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  • 2.5 and 3DIC for those who can no longer afford scaling... and not only (ADVANCED PACKAGING)
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  • A Contraceptive implant with remote control (MEDTECH)
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  • InvenSense to acquire Movea. (MEMS)
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  • Orbotech to acquire SPTS technologies to extend leadership in advanced micro manufacturing (ADVANCED PACKAGING)
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  • The bright future of Si photonics (MEMS)
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  • PerkinElmer launches LabChip® GX Touch and GXII TouchTM automated Gel Electrophoresis Systems (MEDTECH)
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  • 8-inch IGBT wafer and module production opens in China (POWER ELECTRONICS)
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  • SPTS Technologies’ Sigma fxP PVD System selected by HuaTian Technologies for 300mm flip chip bumping and CMOS image sensor applications (ADVANCED PACKAGING)
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  • SPTS Technologies and CEA-Leti and Nanoelec RTI collaborate on 3D-TSV Technology (ADVANCED PACKAGING)
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  • 2.5/3DIC laser assisted debonding: a closer look (ADVANCED PACKAGING)
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  • TSV is a business looking for wider adoption! (ADVANCED PACKAGING)
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  • Researchers invent nanotech microchip to diagnose type-1 diabetes (MEDTECH)
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  • memsstar launches next-generation MEMS etch and deposition equipment (MEMS)
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  • Novartis to license Google "smart lens" technology (MEDTECH)
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  • Orbotech to acquire SPTS technologies to extend leadership in advanced micro manufacturing (MEMS)
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  • AUO reports decline in June revenues (OPTO & PHOTONICS)
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  • Omron – highly-accurate MEMS pressure sensors can detect height differences of just 50cm (MEMS)
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  • TSVs and cantilever etching facilitated at the CiS, Erfurt, using Oxford Instruments plasma system (MEMS)
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  • Ushio exhibits lithography tools for next-generation packaging, including 300-mm interposer stepper ux7-3di lis 350, at semicon west 2014 (ADVANCED PACKAGING)
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  • Dolomite’s new microfluidic system showcases droplet merging at nanoliter sample scale (MEDTECH)
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