The advanced electronic packaging industry has seen major changes in recent years. Fan-out wafer level packaging (FO WLP) has grown, and TSMC has penetrated the high-end market. Through-silicon via (TSV) integration has been adopted into volume production in high-bandwidth memory (HBM), which is key for artificial intelligence (AI) and high-end applications in general. The next expected evolution is to move FO packaging from wafer size to panel format, to benefit from packaging more die in parallel. What’s the status of panel-level packaging (PLP)? How many devices packaged in this way will be produced in the next three years? Which companies are winning this race? Yole Développement’s new “Status of Panel Level Packaging 2018” report provides the answers. Here are the highlights of our latest analysis.

Mersen announces a strategic investment in Silicon Carbide (SiC) semiconductor technology. Mersen, a global expert in electrical power and advanced materials, announces an agreement to acquire 49% of CALY Technologies, a Lyon-based start-up company developing Silicon Carbide (SiC) semiconductor devices along with a proven experience on protection functions.

Batteries are everywhere, from electric vehicles to stationary energy storage to make renewable energy more versatile, whether for houses with PV systems to utility-scale systems to manage the energy of a small city. The industry’s compound annual growth rate (CAGR) will be more than 27% for the next 5 years, which is both linked to regulation changes, new market needs and also availability of key technologies. The new report from Yole Développement Li-ion Battery Packs for Automotive and Stationary Storage Applications provides all the details on the expected growth of the battery pack industry.