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For the 3rd time, Yole Développement & NCAP partner to organize the Advanced Packaging Symposium focused on Advanced Packaging & System Integration Technology. This symposium is an unparalleled gathering of the leading executives from around the world discussing the timeliest issues, challenges and opportunities. The unique single-meeting event will take place in one of the most dynamic place in the field of advanced packaging: Wuxi, China, from April 20 to 21, 2017. Discover below the preliminary agenda.


Thursday 20th of April – Market, Industry and Platforms

8:40 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:10 PM: Session #1 - Fan Out Packaging: from Integration to IP
9:00 – 9:45 – KEYNOTE
Herb Huang, SMIC

9:45 – 10:10 – Fan Out Packaging Market Trends
Jérôme Azemar, Market & Technology Analyst, Yole Développement

10:10 – 10:35 – Advanced WLP Technology as Mobile, Wearable and IoT Packaging Solution
Lewis Kang, Global Marketing Unit., Director, nepes Corporation


10:35 AM – 11:20 AM: Coffee Break and Networking


11:20 – 11:45 – Development of Advanced Wafer-Level Packaging Technology Achieving Miniaturization, High Performance and Low Cost
Daquan Yu, CTO, VP, Huatian Technology Electronic

11:45 – 12:10 – Fan-Out Intellectual Patent Landscape
Jérôme Azemar, Market & Technology Analyst, Yole Développement


12:10 PM – 1:45 PM: Lunch and Networking


1:45 PM – 3:25 PM: Session #2 - 3D Integration & Processes for Advanced Packaging

1:45 – 2:10 – Application Driven Heterogeneous Fan-Out / 2.5D & 3D Integration
Farhang Yazdani, President & CEO, BroadPak Corporation

2:10 – 2:35 – Reducing TSV Integration Cost Using F.A.S.T.® Deposition Solution
Julien Vitiello, CEO, Kobus

2:35 – 3:00 – Sensors 3D integration: Technology & Cost Review
Stéphane Elisabeth, Advanced Packaging, MEMS & RF Costing Engineer, System Plus Consulting

3:00 – 3:25 – Wafer Level Packaging of MEMS Sensors
Dr Wenqi Zhang, Technical Director, NCAP



3:25 PM – 4:10 PM: Coffee Break and Networking


4:10 PM – 5:25 PM: Session #3 - Equipment for Advanced Packaging Platforms

4:10 – 4:35 – Versatile Platform for Advanced Die Attach
Dr. Hugo Pristauz, VP Technical Development Advanced Technology DA, Besi Austria

4:35 – 5:00 – System In Package Applications
Chan Pin Chong, Senior VP, Kulicke & Soffa

5:00 – 5:25 – Advanced Packaging Process Control for High Volume Manufacturing
Dario Alliata, Product Manager, UnitySC


5:30 PM – 6:30 PM: Panel Session

Topic: Is the supply chain ready to support the latest advancements in Fan Out packaging?

6:30 PM – 6:45 PM: Thank You and Adjourn

6:45 PM – 8:00 PM: Networking Cocktail


Friday 21st of April – Materials, Processes and Applications

8:45 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:35 PM: Session #4 - Advanced Materials & Processes

9:00 – 9:45 – KEYNOTE: The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates
Tony D. Flaim, Chief Technical Officer, Brewer Science

9:45 – 10:10 – Temporary Bonding for FOWLP and Advanced Packaging
Dr. Thomas Uhrmann, Business Development Director, EV Group

10:10 – 10:35 – Innovative Laser Debonding Solution for Advanced Package
Howard Huang, Director, Kingyoup Optronics

10:35 – 11:00 – High Density, Ultra-Thin & Small Packaging
Tetsukazu Sugiya, Group Leader, Technology Solutions Group, DISCO Corp.

