Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Headlines

Header LaserForum YoleCIOE 1000x252

 

HOMEButtonViolet LASER2017

CallforpaperButtonViolet LASER2017

SPONSORSHIPOPPButtonPink LASER2017

This email address is being protected from spambots. You need JavaScript enabled to view it.

REGISTERButtonPink LASER2017

 

Why should you sponsor the 1st Executive Forum on Laser Technologies?

Sponsoring the Executive Forum on Laser Technologies is a prime opportunity to put your company in front of more than 80 of the key industry players and decision makers of the industry. The forum is the unique single-meeting event in China exclusively dedicated to laser, where you will be able to meet and talk with key players.

  • Increase your organization's visibility before, during and after the forum
  • Enhance relationships with existing customers and generate new leads
  • Promotion to thousands of email subscribers
  • Meet customers and partners from different countries
  • Senior management networking opportunities
  • Get free pass (depending on the selected package)

 

Different levels of opportunities to suit your needs

 

PLATINUM SPONSORSHIP - LUNCH

 

Forum

  • A 5-minute presentation before lunch
  • 1 free full pass registration
  • 2 full pass registrations at CNY 2000 (30% discount)
  • Proceedings of all shared presentations

Visibility and brand exposure

  • 18m² standard booth at CIOE - Laser Technology and Intelligent Manufacturing Expo
  • Onsite interview of the company leaders by CCTV
  • One 1/2 page advert in the onsite newspaper "China Optoelectronics Express" distributed to all exhibitors on the 1st day of CIOE (by August 5th)
  • Logo on all the communication tools (web and print)
  • Logo on lunch tickets
  • Company name board placed on each lunch table
  • 2 posters to be displayed in the lunch room
  • Logo and description of your organisation on the Sponsors webpage
  • Opportunity to provide one quote for pre-event press release
  • Corporate leaflets or giveaways inserted in the attendees' bag
  • Opportunity to distribute brochures at the Sponsors Corner

10000ButtonViolet LASER2017

 

GOLD SPONSORSHIP - COFFEE BREAKS

 

Forum

  • A 3-minute presentation before the first break
  • 1 free full pass registration
  • 1 full pass registration at CNY 2000 (30% discount)
  • Proceedings of all shared presentations

Visibility and brand exposure

  • 9m² standard booth at CIOE - Laser Technology and Intelligent Manufacturing Expo
  • One 1/2 page advert in the onsite newspaper "China Optoelectronics Express" distributed to all exhibitors on the 1st day of CIOE (by August 5th)
  • Logo on all the communication tools (web and print)
  • Company name board placed on each coffee break table
  • 2 posters to be displayed in the coffee break room
  • Logo and description of your organisation on the Sponsors webpage
  • Corporate leaflets or giveaways inserted in the attendees' bag
  • Opportunity to distribute brochures at the Sponsors Corner

8500ButtonViolet LASER2017

 

GOLD SPONSORSHIP - COCKTAIL

 

Forum

  • A 3-minute presentation before the cocktail
  • 1 free full pass registration
  • 1 full pass registration at CNY 2000 (30% discount)
  • Proceedings of all shared presentations

Visibility and brand exposure

  • 9m² standard booth at CIOE - Laser Technology and Intelligent Manufacturing Expo
  • One 1/2 page advert in the onsite newspaper "China Optoelectronics Express" distributed to all exhibitors on the 1st day of CIOE (by August 5th)
  • Logo on all the communication tools (web and print)
  • 2 posters to be displayed in the cocktail room
  • Logo and description of your organisation on the Sponsors webpage
  • Corporate leaflets or giveaways inserted in the attendees' bag
  • Opportunity to distribute brochures at the Sponsors Corner

8500ButtonViolet LASER2017

 

ATTENDEES BAG SPONSORSHIP

 

Forum

  • 1 free full pass registration
  • Proceedings of all shared presentations

Visibility and brand exposure

  • Your attendees bag to be distributed to each delegate(bags provided by the sponsor)
  • Logo and description of your organisation on the Sponsors webpage
  • Opportunity to distribute brochures at the Sponsors Corner

