Thin Wafer Manufacturing Equipment & Materials Markets
Temporary bonding equipment market will see 5x growth in value 2011-2016
WHY THIN WAFERS WILL REQUIRE SPECIAL HANDLING PROCESSES & TECHNOLOGIES
Many consumer applications will require the need for ultra-thin semiconductor wafers (down to 50μm). But as wafer thickness decreases from the traditional 500μm to 100μm and below, manufacturing challenges arise. Indeed, ultra-thin wafers are less stable and more vulnerable to stresses, and die can be prone to breaking and warping—not only during grinding but also at subsequent processing steps. To address these challenges, as chip thickness is reduced, new processes including temporary bonding technologies will be required for handling such fragile wafers, specifically to support the wafer during backgrinding and subsequent post-thinning processes.
As tapes can no longer be used for ultra-thin wafers (main reasons are the non-uniformity of the tapes, adhesion and extreme flexibility), new wafer handling technologies have to be developed. We are at the very start of an impressive market growth for temporary bonding technology. The “Thin Wafer Manufacturing Equipment & Materials Market” report is the first Yole report to describe the markets, applications and technologies for thin wafer manufacturing: our scope covers temporary bonding markets, applications, descriptions and trends for wafer thinning and dicing. This report also includes a market analysis on temporary bonding materials (wax, glue, tapes, carrier wafers) associated with the temporary bonding technology.
MANY DIFFERENT APPROACHES IN DEVELOPMENT
Temporary bonding technologies are numerous with no clear winning scenario coming out today. We have identified at least 6 different technologies for wafer temporary bonding with carriers (see figure 1). Each one of these approaches might have subtle differences in terms of chemistry, carriers and other attributes. Along with these approaches came also temporary bonding without carrier and reconstituted wafer for Fan Out WLP. So, the total number of approaches is more than 10 as of today. But this market is still in infancy and no clear temporary bonding technology is emerging. Many companies are competing to propose the best approach to achieve low cost, high temperature resistance and resolve topography issues
As temporary bonding is a multi-disciplinary technology, it implies mastering know-how in process, chemistry and an understanding of the final application requirements. As a consequence, there are numerous collaborations running between tool makers, chemical players and substrate suppliers. Some companies are mastering both process and chemistry (Nitto Denko, TOK or TEL), but for others, partnerships are necessary.
THE TEMPORARY BONDING MARKET WILL UNDERGO A 5X MARKET GROWTH OVER 2011-2016
Temporary bonding is definitively a multiple-applications market. This is why the market is expected to boom. We estimate the total number of wafers requiring temporary wafer bonding will be more than 35M by 2016 (all wafer sizes). Main applications driving temporary bonding are Advanced Packaging applications (TSV, interposers and Fan Out WLP), Power Devices (IGBTs), RF Devices & LEDs.
By 2016, we evaluate the wafer temporary bonding (WTB) market equipment value for wafer & panels to be $300M by 2016.
KEY FEATURES OF THE REPORT:
The report will analyze in detail the technical & economic evolution of the temporary wafer bonding process and wafer thinning and dicing. It will give:
- 2010-2016 Market Forecasts for temporary bonding in MUS$ value and number of equipment
- By application (Advanced Packaging: 3D TSV Interposers, FO WLP, LEDs, RF, Power, MEMS)
- By wafer size
- 2010-2016 Market Forecast for temporary bonding chemistry
- Overview of the different temporary bonding approaches, e.g.:
- Without carrier
- With Carrier:
- UV laser released, Electrostatic, Thermal release, Mechanical release, Chemical release
- Reconstitued wafer
- What the trends for temporary wafer bonding are
- What the trends for wafer thinning are
- What the trends for wafer dicing are
- Description of the applications for temporary wafer bonding with main characteristics, challenges
- Equipment players market shares and competitive information
COMPANIES CITED IN THE REPORT:
3M, ABB, Accretech, AIT, All Via, ALSI, AMAT, Brewer Science, Corning, Danfoss, Denka, Disco, DoubleCheck Semiconductors, Dupont, Dynatex, ERS, ESI, EVG, Fairchild, FhG IZM, Fico, Furukawa, Hamamatsu, Hitachi Chemical, Infineon, Invensense, IR, Jenoptik, Laserod, Leti, Lintec, Loadpoint, Lumileds, Mitsui Chemicals, Nitronex, Nitta, Nitto Denko, OnSemi, Osram, Okamoto, Panasonic, Plan Optik, ProTec, PVA Tepla, RFMD, Ricmar, Rorze, Schott, Scrypt, Sekisui, Shibuya, ShinEtsu, Skyworks, STM, Strasbaugh, Sumitomo Bakelite, Sumitomo Chemical, SUSS MicroTec, Synova, Sysmelec, Takada, TEL, TMAT, TOK, Triquint, Veeco, Yushin…
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Temporary bonding equipment market will see 5x growth in value 2011-2016