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An article written by Junko Yoshida for EETIMES - TDK Corp. has enviable brand recognition. The problem is, it’s known for the wrong products. The TDK brand is tightly associated with magnetic tapes (audio and videocassette) and magnetic hard disk drive (HDD) heads. The company was founded in 1935 to market the world’s first manufactured magnetic material, ferrite. Given its heritage, TDK has ample reason to be proud of its magnetic personality.

Lextar Electronics, the vertically integrated LED company is to announce its I-Mini Square module for automotive tail lamp application. The company applied its newest mini LED technology on automotive tail lamps which can display dynamic image smoothly. No longer after Lextar announced its Mini LED display technology in August, it has again made an innovative breakthrough in Mini LED applications. This concept application will make its debut at the biannual Electronica 2018 held in Munich from 13 to 16 Nov.

SPL DS90A_3 is Osram’s latest addition to its portfolio for LiDAR applications - LiDAR systems are an integral part of driving assistance systems, such as lane assist and emergency braking systems in autonomous or semi-autonomous vehicles. The propagation time of very short light pulses is used to determine the distance between the vehicle and objects in its vicinity.

The announcement on 9^th November 2018 that II-VI is buying Finisar is astonishing the industry. But, looking at recent trends, this move can also be seen as a logical evolution of the laser diode and datacom/telecom supply industries. Yole Développement (Yole) has covered these domains very closely in recent months, publishing several reports that are the background to this mega-merger, specifically our VCSELs - Technology, Industry and Market Trends and 3D Imaging & Sensing reports.

Infineon Technologies AG acquires Siltectra, a start-up based in Dresden. The start-up has developed an innovative technology (Cold Split) to process crystal material efficiently and with minimal loss of material. Infineon will use the Cold Split technology to split silicon carbide (SiC) wafers, thus doubling the number of chips out of one wafer. A purchase price of 124 million Euros was agreed on with the venture capital investor MIG Fonds, the main shareholder.

One of the world’s largest outsourced assembly and test providers names AP300E™ their preferred lithography system due to Veeco’s industry-leading uptime and process performance - Veeco Instruments announced that one of the world’s largest outsourced assembly and test (OSAT) providers has purchased multiple Veeco AP300E lithography systems.