2000ButtonViolet LASER2017

 

BADGE SPONSORSHIP

 

Forum

  • 1 free full pass registration
  • Proceedings of all shared presentations

Visibility and brand exposure

  • Logo on the attendee badge
  • Logo and description of your organisation on the Sponsors webpage
  • Opportunity to distribute brochures at the Sponsors Corner

2000ButtonViolet LASER2017

 

GIVEAWAYS & BROCHURES SPONSORSHIP

 

Forum

  • 1 free full pass registration
  • Proceedings of all shared presentations

Visibility and brand exposure

  • Giveaways or brochures inserted in the attendees bag (items provided by the sponsor)
  • Logo and description of your organisation on the Sponsors webpage
  • Opportunity to distribute brochures at the Sponsors Corner

1500ButtonViolet LASER2017


Please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question or application. PDF form is available here.

 

 Organized by Hosted by  Partnered by:
  logo yole moyen CIOE Logo  epic



Slider YoleNCAP2017 2000x525a

 

HOMEButton NCAP2017

PROGRAMButton NCAP2017

SPONSORSHIPButton NCAP2017

SPONSORButton NCAP2017

This email address is being protected from spambots. You need JavaScript enabled to view it.

REGISTERNowButton NCAP2017

 

For the 3rd time, Yole Développement & NCAP partner to organize the Advanced Packaging Symposium focused on Advanced Packaging & System Integration Technology. This symposium is an unparalleled gathering of the leading executives from around the world discussing the timeliest issues, challenges and opportunities. The unique single-meeting event will take place in one of the most dynamic place in the field of advanced packaging: Wuxi, China, from April 20 to 21, 2017. Discover below the preliminary agenda.


Thursday 20th of April – Market, Industry and Platforms

8:40 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:10 PM: Session #1 - Fan Out Packaging: from Integration to IP
9:00 – 9:45 – KEYNOTE
Herb Huang, SMIC

9:45 – 10:10 – Fan Out Packaging Market Trends
Jérôme Azemar, Market & Technology Analyst, Yole Développement

10:10 – 10:35 – Advanced WLP Technology as Mobile, Wearable and IoT Packaging Solution
Lewis Kang, Global Marketing Unit., Director, nepes Corporation


10:35 AM – 11:20 AM: Coffee Break and Networking


11:20 – 11:45 – Development of Advanced Wafer-Level Packaging Technology Achieving Miniaturization, High Performance and Low Cost
Daquan Yu, CTO, VP, Huatian Technology Electronic

11:45 – 12:10 – Fan-Out Intellectual Patent Landscape
Jérôme Azemar, Market & Technology Analyst, Yole Développement


12:10 PM – 1:45 PM: Lunch and Networking


1:45 PM – 3:25 PM: Session #2 - 3D Integration & Processes for Advanced Packaging

1:45 – 2:10 – Application Driven Heterogeneous Fan-Out / 2.5D & 3D Integration
Farhang Yazdani, President & CEO, BroadPak Corporation

2:10 – 2:35 – Reducing TSV Integration Cost Using F.A.S.T.® Deposition Solution
Julien Vitiello, CEO, Kobus

2:35 – 3:00 – Sensors 3D integration: Technology & Cost Review
Stéphane Elisabeth, Advanced Packaging, MEMS & RF Costing Engineer, System Plus Consulting

3:00 – 3:25 – Wafer Level Packaging of MEMS Sensors
Dr Wenqi Zhang, Technical Director, NCAP



3:25 PM – 4:10 PM: Coffee Break and Networking


4:10 PM – 5:25 PM: Session #3 - Equipment for Advanced Packaging Platforms

4:10 – 4:35 – Versatile Platform for Advanced Die Attach
Dr. Hugo Pristauz, VP Technical Development Advanced Technology DA, Besi Austria

4:35 – 5:00 – System In Package Applications
Chan Pin Chong, Senior VP, Kulicke & Soffa

5:00 – 5:25 – Advanced Packaging Process Control for High Volume Manufacturing
Dario Alliata, Product Manager, UnitySC


5:30 PM – 6:30 PM: Panel Session

Topic: Is the supply chain ready to support the latest advancements in Fan Out packaging?