 

11:00 AM – 11:45 AM: Coffee Break and Networking

 

11:45 – 12:10 – Plasma Dicing – The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die
Richard Barnett, Etch Product Manager, SPTS / Orbotech

12:10 – 12:35 – Adopting Plasma Dicing for Advanced Packaging
Dr. David Lishan, Principal Scientist, Plasma-Therm

 

12:35 PM – 2:00 PM: Lunch and Networking


2:00 PM – 4:15 PM: Session #5 - Applicative Packaging & Materials

2:00 – 2:25 – Developments and Innovations in IC Packaging Technologies
Yifan Guo, VP, ASE China

2:25 – 2:50 – The trends of Packaging Technologies for High Power Density Power Module 
Kenji Kawada, Staff Engineer, Infineon Technologies Japan

2:50 – 3:15 – CYCLOTENETM BCB Dielectric Material for RF Packaging
Lianming Tong, Lead Marketing Manager, Dow Electronics Materials

3:15 – 3:40 – The Development of Alternative TFRs (Thick Resist Resists) Removing Formulations for Advanced Packaging Applications
Tianniu (Rick) Chen, Vice President of SP&C (Surface Preparation & Cleans), Versum Materials

3:40 – 4:05 – Application and Reliability Analysis of BWECA-200 Conductive Adhesive
Dr. GuoJun Hu, R&D Director, 38th Research Institute of China Electronics Technology Group

4:05 – 4:25 – Production-Ready Flux-free Bump Reflow System with Activated Hydrogen
Tim Bao, Director of Advanced Technology, Asia Pacific, Air Products


4:25 PM – 4:30 PM: Thank You and Adjourn

Download PDF files: AGENDA - SPEAKERS BIO - ABSTRACTS

REGISTER NOW!

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Why should you sponsor the Promising future of sensors in IoT seminar?

Sponsoring the "Promising future of sensors in IoT seminar" is a prime opportunity to put your company in front of more than 80 of the key industry players and decision makers of the industry. Be partner of a focused and high-level MEMS seminar !

  • Increase your organization's visibility before, during and after the symposium
  • Enhance relationships with existing customers and generate new leads
  • Promotion to thousands of email subscribers
  • Senior management networking opportunities
  • Get free pass (depending on the selected package)

 

Different levels of opportunities to suit your needs

 

ALL LEVELS OF SPONSORSHIP INCLUDE

 

  • 1 free full pass registration
  • Logo and description of your organization on the Sponsors section of the event webpage (with a link to your website)
  • Acknowledgement during the seminar (openings, conference, ...)
  • Possibility to provide a corporate brochure or giveaways inserted in the attendees' jacket
  • Opportunity to set up a roll up or a poster, or to distribute brochures at the Sponsor Corner onsite

 

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PLATINIUM SPONSORSHIP

 Exclusive benefits for the platinum sponsor:

  • 1 break sponsorship, including 8-minute speaking opportunity (or a video)
  • 1 extra free full pass registration
  • Access to the presentations and complete attendees list after the seminar
  • Logo on all the communication tools (web and print)
  • Logo on the table during the break
  • Opportunity to provide one quote for pre-event press release
  • Promotion on Yole Développement and EMFT Linkedin and Twitter accounts

Luckydrawrate NCAP2017

 

 

GOLD SPONSORSHIP

 Exclusive benefits for the gold sponsor

  • 1 break sponsorship, including 5-minute speaking opportunity (or a video)
  • Logo on all the communication tools (web and print)
  • Logo on the table during the break
  • Opportunity to provide one quote for pre-event press release
  • Promotion on Yole Développement and EMFT Linkedin and Twitter accounts

SoldOut NCAP2017

 

 

LUCKY DRAW SPONSORSHIP

  • Logo on all the communication tools (web and print)
  • Company name board will be placed near the bowl for the business cards
  • Access to all the business cards at the end of the event
  • Opportunity to provide one quote for pre-event press release
  • Promotion on Yole Développement and EMFT Linkedin and Twitter accounts

The sponsor is responsible for providing the gift to the seminar

SoldOut NCAP2017

 

 

ATTENDEES BAG SPONSORSHIP

  • Your logo and company name on your own attendee bag provided to each attendee by the entrance (self-delivery)

 

Giverate NCAP2017

 

GIVEAWAYS & BROCHURES SPONSORSHIP

  • Giveaways or brochures inserted in the attendees bag (self-delivery)

 

SoldOut NCAP2017

 

 

POSTER SPONSORSHIP

  • 1 poster/banner to be displayed in the breaks room
  • Logo and description of your organisation on the Sponsors webpage

Posterrate NCAP2017


Please contact Clotilde (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question or application.

