VTI CMR3000 3-Axis MEMS Gyroscope

Yole Développement is proud to publish the reverse costing report of the new 3-axis consumer MEMS gyroscope supplied by VTI Technologies.

Featuring a 4.1x3.1x0.83mm size, the CMR3000 is the smallest 3-axis consumer gyroscope. Manufactured with VTI 3D-MEMS technology, this tuning fork capacitive gyroscope is bulk micromachined in a c-SOI wafer (SOI with buried cavities) and wafer-level packaged.

The ASIC chip is flip-chipped under the MEMS sensor (VTI Chip-on-MEMS technology) allowing a very small package height. The CMR3000 is targeted for battery operated devices like mobile phones, gaming devices, computer peripheral and remote controllers.

This report provides complete teardown of the MEMS gyroscope with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

• Glossary
• Overview/Introduction
  • Executive Summary
  • Reverse Costing Methodology
• VTI Company Profile
  • Product Range
  • Business Model
• Physical analysis
  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package X-Ray
  • Package Cross-Section
  • ASIC Dimensions
  • ASIC Markings
  • ASIC Main blocks
  • ASIC Cross-Section
  • ASIC Process Characteristics
  • MEMS Dimensions
  • MEMS Vias
  • MEMS Sensor
  • MEMS Sensor (buried cavities)
  • MEMS Cap
  • MEMS Cross-Sections
  • MEMS Process Characteristics
  • Physical Data Summary
• Manufacturing Process Flow
  • Overview
  • ASIC/MEMS/Packaging Process Flows
  • Description of the Wafer Fabrication Units
• Cost Analysis
  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Supply Chain Analysis
  • Manufacturers financial ratios
  • Yields Explanation
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 Cost (Probe Test and Dicing)
  • ASIC Die Cost (Front End + Back End 0)
  • MEMS Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End: Equipment Cost per Family
  • MEMS Front-End: Material Cost per Family
  • Back-End 0: Packaging, Probe Test and Dicing Cost
  • Back-End 0 Cost per Process Steps
  • Back-End 0: Die Cost (Front End + Back End 0)
  • Back-End 1: Final Test & Calibration Cost
  • CMR3000 Component Cost (FE + BE 0 + BE 1)
• Estimated Price Analysis
• Conclusion