6:30 PM – 6:45 PM: Thank You and Adjourn

6:45 PM – 8:00 PM: Networking Cocktail


Friday 21st of April – Materials, Processes and Applications

8:45 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:35 PM: Session #4 - Advanced Materials & Processes

9:00 – 9:45 – KEYNOTE: The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates
Tony D. Flaim, Chief Technical Officer, Brewer Science

9:45 – 10:10 – Temporary Bonding for FOWLP and Advanced Packaging
Dr. Thomas Uhrmann, Business Development Director, EV Group

10:10 – 10:35 – Innovative Laser Debonding Solution for Advanced Package
Howard Huang, Director, Kingyoup Optronics

10:35 – 11:00 – High Density, Ultra-Thin & Small Packaging
Tetsukazu Sugiya, Group Leader, Technology Solutions Group, DISCO Corp.

 

11:00 AM – 11:45 AM: Coffee Break and Networking

 

11:45 – 12:10 – Plasma Dicing – The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die
Richard Barnett, Etch Product Manager, SPTS / Orbotech

12:10 – 12:35 – Adopting Plasma Dicing for Advanced Packaging
Dr. David Lishan, Principal Scientist, Plasma-Therm

 

12:35 PM – 2:00 PM: Lunch and Networking


2:00 PM – 4:15 PM: Session #5 - Applicative Packaging & Materials

2:00 – 2:25 – Developments and Innovations in IC Packaging Technologies
Yifan Guo, VP, ASE China

2:25 – 2:50 – The trends of Packaging Technologies for High Power Density Power Module 
Kenji Kawada, Staff Engineer, Infineon Technologies Japan

2:50 – 3:15 – CYCLOTENETM BCB Dielectric Material for RF Packaging
Lianming Tong, Lead Marketing Manager, Dow Electronics Materials

3:15 – 3:40 – The Development of Alternative TFRs (Thick Resist Resists) Removing Formulations for Advanced Packaging Applications
Tianniu (Rick) Chen, Vice President of SP&C (Surface Preparation & Cleans), Versum Materials

3:40 – 4:05 – Application and Reliability Analysis of BWECA-200 Conductive Adhesive
Dr. GuoJun Hu, R&D Director, 38th Research Institute of China Electronics Technology Group

4:05 – 4:25 – Production-Ready Flux-free Bump Reflow System with Activated Hydrogen
Tim Bao, Director of Advanced Technology, Asia Pacific, Air Products


4:25 PM – 4:30 PM: Thank You and Adjourn

Download PDF files: AGENDA - SPEAKERS BIO - ABSTRACTS

REGISTER NOW!

 Organized by Hosted by 
  logo yole moyen NCAP China Logo 



Slider YoleNCAP2017 2000x525a

 

HOMEButton NCAP2017

SPONSORSHIPButtonBlue NCAP2017

SPONSORButton NCAP2017

CONTACTButton NCAP2017

This email address is being protected from spambots. You need JavaScript enabled to view it.

REGISTERNowButton NCAP2017

 

Photos2016 NCAP2017

 

Why should you sponsor the Promising future of sensors in IoT seminar?

Sponsoring the "Promising future of sensors in IoT seminar" is a prime opportunity to put your company in front of more than 80 of the key industry players and decision makers of the industry. Be partner of a focused and high-level MEMS seminar !

