This report provides complete teardown of the MEMS gyroscope with:

•  Detailed photos
•  Material analysis
•  Schematic assembly description
•  Manufacturing Process Flow
•  In-depth economical analysis
•  Manufacturing cost breakdown
•  Selling price estimation

TABLE OF CONTENTS (~100 pages)

Glossary

Overview/Introduction

•  Executive Summary
•  Reverse Costing Methodology

Company Profile

•  STMicroelectronics Profil
•  L3G3250A Characteristics
•  Business Model

Physical analysis

•  Package Characteristics & Markings
•  Package X-Ray
•  Package Cross-Section
•  Package Opening
•  ASIC – Dimensions
•  ASIC – Markings
•  ASIC – Cross-Section
•  ASIC Process Characteristics
•  MEMS – Dimensions
•  MEMS – Markings
•  MEMS – Bond Pads
•  MEMS – Cap Opening
•  MEMS – Sensing Area
•  MEMS – Cross-section
•  MEMS Process Characteristics
•  Physical Data Summary

Manufacturing Process Flow

•  Overview
•  ASIC Process Flow
•  MEMS Process Flow
•  Description of the Wafer Fabrication Units

Cost Analysis

•  Synthesis of the Cost Analysis
•  Main Steps of Economic Analysis
•  Yields Explanation
•  Yields Hypotheses
•  Die per wafer & Probe Test
•  ASIC Front-End : Hypotheses
•  ASIC Front-End Cost
•  ASIC Back-End 0 : Probe Test, Backgrinding  & Dicing
•  ASIC Die Cost
•  MEMS Front-End : Hypotheses
•  MEMS Front-End Cost
•  MEMS Back-End 0 : Probe Test & Dicing
•  MEMS Die Cost (Front End + Back End 0)
•  Back-End 1 : Packaging Cost
•  Back-End 1 : Final test & Calibration Cost
•  L3G3250A Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis
Conclusion