Headlines
EV GROUP partners with NSI to enable first wafer-level heterogeneous integration of gaas on silicon for rf front-end module manufacturing
NSI’s proprietary micro wafer-level system integration (uWLSI®) technology, combined with EVG’s wafer bonding and lithography systems, enables…
NanoString technologies announces pricing of public offering of 4,500,000 shares of common stock
Oxford Nanopore launches Flongle, for rapid, smaller DNA/RNA sequencing tests in any environment
