Physical Analysis of the Device

Step by Step Reconstruction of the Process Flow

 Cost of Manufacturing and Estimation of Selling Price

Yole Développement is proud to publish the reverse costing report of the SL-V-B40AK Cool White LED supplied by SemiLEDs packaged in the first Wafer Level Package for LED from VisEra. Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.

This report provides complete teardown of the LED with:

This report provides complete teardown of the LED with:

Glossary ………………………..…………….…….…...…3

1. Overview / Introduction……………………….…...…4

–        Executive Summary

–        Reverse Costing Methodology

2. Physical Analysis……………………….………...…...7

–         About the Physical Analysis

–         Physical Analysis Methodology

–         Package Characteristics

–         Package X-Ray

–         Package Opening

–         Package Cross-Section

–        Visera LED Wafer Package

–         LED Dimensions

–         LED Details

–         LED Edge

–         LED Cross-Section

–         LED Structure

–         LED Synthesis

–         SemiLEDs Patents

3. Manufacturing Process Flow…………….…………28

–         LED Die Process Flow

–         Description of the Wafer Fabrication Unit

4. Cost Analysis…………………………………………..…..35

–         Synthesis of the Cost Analysis

–         Yields Explanation

–         Hypothesis

–        LED Front-End Cost

–        Front-End : Epitaxy Hypotheses

–        Front-End : Epitaxy Cost

–        Front-End : Epitaxy Cost per Steps

–        Front-End : Other Front-End Cost

–        Front-End Cost per Equipment Family

–        Front-End Cost per Consumable Family

–        Dies per Wafer & Probe Test

–        Back-End 0 : Probe Cost

–        Back-End 0 : Dicing Cost

–        LED Wafer & Die Cost (FE + BE 0)

–        Back-End 1 : Packaging Hypothesis

–        Back-End 1 : Packaging Process Flow

–        Back-End 1 : Packaging Cost Details

–        Back-End 1 : Final Test Cost

–        Component Manufacturing Cost (FE+BE0+BE1)

–        Cost Analysis Evolution

5. Estimated Manufacturer Price Analysis ………………63

–        Price Price

–        Manufdefinitions

–        Manufacturers financial ratios     

–        Binning Impact on Manufacturing Price

–        Ideal manufacturer acturing Price with Binning Yield