3D integration with Through Si Vias (TSV) continues to be developed to address different 3D technology platforms with different characteristics such as 3D MEMS, 3D stacking memories and logic, 3D interposers, 3D WLP of CIS, LED…
With manufacturing technologies in constant development with many different options, the need for cost simulation of TSV is rising.
The cost of the TSV technology can be very difficult to estimate due to the wide range of technological options (via-first, via-last, type of etching processes…).
Multiple process flows
Any TSV process flow can be simulated.
Hierarchical description for multiple wafer processes.
Simulate cost for a variety of different conditions (region, clean room class, process type, etc).
Possibility to store an unlimited number of process steps or process flows in libraries.
Simulation of up to five simultaneous scenarios allowing the user to run sensitivity analysis and compare results like yield improvement, manufacturing location impact on cost, etc.
Multiple subcontracting operations
Costs of usually externalized operations can be precisely evaluated by setting their individual regional and commercial parameters.
No admin privilege is required for setup
TSV Cosim+ is working from a single MS-Excel™ file and an external and sharable data file.
Requires only basic MS-Excel ™ or MS-Office™ suite (from 2003 to 2010 release)
Results are fully open-format
You can modify or export final results, and build reports your own style as with any Excel workbook.
All the data managed by TSV Cosim+ are stored in an external MS-Access™ database file. Data cannot be read from the single Excel file and access rights to the database are needed. Multiple access, data sharing and data integrity are secured.
WORKING WITH TSV Cosim+
TSV COSIM+ DATABASES
TSV COSIM+ RESULTS EXAMPLES
For more information about our company, specific custom analysis or reports, please feel free to contact us
Yole Développement Headquarter, France:
David Jourdan, Sales Coordination & Customer Service
Tel: +33 472 83 01 90, Email: firstname.lastname@example.org
Yves Devigne, Europe Business Development Manager
Cell : +33 6 75 80 08 25 - Email : email@example.com