Overview / Introduction p3
– Executive Summary
– The Course of the Analysis
Power Module Physical Analysis p7
– Simplified Block Diagram
– Sunny Boy Disassembly
– Ceramic Power Module
– Ceramic Board
– Sunny Boy 3000TL, 4000TL and 5000TL Family
– Transistors Physical Analysis
Transistor 1 & 2 Physical Analysis p15
– Die Dimensions and pads – Transistor 1
– Die Dimensions and pads – Transistor 2
– Guard Ring
– Trench IGBT
– Wafer
– Well Thickness
– Synthesis : IGBT Structure
Transistor 1 & 2 Process Flow p25
– Front Side
– Back Side
– Wafer Fabrication Unit
Transistor 1 & 2 Cost p29
– Wafer Cost Data
– Wafer Cost
– Probe Yield
– Component Manufacturing Cost
– Selling Price – Transistors 1 & 2
Boost Transistor p41
– Die Dimension and Pads- Boost Transistor
– Wafer Technology
– Component Manufacturing Cost
BOM Cost p44
– Assessing the BOM
– Estimation of the Cost of the Ceramic board
– Ceramic Power Board
– Material Cost Breakdown
Added Value Cost p47
– Assessing the Added Value (AV) cost
– Assessing the Added Value (AV) cost
– Ceramic Board manufacturing flow
– Ceramic Board Hourly rates and cadencies
– Details of the Ceramic board AV Cost
Estimation of the selling price p52
– Selling Price Hypothesis
– Estimation of the Selling Price
–
Conclusion p54