- Market Perspectives
- Technical Analysis
- Reverse Costing Analysis
Get inside the first high volume Through Silicon Via implementation. This exclusive report, jointly published by Chipworks and Yole Developpement, analyzes the technology and economics behind Toshiba’s latest Dynastron CMOS Image Sensor. Leveraging downstream product teardowns and semiconductor reverse engineering this report provides evidence-based analysis on the technical achievements and cost of the device.
KEY FEATURES
• More than 50 high resolution images (SEM,Optical, X-Ray) of Toshiba’s TSV VGA sensor and camera module
• Complete Reverse Costing Analysis of the miniature VAG camera module component (from the Front-end , TSV / WLP packaging to the optical module assembly)
• Full decomposition of the TSV / WLP manufacturing process sequence that highlights the major technical hurdles that have been solved
• Analysis of WLP / TSV market opportunities in CMOS image sensor applications
OBJECTIVES OF THE REPORT
• To combine the key analysis of a market research supplier and a reverse engineering firm into a report that delivers value across the organization
• To deliver a complete analysis of the first, high volume Through-Silicon-Via (TSV) implementation, with highlights on:
- Present & future market landscape for this product and technology
- Analysis of the TSV manufacturing process flow sequence and final assembly cost structure of the full camera module with evidence obtained from reverse engineering
ABOUT THE AUTHORS:
Chipworks Inc. is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems.
The company’s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world’s largest semiconductor and microelectronics companies. These companies depend on Chipworks to secure, defend, and grow market share, and to save millions of dollars in royalty payments and product design costs, allowing them to earn millions by licensing patents, designing superior products, and launching new products faster.
Yole Développement is a market research and business development consulting company, facilitating market access for advanced technology industrial projects.
With more than 20 consultants, Yole Développement is working worldwide with the key industrial companies, R&D institutes and investors in order to help them to understand the markets and technology trends in the MEMS, Advanced Packaging, Compound Semiconductor & Solar industry fields.
RSS FEEDS
This exclusive report, jointly published by Chipworks and Yole Developpement, analyzes the technology and economics behind toshiba’s latest Dynastron CMOS Image sensor. Leveraging downstream product teardowns and semiconductor reverse engineering this report provides evidence-based analysis on the technical achievements and cost of the device.