  • Increase your organization's visibility before, during and after the symposium
  • Enhance relationships with existing customers and generate new leads
  • Promotion to thousands of email subscribers
  • Senior management networking opportunities
  • Get free pass (depending on the selected package)

 

Different levels of opportunities to suit your needs

 

ALL LEVELS OF SPONSORSHIP INCLUDE

 

  • 1 free full pass registration
  • Logo and description of your organization on the Sponsors section of the event webpage (with a link to your website)
  • Acknowledgement during the seminar (openings, conference, ...)
  • Possibility to provide a corporate brochure or giveaways inserted in the attendees' jacket
  • Opportunity to set up a roll up or a poster, or to distribute brochures at the Sponsor Corner onsite

 

Platinumrate NCAP2017

 

PLATINIUM SPONSORSHIP

 Exclusive benefits for the platinum sponsor:

  • 1 break sponsorship, including 8-minute speaking opportunity (or a video)
  • 1 extra free full pass registration
  • Access to the presentations and complete attendees list after the seminar
  • Logo on all the communication tools (web and print)
  • Logo on the table during the break
  • Opportunity to provide one quote for pre-event press release
  • Promotion on Yole Développement and EMFT Linkedin and Twitter accounts

Luckydrawrate NCAP2017

 

 

GOLD SPONSORSHIP

 Exclusive benefits for the gold sponsor

  • 1 break sponsorship, including 5-minute speaking opportunity (or a video)
  • Logo on all the communication tools (web and print)
  • Logo on the table during the break
  • Opportunity to provide one quote for pre-event press release
  • Promotion on Yole Développement and EMFT Linkedin and Twitter accounts

SoldOut NCAP2017

 

 

LUCKY DRAW SPONSORSHIP

  • Logo on all the communication tools (web and print)
  • Company name board will be placed near the bowl for the business cards
  • Access to all the business cards at the end of the event
  • Opportunity to provide one quote for pre-event press release
  • Promotion on Yole Développement and EMFT Linkedin and Twitter accounts

The sponsor is responsible for providing the gift to the seminar

SoldOut NCAP2017

 

ATTENDEES BADGE SPONSORSHIP

  • Your logo and company name on all the attendee badges

BADGE SPONSOR

 

ATTENDEES BAG SPONSORSHIP

  • Your logo and company name on your own attendee bag provided to each attendee by the entrance (self-delivery)

 

Giverate NCAP2017

 

GIVEAWAYS & BROCHURES SPONSORSHIP

  • Giveaways or brochures inserted in the attendees bag (self-delivery)

 

SoldOut NCAP2017

 

 

POSTER SPONSORSHIP

  • 1 poster/banner to be displayed in the breaks room
  • Logo and description of your organisation on the Sponsors webpage

Posterrate NCAP2017


Please contact Clotilde (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question or application.

 

 Organized by Hosted by 
  logo yole moyen NCAP China Logo 



Banner LaserForum YoleCIOE 707x100

 

HOME LASER Forum 2017

Call for paper LASER Forum 2017 SPONSORSHIPOPPButtonViolet LASER2017 This email address is being protected from spambots. You need JavaScript enabled to view it. REGISTERButtonPink LASER2017

 

Planned sessions so far will be dedicated to applications, incl. 3D imaging and semiconductor manufacturing, China market focus and technology trends.
These are subject to changes according to call for paper results.

Yole Développement and CIOE welcome original submissions in the following range of areas:

  • Emerging applications:

    - LIDAR
    - 3D imaging
    - Detection
    - Integration and miniaturization
    - Sensor fusion
    - IR optics & lenses

  • Market status:

    - China industry
    - Market trends
    - Players’ strategies

     

  • New technologies:

    - Gesture recognition
    - Sensor fusion
    - Packaging
    - Ultra-fast laser
    - Optics

Please submit abstract (200 words max.) to Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.) by May 15, 2017. Your abstract can include one or two illustrations (graph, images…).

 

 

 

About the 1st Executive Forum on Laser Technologies: From New Technologies to Emerging Applications

  

Yole Développement is proud to collaborate with CIOE to organize the 1st Executive Forum on Laser Technologies. The forum will bring together a worldclass panel of manufacturers, integrators and users experts and allow participants to get valuable insights into the status and future of the laser industry as well as provide unprecedented opportunities for meeting with industry leaders.
Over 1.5 day, it will address laser emerging applications and key markets, new technologies, and future trends. This 1st forum is must for all laser industry executives as well as for manufacturers, integrators and users managers to network and learn about all the latest industry trends. It will take place on September 6 and 7, 2017 in Shenzhen, alongside the 19th China International Optoelectronic Expo 2017.

