1. Overview / Introduction…………………......……4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile. ……………………....…………6
– Wispry Profile
3. Physical Analysis……………………......……….10
– Package Characteristics
– Package Markings
– Package X-Ray
– Package Composition
– Package Opening & Bonding Number
– Package Cross-Section
– Die Dimensions
– MEMS Details
– MEMS Structure
– MEMS Cross-Section
4. Manufacturing Process Flow………………..…50
– Front-end Process Flow
– Package Process Flow
– Wafer Fabrication Units
5. Cost Analysis…………………………………..…65
– Supply Chain Analysis
– Wafer Cost Hypothesis
– Wafer Cost
– Die cost
– Packaging Process Flow
– Packaging Cost Details
– Final Test Cost
– Component Manufacturing Cost
– Yield Synthesis
6. Estimated Manufacturer Price Analysis ……80
– Manufacturers ratios
– Estimated manufacturer Price