1. Overview / Introduction…………………......……4
– Executive Summary
– Reverse Costing Methodology
2. Company Profiles ……………………....…………6
– SensorDynamics
– Kionix
– ST Microelectronics
3. Physical Analysis……………………......……….11
– Physical Analysis Methodology
– Package Analysis
– ASIC Analysis
– Gyroscope Analysis
– Gyroscope Cross-Section
– Gyroscope process characteristics
– Kionix Accelerometer Analysis
– Accelerometer Structure
– Accelerometer Cross-Section
– Accelerometer process characteristics
4. Manufacturing Process Flow……………..…87
– ASIC Process Flow
– Gyroscope Process Flow
– Accelerometer Process flow
– Description of the Wafer Fabrication Units
5. Cost Analysis………………………………..…107
– Synthesis of the Cost Analysis
– Supply Chain Analysis
– ASIC Wafer Cost
– ASIC Die Cost
– Gyroscope Wafer Cost
– Gyroscope Die cost
– Accelerometer Wafer / Die Cost
– SD746 Packaging Cost
– SD746 Component Manufacturing Cost
6. Estimated Manufacturer Price Analysis …144
– Manufacturers financial ratios
– Estimated manufacturer Price