Marketing, technology and strategy reports, industrial research reports

Pierre Cambou, imaging activity leader at Yole Développement, analyses the merger and acquisition landscape for machine vision - In the last three years from 2014 to 2017, we have witnessed an acceleration of merger and acquisition activity relative to machine vision, either at image sensor or camera level. Among the latest examples of this trend are the acquisitions of Point Grey by Flir for $215 million in 2016, and of e2v by Teledyne for $790 million in 2017.

The 5th generation of cellular networks is anticipated to arrive in the timeframe of the next 2-5 years, enabling Gbps datarates and a plethora of new applications and services. One of the key drivers for developing such speed is high resolution video demand (4K, 8K etc.) over mobile devices.

A wide variety of laser technologies is today available to semiconductor manufacturers and enable the development of innovative semiconductor manufacturing processes. According to Yole Développement (Yole), the laser equipment market will grow at a 15% CAGR between 2016 and 2022 and should reach more than US$4 billion by 2022 (excluding marking). Those figures are showing the massive adoption of laser technologies for semiconductor manufacturing processes.

Commercial power GaN devices have now been around now for seven years, with the first device introduced to the market by EPC in 2010. Yole Développement estimates that the market will be around $20M in 2017, with even greater opportunities and growth potential. The total GaN power device market will be worth more than $450M in 2022, according to Yole’s report ‘Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends’.

The emerging 5G wireless communication standard will bring wholesale change, from services to device technologies shaping new wireless infrastructure, and in the associated supply chain. Yole Développement (Yole) now highlights the technology and market trends 5G is driving in one new report: “5G’s impact on the RF front-end industry: How will wireless infrastructure and cell phone terminals change in the next decade?”. Yole also explores how the system-in-package (SiP) platform will enable such changes in an accompanying report, “Advanced RF System-in-Package for Cell Phones”.

An article writen by Paula Doe for SEMI | MSIG and the MEMS & Sensors Executive Congress, 2017 edition - New sensor technologies, and smarter ways of integrating more intelligence, continue to generate unexpected opportunities in the changing MEMS business.