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MEMS : STM's smallest inertial modules for consumer applications

Teardown & reverse costing analysis of ST LSM330DLC

PRICE (Multi user license) : 4090 €

Publication date : 9 February 2012

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STM's smallest inertial modules for consumer applications

Physical Analysis of the Devices Step by Step

Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price

Yole Developpement is pleased to publish the reverse costing report of the new 6-axis MEMS Inertial Module supplied by STMicroelectronics performed by System Plus.

The LSM330DLC is a system-in-package featuring a 3-axis accelerometer and a 3-axis gyroscope. With a 4.0x5.0x1.1mm size, the smallest inertial modules for consumer applications. It is manufactured with the same ST THELMA process used for more than 1.5billon other MEMS devices.

The LSM330DLC is targeted for consumer applications: GPS navigation systems, impact recognition and logging, gaming …

This report provides complete teardown of the MEMS IMU with:

Detailed photos
Material analysis
Schematic assembly description
Manufacturing Process Flow
In-depth economical analysis
Manufacturing cost breakdown
Selling price estimation

The report provides also a comparative analysis with the previous ST 6DoF MEMS IMU (ST LSM330DL).

TABLE OF CONTENTS (~160 pages)

Glossary

Overview/Introduction

Executive Summary
Reverse Costing Methodology

ST Company Profile

Product Range
Business Model

Physical analysis

Physical Analysis Methodology
LSM330DLC - Package
- Package Characteristics & Markings
- Package X-Ray
- Package Cross-Section
- Package Opening
LSM330DLC - Accelerometer
- Accelerometer Cross-section
- Accelerometer ASIC
- Accelerometer MEMS
LSM330DLC - Gyroscope
- Gyroscope Cross-section
- Gyroscope ASIC
- Gyroscope MEMS

LSM330DL Short Physical Analysis
ST 3-Axis Accelerometers MEMS Dies Comparison
ST 3-Axis Gyroscopes MEMS Dies Comparison

Manufacturing Process Flow
- Overview
- ASIC/MEMS Process Flows
- Description of the Wafer Fabrication Units

Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Supply Chain Analysis
- Manufacturers financial ratios
- Yields Explanation
- Yields Hypotheses
- ASICs Front-End Cost
- ASICs Back-End 0 Cost (Probe Test and Dicing)
- ASICs Dies Cost (Front End + Back End 0)
- MEMSs Front-End Cost
- MEMSs Front-End Cost per Process Steps
- MEMSs Front-End: Equipment Cost per Family
- MEMSs Front-End: Material Cost per Family
- Back-End 0: Packaging, Probe Test and Dicing Cost
- Back-End 0 Cost per Process Steps
- Back-End 0: Dies Cost (Front End + Back End 0)
- Back-End 1: Final Test & Calibration Cost
- LSM330DLC/DL Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

Conclusion

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