Many applications, different drivers, several available bumping technologies, varying die and package sizes and many different sourcing strategies make Flip Chip one of the most diversified and interesting platform to look at. Despite its highly respectable age, Flip Chip platform is still in mutation and provides continuously innovative fine pitch bumping solution to serve the most advanced packaging technologies like 3DIC and 2.5D Interposer.

Speaker:

Lionel Cadix joined Yole Developpement after the completion of several projects linked to the characterization and modeling of high density TSV and 3DIC chip stacking in collaboration with CEALeti and STMicroelectronics during his PhD. He is author of several publications and 8 patents in the field of 3D Integration.

Moderator:

Mike McLaughlin has been working with emerging technologies for over 12 years at IBM and Cisco and was a principal analyst at Gartner. He now leads all of Yole Développement's activities and business development for North America. Mike is a graduate of Stanford University in Palo Alto, CA