Yole Developpement is pleased to publish System Plus Consulting teardown & reverse costing report of the GW5BTF27K00 Warm White LED supplied by Sharp. Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.

• The GW5BTF27K00 has a maximum brightness of 355lm at 700mA with a consumption of 6.7W.
• The module is provided in a specific 2-pins package integrating multiple LED chips using COB.

This report provides complete teardown of the LED with:

•  Detailed photos
•  Material analysis
•  Schematic assembly description
•  Manufacturing Process Flow
•  In-depth economical analysis
•  Manufacturing cost breakdown
•  Selling price estimation

Glossary ………………………..………………….…...…3

1. Overview / Introduction……………………….…...…4

• Executive Summary
• Comparison of the Analyzed LEDs
• Reverse Costing Methodology
• GW5BTF27K00

2. Physical Analysis………………………………...……10

• About the Physical Analysis
• Physical Analysis Methodology
• Package Characteristics /  Package X-Ray /  Package Connection
• Dam and Fill
• Phosphor
• LEDs in the package
• Package synthesis
• Semiconductor Die
• Patterned Sapphire Substrate
• Epitaxial Structure
• Structure
• Passivation
• Cathode
• Anode
• Active Layers – GaN die
• Blue LED Structure

3. Manufacturing Process Flow…………….…………39

• LED Die Process Flow
• Description of the Wafer Fabrication Units

4. Cost Analysis……………………………………………..…..44

• Synthesis of the Cost Analysis
• Yields Explanation
• Yield Hypotheses
• LED Front-End Cost
• Front-End : Epitaxy Hypotheses
• Front-End : Epitaxy Cost / Cost per Steps
• Front-End : Other Front-End Cost
• Front-End : Other Front-End Cost per Steps
• Front-End Cost per Equipment Family
• Front-End Cost per Consumable Family
• Dies per Wafer & Probe Test
• Back-End 0 : Probe Cost
• Back-End 0 : Dicing Cost
• LED Wafer & Die Cost (FE + BE 0)
• Back-End 1 : Packaging Hypothesis
• Back-End 1 : Packaging Process Flow / Packaging Cost Details
• Back-End 1 : Final Test Cost
• Component Manufacturing Cost (FE+BE0+BE1)
• Cost Analysis Evolution

5. Estimated Manufacturer Price Analysis …………………70

• Price definitions
• Manufacturers financial ratios
• Binning Impact on Manufacturing Price
• Ideal manufacturer Price
• Manufacturing Price with Binning Yield

Conclusion ………………………………………………………77