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New SFH 4718A cuts the size and cost of illumination units for CCTV systems - Osram Opto Semiconductors is expanding its proven Oslon Black portfolio for infrared illumination with the addition of an infrared LED with a narrower beam angle of ± 25°. Thanks to the new SFH 4718A IRED, illumination units for camera systems with a medium capture range no longer require secondary optics. The Oslon Black family now offers a wide selection for the most varied of infrared-based applications, taking in four power classes, three wavelengths and three beam angles.

Micron and Intel announced an update to their 3D XPoint™ joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory.

An article written by Mike Rosa, Applied Materials for Nanochip newsletter - Did you think chip making on 150mm wafers was a thing of the past? Think again. Many of the megatrends shaping our collective futures—mobility, autonomous driving and electric vehicles, 5G wireless communications, augmented- and virtual reality (AR/VR), and healthcare—depend on innovations created on the 150mm wafer size.

Article written by Adele Hars for Nanochip, powered by Applied Materials - The semiconductor industry has new drivers in automotive, Internet of Things (IoT), both high- and low power, sensors, and medical and industrial applications—which happen to be traditional European core strengths. The new CEO of French RTO Leti and other industry leaders and analysts see this as a golden opportunity.

An article written by Amandine Pizzagalli and Emilie Jolivet, Yole Développement for SEMI Newsletter - Driven by the adoption of evermore electronic components in end products, the semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path followed for the past few decades. Advanced nodes no longer bring the desired cost benefit, and R&D investments in new lithography solutions and devices below 10nm nodes are rising substantially. In order to satisfy market demands, the industry is looking for technology solutions to bridge the gap and improve cost/performance while at the same time adding more functionality through integration.

Telecom revolution taking place at the early 21st century has led to impressive innovations, especially at the devices level. “We are today at the first step of 5G implementation,” asserts Paul Leclaire, Patent & Technology Analyst at Knowmade.“5G comes with strong technology challenges that reshuffle the cards and change the competitive landscape.” The RF FE modules market will be so highly impacted by new 5G standard. According to Yole Développement (Yole), it is expected to reach US$35.2 billion in 2023.