I-Micronews - Top read news


	UAlbany NanoCollege & Applied DNA Sciences partner on nanochip anti-counterfeiting program	(NANOMATERIALS)
	Magnachip to acquire Dawin Electronics, designer and manufacturer of power modules	(POWER ELECTRONICS)
	International SiC Power Electronics Applications Workshop - from May 29 to 30, 2012 – Stockholm, Sweden	(COMPOUND SEMI)
	Discussion about wide IO memory and high-performance DRAM stack design	(ADVANCED PACKAGING: 3D IC, WLP & TSV )
	Solar Frontier selected by enXco for 100+ MWp CIGS power plant	(PHOTOVOLTAICS)
	Easier Testing for Diabetics? Biochip Measures Glucose in Saliva, Not Blood	(MEDTECH)
	Palm Springs networking event announced for power electronics	(POWER ELECTRONICS)
	Schott announces thinner glass wafer for MEMS industry	(MEMS)
	PV market continues to grow in Europe and around the world	(PHOTOVOLTAICS)
	Ground-breaking MEMS Technology Event Returns for Second Edition	(MEMS)
	Carbon nanotubes films flexibility impact Electronic properties	(NANOMATERIALS)
	Teledyne and Zephyr develop optical interconnects	(OPTOELECTRONICS)
	Silex to develop advanced packaging toolbox for future RF applications	(ADVANCED PACKAGING: 3D IC, WLP & TSV )
	Philips develops solar powered LED street lighting breakthrough	(LED)
	New means for creating elastic conductors	(NANOMATERIALS)
	Bombardier selects Maxwell technologies' ultracapacitors for innovative rail transit braking energy recuperation system	(POWER ELECTRONICS)
	Powerex released full SiC modules featuring multiple circuit topologies	(POWER ELECTRONICS)
	TSMC plans 3-D IC assembly launch early in 2013	(ADVANCED PACKAGING: 3D IC, WLP & TSV )
	Teledyne and Zephyr develop optical interconnects	(OPTOELECTRONICS)
	Soitec and Sumitomo Electric announce major milestone in strategic joint development of engineered gallium nitride substrates	(COMPOUND SEMI)