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Advanced Packaging & System Integration Technology Symposium - April 22&23 – Shanghai, China | Source: Status of the Advanced Packaging Industry report, Yole Développement, 2018 - The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the key words. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are step by step changing our world. Big data, AI , 5G, HPC , IoT , smart automotive, industry 4.0, datacenters and more…, all mega-trends becoming part of our day to day life, with a direct impact on the semiconductor industry and its supply chain. But not only…

The RF GaN industry is showing an impressive growth with a 23% CAGR between 2017 and 2023, driven by telecom and defense applications. By the end of 2017, the total RF GaN market was close to US$380 million and 2023 should reach more than US$1.3 billion with an evolving industrial landscape (1). Telecom and defense are looking for innovative technologies and RF GaN-based devices are directly answering to the market demand.

An article written by Mark LaPedus for SEMICONDUCTOR ENGINEERING - Advanced packaging moves into high-volume mobile markets, but requires more sophisticated equipment and lower-cost processes. Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools.

As reported in “Fan-Out Packaging: Technologies and Market Trends 2019” and "Status of Panel Level Packaging 2018" from Yole Développement (Yole), key players from all kinds of business models have adopted Fan-Out packaging. The core FO (Fan-Out) market confirmed its stability, with significant new entrants joining via FOPLP. Although existing FOWLP players have a long history of established qualifications, mid-end devices may be too costly for FOWLP players.

An article written by Hong Lin, PhD. Senior Technology & Market Analyst at Yole Développement (Yole) - Following the acquisition of Siltectra by Infineon Technologies in November 2018, STMicroelectronics has made two news-worthy announcements: in January 2019, a long term wafer and epiwafer supply agreement with Cree valued at US$250 million. In February 2019, the acquisition of Norstel, a manufacturer of conductive and semi-insulating SiC wafers and SiC single-crystal 4H epitaxial layers.

Non-invasive sensors for medical devices are becoming a must-have in the healthcare market. These solutions are promising patient comfort, ease of use, painless monitoring and are typically well-adapted to the fast-growing wearables market. The healthcare sector is rapidly adopting wearables to monitor patients, and patients are more willing to use technology that helps them and imposes no constraints. Yole Développement recently described how non-invasive solutions are advancing in its report “BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences & Healthcare 2018”.