TSV CoSim+
TSV MANUFACTURING COST SIMULATION TOOL
Evaluate the production cost of any TSV process
from final wafer to bare die
Review the demo video of the tool here
A TOOL DESIGNED for 3D TSV TECHNOLOGY
- 3D integration with Through Si Vias (TSV) continues to be developed to address different 3D technology platforms with different characteristics such as 3D MEMS, 3D stacking memories and logic, 3D interposers, 3D WLP of CIS, LED…
- With manufacturing technologies in constant development with many different options, the need for cost simulation of TSV is rising.
- The cost of the TSV technology can be very difficult to estimate due to the wide range of technological options (via-first, via-last, type of etching processes…).
MAIN FEATURES
Multiple process flows
- Any TSV process flow can be simulated.
- Hierarchical description for multiple wafer processes.
- Simulate cost for a variety of different conditions (region, clean room class, process type, etc).
- Integrated equipment, wafer & materials databases.
- Possibility to store an unlimited number of process steps or process flows in libraries.
- Simulation of up to five simultaneous scenarios allowing the user to run sensitivity analysis and compare results like yield improvement, manufacturing location impact on cost, etc.
Multiple subcontracting operations
- Costs of usually externalized operations can be precisely evaluated by setting their individual regional and commercial parameters.
No admin privilege is required for setup
- TSV Cosim+ is working from a single MS-Excel™ file and an external and sharable data file.
- Requires only basic MS-Excel ™ or MS-Office™ suite (from 2003 to 2010 release)
Results are fully open-format
- You can modify or export final results, and build reports your own style as with any Excel workbook.
Workgroup-compliant, safely
- All the data managed by TSV Cosim+ are stored in an external MS-Access™ database file. Data cannot be read from the single Excel file and access rights to the database are needed. Multiple access, data sharing and data integrity are secured.
WORKING WITH TSV Cosim+
PRODUCT DESCRIPTION
TSV COSIM+ DATABASES
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TSV COSIM+ RESULTS EXAMPLES
RSS FEEDS
Evaluate the production cost of any TSV process
from final wafer to bare die