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  March 14th - 07:53 pm
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  •  
    		•  Colibrys new MEMS accelerometer for Attitude Heading and Reference Systems (AHRS) (MEMS)
  •  
    		•  OSRAM bits direct green laser diodes world record output CW power and efficiency (COMPOUND SEMI)
  •  
    		•  SPTS sees 150% high jump in Q4-2009 orders, driven by MEMS & TSV Packaging applications (ADVANCED PACKAGING: 3D IC, WLP & TSV )
  •  
    		•  Light turned into electrical current (PHOTONICS)
  •  
    		•  Centrotherm Photovoltaics publishes preliminary figures and meets 2009 guidance (PHOTOVOLTAIC)
  •  
    		•  Nanophotonic avalanche photodetector uses light for communication between computer chips (PHOTONICS)
  •  
    		•  New graphene 'nanomesh' could change the future of electronics (NANOMATERIALS)
  •  
    		•  New device for ultrafast optical communications (PHOTONICS)
  •  
    		•  Cilas unveils optical coatings machine (PHOTONICS)
  •  
    		•  Liquid lens eliminates the shakes (PHOTONICS)
  •  
    		•  Microwells for detecting smells (MICROFLUIDICS)
  •  
    		•  Silicon Labs introduces single-chip wireless solution for battery-powered systems with RF connectivity (POWER ELECTRONICS)
  •  
    		•  GlobalFoundries & Qualcomm to collaborate on 28nm & 3D Packaging with TSV technologies (ADVANCED PACKAGING: 3D IC, WLP & TSV )
  •  
    		•  Nanophotonics: Bright attractions (PHOTONICS)
  •  
    		•  First Commercial Application of Baytubes® Carbon Nanotubes in Japan (NANOMATERIALS)
  •  
    		•  Luminus Devices raises $19 million (COMPOUND SEMI)
  •  
    		•  Light sculpts three-dimensional crystals in nonlinear optical materials (PHOTONICS)
  •  
    		•  Imec and Synopsys collaborate on 3D stacked IC development (ADVANCED PACKAGING: 3D IC, WLP & TSV )
  •  
    		•  Mitsumi Prototypes MEMS Mirror With 10mW Power Consumption (MEMS)
  •  
    		•  Marriage of Microfluidics and Optics could advance lab-on-a-chip devices (MICROFLUIDICS)
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