Yole Développement is pleased to publish the Nikkei BP Consulting study entitled “Worldwide Memory Market Forecasts 2009-2013” in English version.

The report includes production forecast of Memories by application:

• PC (mother board, laptop, desktop PC…),
• Cellular (camera, color, iPhone…),
• Flat TV (LCD by country, by manufacturer…),
• Digital Still Camera (by manufacturer, by share…),
• Game (TV game console, portable game console…) .

Nikkei BP Consulting study also features production forecast, sales, price, wafer… of LSI by memory type:

• NAND Flash Memory
• Flash Memory
• MCP
• DRAM (256 Mo, 512 Mo, 1 Gb)
• LSI Fab　

The study present LSI Manufacturers information (products, sales, sales by applications, operating incomes, CAPEX, inventories…) for:

Intel, Texas Instruments, Freescale Semiconductor, Advanced Micro Devices (AMD), Micron Technology, STMicroelectronics, Infineon Technologies, Samsung Electronics, Hynix Semiconductor, Toshiba, Renesas Technology, NEC Electronics, Elpida Memory, Nanya Technology, Powerchip Semiconductor, ProMOS Technologies, TSMC, UMC, Chartered, SMIC

In the report you will also find  a chapter on Demand Simulation. This chapter estimates IC demand until 2013. Especially NAND Flash Memory and DRAM demand are estimated by setting preconditions, shipments of Electronic appliances and memory capacity of Electronic appliances. Simulation Model is performed for NAND Flash Memory, DRAM and IC Fab Capacity.

Chapter 1　Application of Memories　　······································         9

1. PC　　·······································································       10
2. Cellular　 ··································································       21
3. Flat TV　 ······································································       33
4. Digital Still Camera　 ····················································       38
5. Game　 ·······································································       44

Chapter 2　LSI Memories　　····················································      48

1. Flash Memory　　·······················································        49
2. DRAM　 ····································································       59
3. LSI Fab　 ··································································       70

Chapter 3　LSI Manufacturers　　··············································      84

1.Intel　　····································································      85

2.Texas Instruments　　·················································    89

3.Freescale Semiconductor　　·······································      92

4.Advanced Micro Devices(AMD)　　································      94

5.Micron Technology　　················································      97

6.STMicroelectronics　　················································     100

7.Infineon Technologies　　············································    102

8.Samsung Electronics　················································    105

9.Hynix Semiconductor　　············································     107

10.Toshiba　　······························································    110

11.Renesas Technology　···············································    113

12.NEC Electronics　　···················································    117

13.Elpida Memory　·······················································    121

14.Nanya Technology　　···············································    124

15.Powerchip Semiconductor　　····································     126

16.ProMOS Technologies　　···········································    127

17.TSMC　　·································································    129

18.UMC　　··································································     133

19.Chartered　　···························································     137

20.SMIC　　·································································     140

Chapter 4　Demand Simulation　　············································     144

　　　　1.Simulation Model　　··················································     145

　　　　2.NAND Flash Memory　 ···············································     157

　　　　3.DRAM　 ····································································    159

　　　　4.IC Fab Capacity　 ······················································     161