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MEMS : STMicroelectronics: World’s first inertial MEMS using TSV technology
 Teardown & reverse costing analysis of a special version of the STM 3-Axis Accelerometer LIS302DL.
PRICE (Multi user license) : 4090 €
Publication date : 15 March 2012
STMicroelectronics: World’s first inertial MEMS using TSV technology
Physical Analysis of the Devices
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
Yole Développement is proud to publish the reverse costing report of the world’s first 3-Axis MEMS accelerometer supplied by STMicroelectronics and using Through-Silicon-Via technology.
The Component was extracted from a NOKIA phone and seems to be a special version of the STM 3-Axis Accelerometer LIS302DL.
Packaged in a LGA-14 pin package, the device integrates two dies in a side-by-side configuration and features an ultra low-power consumption that allows power saving functions in consumer applications.
By removing the area reserved for I/O pads, the TSV process allows the MEMS die area to be shrinked when compared to the standard accelerometer. The manufacturing process uses an approach similar to the standard THELMA technology, but adds major changes which increase the final wafer cost.
The report also provides a comparative analysis with the standard ST 3-Axis MEMS Accelerometer, the LIS302DL.
TABLE OF CONTENTS (~112 Pages)
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
STMicroelectronics Company Profile
- STMicroelectronics Profile
- Component Specifications
Physical Analysis
- Synthesis of the Physical Analysis
- Package Characteristics & Markings
- Package Opening
- ASIC Process technology
- ASIC Synthesis
- MEMS – Dimensions and Marking
- MEMS Opening
- MEMS Sensor – biaxial accelerometer
- MEMS Sensor – Z-Axis
- Component Cross-Section
- ASIC Cross-Section
- MEMS Cross-Section
- TSV Cross Section
Standard Component : Short Analysis
Manufacturing Process Flow
- ASIC Wafer Fabrication Unit
- MEMS Wafer Fabrication Unit
- Manufacturing Process Flow: TSV Component
- Manufacturing Process Flow: Standard Component
Cost Analysis
- Synthesis of the Cost Analysis
- ASIC Wafer Front-End Cost
- ASIC Die Cost
- MEMS Wafer Front-End Cost
- MEMS Wafer Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- MEMS Back-End 0 : Probe Test & dicing
- MEMS Die Cost
- Packaging, Final test and Calibration
- Component with TSV Cost
- Standard Component Cost
- Yields Synthesis
Estimated Manufacturer Price
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