“Microfluidic technologies have been around for a while, but only in the last few years have certain applications started benefiting from microfluidic breakthroughs”, comments Technology & Market Analyst, Sébastien Clerc from Yole Développement (Yole), part of Yole Group of Companies (1). Indeed, microfluidic technologies have finally found sweet spots and there are already credible options for the next upsurge, announces Yole, in its latest report, Status of the Microfluidics Industry.

Through-silicon via (TSV) technology has been forecasted to impact the memory and logic industry for years. Die partitioning was developed to optimize technology nodes and improve device yields for high performance technology. Super high memory density to satisfy the need for high bandwidth data transfer between memory and logic devices was also a key driver. TSVs’ role became noticeable a few years ago with the launch of the hybrid memory cube (HMC) interface and high bandwidth memory (HBM), however they only entered small volume production.

The power packaging materials is today the main part of the power module cost. Therefore, in 2016 almost 40% of the total cost is due to the cost of materials for packaging. “To understand the evolution of the power packaging market, it is now essential to look in details the selected materials and design and evaluate each innovation”, comments Mattin Grao Txapartegi, Technology & Market Analyst, Power Electronics at Yole Développement (Yole), part of Yole Group of Companies (1) .