One of the few high volume 3D embedded dies package
Latest evolution of the TDK SESUB Process
TDK-EPC and Maxim Integrated have joined forces to provide an innovative power management solution with an embedded die technology.
Integrated in some version of the BlackBerry Z10, the P8009 Power Management Unit (PMU) of TDK-EPC is one of the few high-volume embedded dies package. It integrates two ICs from Maxim Integrated, a power management IC (PMIC) and a 16-bit MCU, to reduce the module size by 60% compared to using conventional discrete devices and BGA packages.
The embedded die process of TDK-EPC, called SESUB (Semiconductor embedded in SUBstrate), is an innovative packaging technology based on the emerging embedded die in laminate substrate concept where all of the package assembly operations are done at the panel-scale level. A 4-layer 3D interconnection routing path with 20µm minimum line width is provided. This technology extends the package size beyond the ICs surface area and allows for mounting additional passives components on top of the laminated module.
With this packaging approach, TDK considerably changed the conventional supply chain model, where the chip maker sells directly to the system maker. Here the module maker is taking a larger role by adding considerable value.
This report provides a complete teardown of the embedded dies package with:
Detailed photos & Material analysis
Schematic assembly description
Manufacturing Process Flow
In-depth manufacturing cost analysis
Supply chain evaluation
Exhaustive cost breakdown and selling price estimation