 


 

GUIDELINES FOR PAPER SUBMISSION

 

Papers must be original material and not have been previously presented or published.

  • Content: technology and/or market focused content with in-depth information and analysis. The quality of the description of your presentation matters. The ability of your description to clearly explain what the attendees will take away from your presentation is critical for your submission to make it through the review process. The abstract must clearly describe the nature, scope, content, organization, key points and significance of the proposed paper.
  • Speaker: please include short biography to the submitted paper.
  • Language: all papers will be in English. Nevertheless, the conference presentation language can be Chinese as we organize a translation service.
  • Procedure: only papers submitted within the call for paper period will be accepted.
  • Exclusivity: the paper may not be used for another conference in parallel, prior to the forum. It will be then sent to the attendees only.
  • Commercial aspect: no commercial papers will be accepted. The presentation will not include direct or hidden product ads. In the presentation, only one slide is dedicated to company introduction. Product brand names may be mentioned infrequently if necessary for explanations.
  • Speaker benefits: 1 free entrance per company to the forum, announcement with abstract, CV and photo on forum webpage and program, presentation sending to all attendees, announcement in the forum promotion.

 

IMPORTANT DATES

Please make sure the following deadlines and dates are respected:

  • Call for Paper opens: April 4, 2017

  • Abstract due: May 15, 2017

  • Author notification sent: May 23, 2017

  • Speaker letter agreement due: May 30, 2017

  • PowerPoint presentation due: August 18, 2017

 

More information or any question, please contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.).

 

 Organized by Hosted by  Partnered by 
  logo yole moyen CIOE Logo 1 CIOE Logo 1

 

 

 

 

Slider YoleNCAP2017 2000x525a

 

HOMEButton NCAP2017

PROGRAMButton NCAP2017

SPONSORSHIPButton NCAP2017

SPONSORButton NCAP2017

This email address is being protected from spambots. You need JavaScript enabled to view it.

REGISTERNowButton NCAP2017

 

 Download below the presentations made available by the speakers.


Thursday 20th of April – Market, Industry and Platforms

8:40 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:10 PM: Session #1 - Fan Out Packaging: from Integration to IP
9:00 – 9:45 – KEYNOTE: The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates - Here
Tony D. Flaim, Chief Technical Officer, Brewer Science

9:45 – 10:10 – Fan Out Packaging Market Trends - Here
Jérôme Azemar, Market & Technology Analyst, Yole Développement

10:10 – 10:35 – Advanced WLP Technology as Mobile, Wearable and IoT Packaging Solution - Here
Lewis Kang, Global Marketing Unit., Director, nepes Corporation

11:20 – 11:45 – Development of Advanced Wafer-Level Packaging Technology Achieving Miniaturization, High Performance and Low Cost - Here
Daquan Yu, CTO, VP, Huatian Technology Electronic

11:45 – 12:10 – Fan-Out Intellectual Patent Landscape - Here
Jérôme Azemar, Market & Technology Analyst, Yole Développement


1:45 PM – 3:25 PM: Session #2 - 3D Integration & Processes for Advanced Packaging

1:45 – 2:10 – Application Driven Heterogeneous Fan-Out / 2.5D & 3D Integration - Here
Farhang Yazdani, President & CEO, BroadPak Corporation

2:10 – 2:35 – Reducing TSV Integration Cost Using F.A.S.T.® Deposition Solution - Here
Julien Vitiello, CEO, Kobus

2:35 – 3:00 – Sensors 3D integration: Technology & Cost Review - Here
Stéphane Elisabeth, Advanced Packaging, MEMS & RF Costing Engineer, System Plus Consulting

3:00 – 3:25 – Wafer Level Packaging of MEMS Sensors - Here
Dr Wenqi Zhang, Technical Director, NCAP



