Glossary

Overview/Introduction

•        Executive Summary

•        Reverse Costing Methodology

SiTime Company Profile

•        Product Range

•        Business Model

Physical analysis

•        Synthesis of the Physical Analysis

•        Physical Analysis Methodology

•        Package Characteristics & Markings

•        Package X-Ray

•        Package Opening & Bonding Number

•        ASIC Markings

•        ASIC Dimensions

•        ASIC Minimal Dimension and Metal Layers

•        ASIC Process Characteristics

•        Resonator Markings

•        Resonator Dimensions

•        Resonator with Cap and Electrical Contacts

•        Resonator after Cap Polishing

•        Resonator Electrical Contact Details

•        Resonator Cross-Section

•        MEMS process characteristics

Manufacturing Process Flow

•        Overview

•        ASIC Process Flow

•        MEMS Process Flow

•        Description of the Wafer Fabrication Units

Cost Analysis

•        Synthesis of the Cost Analysis

•        Main Steps of Economic Analysis

•        Supply Chain Analysis

•        Manufacturers Financial ratios

•        Yields Explanation

•        ASIC Front-End Cost - Hypothesis

•        ASIC Front-End Cost

•        ASIC Back-End 0 : Probe Test

•        ASIC Back-End 0 : Backgrinding and Dicing

•        ASIC Wafer Cost

•        ASIC Die Cost

•        MEMS Front-End Cost - Hypothesis

•        MEMS Front-End Cost

•        MEMS Front-End Cost per Process Steps

•        MEMS Front-End : Equipment Cost per Family

•        MEMS Front-End : Material Cost per Family

•        MEMS Back-End 0 : Probe Test

•        MEMS Back-End 0 : Backgrinding and Dicing

•        MEMS Wafer Cost

•        MEMS Die cost

•        SiT8002 Packaging Cost Hypothesis & Process Flow

•        SiT8002 Packaging Cost

•        SiT8002 Final Test Cost

•        SiT8002 Component Manufacturing Cost

•        Yield Synthesis

•        SiT8002 Cost Analysis Evolution

Estimated Manufacturer Price Analysis

Conclusion