MEMS : Thin Wafer Market & Applications
 27% of total processed semiconductors are thinned today. In 2016, this ratio will exceed 50%!
Price : 3990 €
Publication date : 10 October 2011
Thin Wafer Market & Applications,
technology & market report - October 2011
27% of total processed semiconductors are thinned today.
In 2016, this ratio will exceed 50%!
THIN WAFERS TARGET MANY APPLICATIONS
Thin wafers will be increasingly used in many diverse applications. The Yole “Thin Wafer Applications” report describes the applications that require thin and ultra-thin wafers: MEMS, CMOS Image Sensors, 3D Packaging (incl. Interposers), Memories, RF Devices, Power Devices and LEDs.
While Memories & Logic will account for the largest fraction of thinned wafers, many other applications are concerned.
MEMS are always characterized by a wide range of process and technologies. This is certainly the application where the widest range of wafer thickness can be found (e.g. the 3-axis gyro from InvenSense is a stack of 3 wafers with intermediate layer of 33μ thickness). To answer the need for thinner sensors for cell phone applications, capping, sensitive elements and MEMS ASIC will get thinner over the next years, specifically for inertial MEMS. For CMOS Image Sensors (CIS), Backside Illumination (BSI) now enables 100% Fill-factor, which opens the opportunity for CMOS sensor with higher Sensitivities or Higher Resolution. But we need to handle VERY thin layer as for a BSI CIS, the active layer is < 10μ. CIS wafers will also be thinner for packaging purposes (TSV, WLCSP).
Memories can be stacked in different ways: wire bonding or TSV. 3D stacking is the next big thing for memory integration with thickness as low as 25μ in 2016. But wire bonding will still be used for a few years and TSV volume will start to be significant in 2013.
Main Power Devices requiring thin wafers are IGBTs but others power devices could use thin wafers. For Power Devices, thin wafers allow low Ron, thus improve current carrying capability and minimize power consumption. For LEDs, GaAs, sapphire and SiC wafers are thinned as well.
MARKET DRIVERS FOR THIN WAFERS
Motivations for thin wafers are: high interconnect density (such as aggressive TSV pitch & diameters), better power dissipation and higher electrical performance and reduced package size.
Consumer electronics are driving the need for smaller, higher performing, lower cost device configurations for use in applications such as memory, wireless devices... These new options, in turn, are pushing demand for a reduction in chip thickness from the traditional 500μ thickness to about 40 μm. Thin dies are driving the need for thin and even ultra-thin semiconductor wafers (below 50μm).
Such dramatic changes will have strong impact on the equipment and materials side as well as new process and bonding technologies will be required for handling such fragile wafers. Yole has covered the equipment and processing aspects in the previous “Thin Wafer Manufacturing” report.
KEY FEATURES OF THE REPORT
The objectives of the report are the following:
- Provide an understanding of the thin wafer applications:
- Overview of the thin wafer applications: MEMS, CMOS Image Sensors, Memories, Power Devices, RF Devices, LEDs, Interposers
- Thin wafers roadmaps
- Give market forecasts for thin wafers:
- 2011-2016 Market Forecast in units and US$ for thin wafers
- Detailed forecasts by application, wafer size and thickness
- Analyze the trends for wafer thinning
- Thinning technologies overview
- Players
WHO SHOULD BUY THIS REPORT?
- Foundries & chip manufacturers
- Get an overview of the large panel of accessible applications for thin wafers
- Identify the key trends into wafer thickness reduction
- Monitor and benchmark your competitor’s advancements
- Thinning tools/services & materials (chemistry, wafers) providers
- Identify and evaluate what the requirements for thinning wafers will be
- Analyze the threads and opportunities
- Evaluate the market value and volume
COMPANIES CITED IN THE REPORT:
3M, Accretech, ADI, AIT, AkM, ALLVIA, ALSI, AMAT, Aptina / Micron, Avago, Brewer, Canon, Corning, Cree, Dalsa, Denka, Denso, Discera, Disco, Dongbu HiTek, DoubleCheck Semiconductors, Dynatex, Dupont, Dynatex, Elmos (SMI), Elpida, Epistar, ERS, ESI, EVG, FhG IZM, Fico, Formosa Epitaxy, Freescale, Genesis, Furukawa, Hamamatsu, HH NEC / Grace, Hitachi Chemical, Huga, Hynix, IBM, IMT, Infineon, Intel, Invensense, JCAP, kionix, Laserod, Lextar, Lighthouse (AU Opto), LG Innotek, Lintec, Loadpoint, Lumileds, Micralyne, Micron, Mitsui Chemical, Nanya, Nichia, Nitta, Nitto Denko, Osram, Okamoto, Panasonic, PlanOptik, Powerchip, ProMOS, Renesas, Ricmar, Robert Bosch, Rorze, Samsung, Schott, Scrypt, Sekusui, Seoul Optodevice, Shinko, Silex, SMIC, Sony, Spansion, STM, Strasbaugh, Sumitomo Chemical, SUSS MicroTec, Synova, Sysmelec, Takada, Tekcore, TEL, Texas Instruments, Tezzaron, TMAT, tMt, TOk, Toshiba, Tower, Toyoda Gosei, Tronic’s, TSMC, Veeco, VTI, X-Fab, Xiamen Sanan Optoelectronics, Yushin.
KEY FEATURES OF THE REPORT
The objectives of the report are the following:
- Provide an understanding of the thin wafer applications:
- Overview of the thin wafer applications: MEMS, CMOS Image Sensors, Memories, Power Devices, RF Devices, LEDs, Interposers
- Thin wafers roadmaps
- Give market forecasts for thin wafers:
- 2011-2016 Market Forecast in units and US$ for thin wafers
- Detailed forecasts by application, wafer size and thickness
- Analyze the trends for wafer thinning
- Thinning technologies overview
- Players
WHO SHOULD BUY THIS REPORT?
- Foundries & chip manufacturers
- Get an overview of the large panel of accessible applications for thin wafers
- Identify the key trends into wafer thickness reduction
- Monitor and benchmark your competitor’s advancements
- Thinning tools/services & materials (chemistry, wafers) providers
- Identify and evaluate what the requirements for thinning wafers will be
- Analyze the threads and opportunities
- Evaluate the market value and volume
- Objective of the report 2
- Table of contents 4
- List of companies mentioned in the report 5
- Executive summary 6
- 2010-2016 Thin wafer market forecasts 24
- Thinned wafers vs. TOT number of shipped wafers
- Thin wafers shipment in 300 mm eq.
- 2010-2016 thin wafer shipment forecast by application
- 2010-2016 thin wafer shipment forecast by wafer diameter
- 2010-2016 thin wafer shipment forecast by wafer thickness
- Thin wafer players 37
- 2010 main thin wafers
- 2010 geographic breakdown for thin wafer processing in % of number of processed wafers
- 2010 wafer size breakdown for thin wafer processing in % of number of processed wafers
- Thin wafer processors
- Description oF applications 81
- MEMS
- CMOS Image Sensors
- Memory & Logic
- Power Devices
- RF Devices (GaAs)
- LEDs
- Advanced Packaging:3D TSV/Interposers
- Thin wafer Technologies overview 160
- Wafer Thinning
- Dry Polishing
- Thin Wafer Handling: the different solutions
- Wafer Dicing
- Final conclusions 214
- Appendices 216
- Yole Développement presentation
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