4:10 PM – 5:25 PM: Session #3 - Equipment for Advanced Packaging Platforms

4:10 – 4:35 – Versatile Platform for Advanced Die Attach - Here
Dr. Hugo Pristauz, VP Technical Development Advanced Technology DA, Besi Austria

4:35 – 5:00 – System In Package Applications -Here
Chan Pin Chong, Senior VP, Kulicke & Soffa

5:00 – 5:25 – Advanced Packaging Process Control for High Volume Manufacturing - Here
Dario Alliata, Product Manager, UnitySC


5:30 PM – 6:30 PM: Panel Session

Topic: Is the supply chain ready to support the latest advancements in Fan Out packaging?


Friday 21st of April – Materials, Processes and Applications

8:45 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:35 PM: Session #4 - Advanced Materials & Processes

9:00 – 9:45 – KEYNOTE: Temporary Bonding for FOWLP and Advanced Packaging -Here
Dr. Thomas Uhrmann, Business Development Director, EV Group

9:45 – 10:10 – Direct Write Lithography for Advanced Semiconductor Package Combination with Slit Coating -Here
Olivier Vatel, CTO, SCREEN Semiconductor Solutions

10:10 – 10:35 – Innovative Laser Debonding Solution for Advanced Package - Here
Howard Huang, Director, Kingyoup Optronics

10:35 – 11:00 – High Density, Ultra-Thin & Small Packaging
Tetsukazu Sugiya, Group Leader, Technology Solutions Group, DISCO Corp.

11:45 – 12:10 – Plasma Dicing – The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die - Here
Richard Barnett, Etch Product Manager, SPTS / Orbotech

12:10 – 12:35 – Adopting Plasma Dicing for Advanced Packaging - Here
Dr. David Lishan, Principal Scientist, Plasma-Therm

 

2:00 PM – 4:15 PM: Session #5 - Applicative Packaging & Materials

2:00 – 2:25 – Developments and Innovations in IC Packaging Technologies
Yifan Guo, VP, ASE China

2:25 – 2:50 – The trends of Packaging Technologies for High Power Density Power Module - Here
Kenji Kawada, Staff Engineer, Infineon Technologies Japan

2:50 – 3:15 – CYCLOTENETM BCB Dielectric Material for RF Packaging - Here
Lianming Tong, Lead Marketing Manager, Dow Electronics Materials

3:15 – 3:40 – The Development of Alternative TFRs (Thick Resist Resists) Removing Formulations for Advanced Packaging Applications - Here
Tianniu (Rick) Chen, Vice President of SP&C (Surface Preparation & Cleans), Versum Materials

3:40 – 4:05 – Application and Reliability Analysis of BWECA-200 Conductive Adhesive - Here
Dr. GuoJun Hu, R&D Director, 38th Research Institute of China Electronics Technology Group

4:05 – 4:25 – Production-Ready Flux-free Bump Reflow System with Activated Hydrogen - Here
Tim Bao, Director of Advanced Technology, Asia Pacific, Air Products


 Organized by Hosted by 
  logo yole moyen NCAP China Logo 



 

HOMEButton NCAP2017

SPONSORSHIPButtonBlue NCAP2017

SPONSORButton NCAP2017

CONTACTButton NCAP2017

This email address is being protected from spambots. You need JavaScript enabled to view it.

REGISTERNowButton NCAP2017

 


JULY 3rd


12:30 PM- Registration and Welcome

1:30 PM: Introduction
Yole Développement and Fraunhofer EMFT

2:00 PM to 5:20 PM - SESSION 1 : INDUSTRIAL IoT - BUILDING AUTOMATION

2:00 – 2:30 – Sensors for intelligent systems – requests and trends
Peter Krause, First Sensor

2:30 – 3:00 – Innovation Opportunities in IoT and Industry 4.0 through MEMS-Sensors
Kerstin Bergmann, Program Director Consumer Internet of Things, Robert Bosch GmbH

3:00 – 3:30 – The challenge and opportunity of More-Than-Moore (MTM) technology development toward an IoT world
Mike Rosa, Head of Marketing, Equipment Product Group (EPG) Applied Materials, Inc.
 

