New player mCube, mainly active on the Chinese market,is getting traction with new technologies allowing very low manufacturing cost. mCube managed to design a smart integration and is the only provider of quasi monolithic accelerometers for consumer electronics.
mCube 3D MEMS process consists in MEMS elements fabricated on top of the drive IC and connected using through silicon vias (TSV). To protect the MEMS elements, a cap is sealed with an eutectic alloy bonding process.
The mCube accelerometer is assembled in a standard LGA 2x2mm package.
With this clever integration, mCube is positioned one step ahead of STMicroelectronics and Bosch Sensortec related to size and manufacturing cost.
This report will provides a complete teardown of the MEMS accelerometer with:
• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth manufacturing cost analysis
• Supply chain evaluation
• Selling price estimation
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