Marketing, technology and strategy reports, industrial research reports

Nokia, Intel and NTT Docomo have kicked off a new bout of trials to test out the 4.5 GHz band, one of the 5G candidates in Japan.

Focusing on Nokia’s 5G FIRST offering, the trio will test end-to-end applications over-the-air between Nokia’s AirScale base station and Intel’s 5G Mobile Trial Platform, a proposition which has been grabbing a few headlines in recent weeks.

Infra-red (IR) light-emitting diodes (LEDs) and laser diodes (LDs) have been around for years, with applications in remote controls, proximity sensors and smoke detectors. It has been a slow-moving market, reaching $450M in 2016 – but this is now changing dramatically. The IR LED/LD market will triple in value over the next five years to reach $1.5B in 2022. That’s because of five applications that are now emerging, boosting the demand for IR illumination. The applications are: 3D cameras, where they can help provide depth of focus, autofocus, surveillance cameras, machine vision and horticultural lighting. Together these five areas will represent a market worth more than $1B in 2022, increasing from less than $400M expected in 2017. For more detail, please look at the new report released by Yole Développement: IR LEDS and Lasers - Technology, Applications and Industry Trends.

TDK and InvenSense announce that TDK has completed the all-cash acquisition of InvenSense.The acquisition price was $13.00 USD per InvenSense share, and the total acquisition price was approximately $1.3 billion USD.TDK currently focuses on three market segments: automotive, industrial equipment & energy, and information & communications technology (ICT).

What is expected from inspection and metrology equipment, and how will it evolve in the future?
Advanced packaging has grown into a complex ecosystem with a variety of business models and a series of players involved, from initial wafer processing steps to final package delivery and subsequent board assembly. The spotlight has turned to advanced packaging as one of the solutions to bring further value to the semiconductor product in terms of cost reduction and functionality increase. The future will bring not only more advanced packages, but a diverse range of multi die systems-in-package (SiP), systems-in-board and modules, as shown in the recent report “Status of the Advanced Packaging Industry”.

“Microfluidic technologies have been around for a while, but only in the last few years have certain applications started benefiting from microfluidic breakthroughs”, comments Technology & Market Analyst, Sébastien Clerc from Yole Développement (Yole), part of Yole Group of Companies (1). Indeed, microfluidic technologies have finally found sweet spots and there are already credible options for the next upsurge, announces Yole, in its latest report, Status of the Microfluidics Industry.

Through-silicon via (TSV) technology has been forecasted to impact the memory and logic industry for years. Die partitioning was developed to optimize technology nodes and improve device yields for high performance technology. Super high memory density to satisfy the need for high bandwidth data transfer between memory and logic devices was also a key driver. TSVs’ role became noticeable a few years ago with the launch of the hybrid memory cube (HMC) interface and high bandwidth memory (HBM), however they only entered small volume production.