03:30 PM – 4:10 PM: Coffee Break and Networking


4:10 – 4:40 – From Smart to Cognitive Buildings – Energy Harvesting Sensors to Cloud
Graham Martin, Chairman & CEO, EnOcean Alliance

4:40 – 5:10 – MEMS-based Optical gas sensors for Air quality services
Yanis Caritu, CTO and co-founder, Elichens

5:10 – 5:20 – Panel introduction - "Strategic crossroads for sensor players - which path to take?"
 Ondrej Burkacky, McKinsey


5:20 PM – PANEL SESSION: Who is the winner of this evolution?
Moderated by Yole Développement

The home & building supply chain is very complex and highly fragmented, with closely interwoven industries. The important question today is: who is and will be best-positioned to enter the smart homes & buildings market and win a significant portion of value?


6:00 PM - Dinner / Cocktail and Networking


JULY 4th


8:30 AM – Welcome

9:00 AM to 12:00 AM: SESSION 2 : CONSUMER IOT (health, wearables, connected home…)

9:00 – 9:30 –Low power sensor for wearables and IoT
Dr. Wolfgang Schmitt, Senior Manager Strategic Marketing, Bosch Sensortec

9:30 – 10:00 – Sensing is life: Why consumer IoT is already living reality
Rainer Minixhofer, Director Solutions R&D, ams

10:00 – 10:30 –The Promise of Digital Olfaction
Dr. Tristan Rousselle, CEO, Aryballe Technologies

10:30 AM – 11:00 AM: Coffee Break and Networking

11:00 – 11:30 – What are the integration limits of Consumer MEMS technologies?
Romain Fraux, CTO, System Plus Consulting

11:30 – 12:00 –The trend for MEMS Sensors in new medical diagnostic applications – unlocking the future with machine learning algorithms
François Villeneuve, Business Development Manager, NXP Semiconductors

12:00 AM: Lunch Break and Networking

1:30 PM to 5:30 PM : SESSION 3 : FUTURE OF AUTOMOTIVE

1:30 – 2:00 –The Senses of tomorrow’s Mobility
Berthold Hellenthal, Audi

2:00 – 2:30 – TBD
Bernhard Straub, Infineon

2:30 –3:00–Smart Environmental Sensors for Automobiles
Dr. Lukas Bürgi, Director R&D Sensor Innovation, Sensirion

3:00 – 3:10 – Panel introduction - Smart Strategies for Smart Sensors
Michael Alexander, Partner, Engineered Products & High Tech, Roland Berger

3:10 PM – PANNEL SESSION: Can the next sensor era’s growth be managed?
Moderated by Yole Développement

The sensor market’s rapid increase in value (+15% per year / +23% per year in units) means more devices for integrating into systems, more sensor fusion, and more intelligence to facilitate the usage of data for analysis and actions. But there’s a downside: potentially less value for sensor manufacturers. So how best to ensure the sensor market’s growth is profitable for everyone?

03:30 PM – 4:00 PM: Coffee Break and Networking

4:00 – 4:30 – Highest computing power and automotive robustness - a challenge or a contradiction
Harald Gossner, Senior Principal Engineer, Intel

4:30 – 5:00 –How the partly disruptive IoT era approach opens new opportunities for silicon foundries
Dr. Rainer Käsmaier, Vice President, SMIC / LFoundry

Warm up and Closing Session


Please contact Clotilde (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question.

 

  

 Organized by Hosted by  Sponsored by 
  logo yole moyen NCAP China Logo  EVG LogoR



Upcoming events


> Transducers
(June 18 - June 22, Kaohsiung, Taiwan)

> SEMI 2017 Flex
(June 19 - June 22, Monterey, CA)

> EMVA
(June 22 - June 24, Prague, Czech Republic)

Webcast

No events