Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach $4.6B in 2020 at an impressive 16% CAGR.
Fan-in WLP is experiencing continuous growth and attracting new applications. Current capacities are full and additional volume is required. Technology innovation continues with increasing die sizes and reducing pitch.
With Apple and TSMC changing the game, 2016 is a turning point for the Fan-Out market. The number of enforceable patents is increasing worldwide, with several companies already standing out by virtue of their strong IP position.
The rapid-changing fingerprint technology market has expanded impressively into the consumer space – now shipment volumes will benefit from an 18% CAGR through to 2022, when the market will be worth $4.7B.