chain Executives
• Procurement Managers
• Product Line Managers
• Technologists

from

• OEM companies (consumer, telecom)
• MEMS manufacturers
• Semicon Equipment and Materials providers

Glossary

Overview / Introduction………………….....…….…  4

• Executive Summary
• Reverse Costing Methodology

STMicroelectronics Company Profile…….............  6

iPod Nano 6G Teardown………………....………….  15

Physical analysis……………………………………..  20

• Synthesis of the Physical Analysis
• Physical Analysis Methodology
• Package Characteristics & Markings (LIS3DH)
• Package Characteristics & Markings (A2L)
• Package Pin-Out
• Package X-Ray
• Package Cross-Section
• Device Structure
• Package Opening (LIS3DH)
• Package Opening (A2L)
• ASIC – Dimensions (LIS3DH)
• ASIC – Dimensions (A2L)
• ASIC – Markings
• ASIC – Bond Pads
• ASIC – MIM Capacitors
• ASIC – Delayering
• ASIC – Cross-Section
• ASIC – Process Characteristics
• MEMS – Dimensions (LIS3DH)
• MEMS – Dimensions (A2L)
• MEMS – Markings
• MEMS – Bond Pads Opening
• MEMS – Bond Pads
• MEMS – Cap Opening
• MEMS – Cap
• MEMS – Sealing Frame
• MEMS – Comparison with Previous Generation
• MEMS – Sensor Optical Overview
• MEMS – Sensor SEM Overview
• MEMS Sensor – X/Y Axes
• MEMS Sensor – Z Axis
• MEMS Sensor – Masses Removed
• MEMS – Cross-Section
• MEMS Process Characteristics
• Physical Data Summary

 Manufacturing Process Flow……………........……  78

• Global Overview
• ASIC Process Flow
• Description of the ASIC Wafer Fabrication Unit
• MEMS Process Overview
• MEMS Sensor Process Flow
• MEMS Cap Process Flow
• MEMS Wafer Bonding Process Flow
• Description of the MEMS Wafer Fabrication Unit

 Cost Analysis…………………………………………..  93

• Synthesis of the Cost Analysis
• Main Steps of Economic Analysis
• Yields Explanation
• Yields Hypotheses
• Die per wafer & Probe Test
• ASIC Front-End : Hypotheses
• ASIC Front-End Cost
• ASIC Back-End 0 : Probe Test, Backgrinding  & Dicing
• ASIC Die Cost
• MEMS Front-End : Hypotheses
• MEMS Front-End Cost
• MEMS Front-End Cost per Process Steps
• MEMS Front-End : Equipment Cost per Family
• MEMS Front-End : Material Cost per Family
• MEMS Back-End 0 : Probe Test & Dicing
• MEMS Die Cost (Front End + Back End 0)
• Back-End 1 : Packaging Cost (LIS3DH / A2L)
• Back-End 1 : Final test & Calibration Cost
• LIS3DH Component Cost (FE + BE 0 + BE 1)
• A2L Component Cost (FE + BE 0 + BE 1)

 Estimated Manufacturer Price Analysis…........…  122

• Definition of Prices
• Manufacturer Financial Ratios
• LIS3DH Estimated Manufacturer Price
• LIS3DH Estimated Selling Price
• A2L Estimated Manufacturer Price
• A2L Estimated Selling Price

Conclusion……………………………………...............  129