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A favorable market situation
3D integration with TSV is a breakthrough integration technology which is expected to have a huge impact in the future of advanced packaging. Through Si Vias (TSV) can address various 3D technology platforms with different characteristics:
- 3D WLP for CMOS image sensors, MEMS or Power Amplifiers
- 3D TSV for stacking memories and logic 3D SoC with small
- 3D interposer platform in substitution of organic substrate to combine heterogeneous dies together such as MEMS and ASIC
CMOS Image Sensors and MEMS have already start to shift from their conventional interconnects architecture to 3D TSV. 3D stacked memories (RAM and Flash) should follow in 2009.
However, one barrier to entry for stacking chips in 3D with TSV is the cost of the technology. The wide range of scenarios regarding processes and via architectures are still major hurdles today as TSVs are directly competing against low cost 3D interconnect technologies such as wire bonding. One current solution to lower cost is to leverage existing infrastructure used in CMOS fabs and wafer level packaging industries.
How can Yole’s “TSV+ Cost Analysis Tool” help you?
Yole CoO tool has been specifically designed to estimate the cost/wafer level for your TSV+ scenario.
Any company choosing to implement a TSV process will face with many decisions such as:
- Vias dimensions (diameter, depth, tapered via or not),
- Vias drilling processes (DRIE or laser),
- Vias filling (Copper, Tungsten, PolySi, Paste Printing …),
- Bonding / Stacking process (CuCu, direct oxide fusion, hybrid adhesive…),
- Choice for a temporary bonding step or not …
Being in strong interactions with 3D IC equipments, materials and chip makers through all the year, we have carefully developed among time an intuitive Cost of Ownership (CoO) tool model specifically designed to evaluate the cost of a given TSV process flow.
TSV+ new version now includes up-to-date information regarding latest equipment parameters (cost, throughput …) and the possibility to calculate the TSV CoO by taking into account existing infrastructure, fab utilization and available tools in-house. TSV+ allows you the implementation of your own Through Si Vias parameters and manufacturing facility characteristics. It can thus be used for any kind of applications: memories, MEMS, CMOS image sensors, RF SiP …
TSV+ is using Excel TM interface in order to be widely exploitable and upgraded. This Yole’s CoO tool will enable you to evaluate what is the cost per wafer level for manufacturing your TSVs using your own inputs or using pre-defined parameters.
Beginner or expert mode
Yole’s CoO tool can be used two different ways. If you are not yet familiar with the different TSV option choices available, you will have the possibility to use a beginner mode. Some parameters have been pre-defined but, among others, you will still be able to choose the following: vias’ characteristics (diameter, depth, angle, density), choice between DRIE or laser, different via filling materials (Cu, Tungsten, PolySi, paste...), type of bonding (Cu-Cu, BCB, direct oxide), W2W or C2W stacking …
If you are already familiar with TSV technology and want to know the cost of ownership for your own process, you will be able to access the expert mode. This will allow you to define your own TSV process scenario with related materials & equipments libraries as well as generic fab parameters. For example, you will be able to define for each equipment its throughput, operator and engineering time, equipment footprint, associated consumables (gases, slurries, glass wafer, advanced resist...), tool price and amortization time period.
The tool will allow you to define and tune your own fab
parameters:
- number of wafers / year processed,
- global process yield,
- # working days / year,
- operator cost / year,
- engineer cost / year,
- clean Room (CR) class,
- CR maintenance cost ($/m²/year),
- CR electricity consumption ($/m²/year),
- CR amortization period (year),
- equipment amortization period (year),
- ...
Additionally, you will be able to consider the level of automation of your fab, and its geographical location (will TSV fab located in North America, China, Japan, Europe, Taiwan...).
... and then, access directly to the TSV cost breakdown showing
where the cost "pain points" are!
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Evaluate the cost of ownership for your TSV scenario with Yole "TSV+ Cost Analysis Tool".