A powerful tool designed for the 3D TS V technology
• 3D integration with Trough Si Vias TSV continues to be developed to address different 3D technology platforms with different characteristics such as 3D MEMS, 3D TSV for stacking memories and logic, 3D interposers, 3D WLP of CIS …
• With manufacturing technologies in constant developments with many different options, the need for cost simulation of TSV is rising.
• The cost of the TSV technology can be very difficult to estimate due to the wide range of technological options (via-first, via-last, type of etching processes …)
• This is why Yole has improved its TSV+ Cost Simulation Tool to provide a new, more powerful version with a new interface.
• Yole Développement, leader in the analysis of MEMS applications and market, and System Plus Consulting, leader in the cost analysis of electronic products have joined their experiences to provide this unique cost simulation tool.
The multiple benefits of TSV CoSim +
The functions:
• Possibility to run the cost simulation for different geographical zone, clean room class …
• Integrated Fab units Database
• Integrated Alchimer AquiVia process for comparison between wet and dry processes for insulation/seed/barrier
• Very High flexibility :
- TSV CoSim+ allows the user to enter any TSV process flow
- The manufacturing process flows are created dynamically in a friendly hierarchical view (treeview) where each process steps can be moved, modified or deleted.
- The user can save an unlimited number of process flow, equipment and materials
- A project manager offer the possibility to save all the user hypotheses (Wafer Fabunit, process flow, yields…) and to reuse them later.
• Integrated Equipment, Wafer & Materials databases
• Two calculation modes: dedicated and non-dedicated fab
• Up to five scenarios simulation allowing the user to compare yields improvement, manufacturing location impact on cost…
• TSV CoSim+ is using ExcelTM interface in order to be widely exploitable and upgraded. This tool will enable you to evaluate what is the cost per wafer level for manufacturing TSV using your own inputs or using pre-defined parameters.
The use of TSV CoSim+ :
• Understanding of the cost structure
• Competitive analysis
• Cost evaluation for different technological options
• Identification of the cost pain points in your process
• Definition of a business model (fables, fablight, manufacturing …)
What is new
Compared to the first version of TSV+, numerous new functionalities have been added:
• More user friendly interface
• Much more flexibility to define and enter your own TSV process
• Possibility to compare different business model scenarios : dedicated fab, use of external foundry services
• Updated equipment & materials database
• Pre-loaded via-first & via-last scenarios
• Integration of Alchimer AquiVia process for comparison
Examples of results
Typical TSV CoSim+ results are:
• Possibility to compare up to 5 different scenarios
• Cost of the wafer with breakdown (depreciation cost, manufacturing cost, labor cost, yield losses)
• Cost of the wafer by steps (DRIE, sacrificial release …)
• Equipment cost of the wafer by steps
• Equipment cost of the wafer by equipment families (etching, deposition, lithography, bonding…)
• Material cost of the wafer by steps (wet chemicals, gases, sputter targets …)
• Material cost of the wafer by material families
• Cost of the TSV with breakdown between wafer, test, dicing
RSS FEEDS
Evaluate the Cost of Ownership for your TSV Scenario with this New Version of Yole TSV Cost Simulation Tool.