Executive Summary p2
Reverse Costing methodology p6
Physical Analysis p7
• Physical Analysis Methodology
• Digital Micromirror Device
• Package
• Optical Apertures
• Ceramic substrate
• Micromirrors - Pictures
• ASIC Process Characeristics
• Functional Blocks Area
• Synthesis Part 1
Manufacturing Process p20
• Front End Process Flow
• Back End Process Flow
• Wafer Fabrication Unit
• Synthesis Part 2
Manufacturing Cost p26
• Wafer Cost Data
• Main Steps of Economic Analysis
• ASIC Wafer Cost
• Front End MEMS Wafer Costs
- Breakdown per Process Steps
- Breakdown per Equipment
- Breakdown per Consumables
• Probe Test Cost
• Windows and Walls Costs
• Back End Wafer Cos
- Breakdown per Process Steps
- Breakdown per Equipment
- Breakdown per Consumables
• Total Wafer Cost
• DMD Silicon Cost
• Packaging Cost
• Final Test Cost
• Component Manufacturing Cost
• Synthesis part 3
Average Selling Price p53
• Definitions of Prices
• Manufacturing Price
• ASP Evolution by Quantity Order
Conclusion p56
Glossary p57