 

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July 3

July4

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8:30 - Welcome

9:00 to 12:00 - SESSION 2 : CONSUMER IOT (health, wearables, connected home…)

 

12:00 - LUNCH

 

1:30 to 4:30 - SESSION 3: FUTURE OF AUTOMOTIVE

 

4:30 - PANEL SESSION : Can we manage the growth to the next sensor era ?

 

5:00 - Warm-up and Closing session


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 Download below the presentations made available by the speakers.


Thursday 20th of April – Market, Industry and Platforms

8:40 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:10 PM: Session #1 - Fan Out Packaging: from Integration to IP
9:00 – 9:45 – KEYNOTE: The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates - Here
Tony D. Flaim, Chief Technical Officer, Brewer Science

9:45 – 10:10 – Fan Out Packaging Market Trends - Here
Jérôme Azemar, Market & Technology Analyst, Yole Développement

10:10 – 10:35 – Advanced WLP Technology as Mobile, Wearable and IoT Packaging Solution - Here
Lewis Kang, Global Marketing Unit., Director, nepes Corporation

11:20 – 11:45 – Development of Advanced Wafer-Level Packaging Technology Achieving Miniaturization, High Performance and Low Cost
Daquan Yu, CTO, VP, Huatian Technology Electronic

11:45 – 12:10 – Fan-Out Intellectual Patent Landscape - Here
Jérôme Azemar, Market & Technology Analyst, Yole Développement


1:45 PM – 3:25 PM: Session #2 - 3D Integration & Processes for Advanced Packaging

1:45 – 2:10 – Application Driven Heterogeneous Fan-Out / 2.5D & 3D Integration - Here
Farhang Yazdani, President & CEO, BroadPak Corporation

2:10 – 2:35 – Reducing TSV Integration Cost Using F.A.S.T.® Deposition Solution - Here
Julien Vitiello, CEO, Kobus

2:35 – 3:00 – Sensors 3D integration: Technology & Cost Review - Here
Stéphane Elisabeth, Advanced Packaging, MEMS & RF Costing Engineer, System Plus Consulting

3:00 – 3:25 – Wafer Level Packaging of MEMS Sensors - Here
Dr Wenqi Zhang, Technical Director, NCAP



4:10 PM – 5:25 PM: Session #3 - Equipment for Advanced Packaging Platforms

4:10 – 4:35 – Versatile Platform for Advanced Die Attach - Here
Dr. Hugo Pristauz, VP Technical Development Advanced Technology DA, Besi Austria

4:35 – 5:00 – System In Package Applications -Here
Chan Pin Chong, Senior VP, Kulicke & Soffa

5:00 – 5:25 – Advanced Packaging Process Control for High Volume Manufacturing - Here
Dario Alliata, Product Manager, UnitySC


5:30 PM – 6:30 PM: Panel Session

Topic: Is the supply chain ready to support the latest advancements in Fan Out packaging?


Friday 21st of April – Materials, Processes and Applications

8:45 AM – 9:00 AM: Welcome and Introduction
Yole Développement and NCAP

9:00 AM – 12:35 PM: Session #4 - Advanced Materials & Processes

9:00 – 9:45 – KEYNOTE: Temporary Bonding for FOWLP and Advanced Packaging -Here
Dr. Thomas Uhrmann, Business Development Director, EV Group

9:45 – 10:10 – NA
Olivier Vatel, CTO, SCREEN Semiconductor Solutions

10:10 – 10:35 – Innovative Laser Debonding Solution for Advanced Package - Here
Howard Huang, Director, Kingyoup Optronics

10:35 – 11:00 – High Density, Ultra-Thin & Small Packaging
Tetsukazu Sugiya, Group Leader, Technology Solutions Group, DISCO Corp.

11:45 – 12:10 – Plasma Dicing – The Lower Cost of Ownership Route to Thinner/Smaller/Stronger Die - Here
Richard Barnett, Etch Product Manager, SPTS / Orbotech

12:10 – 12:35 – Adopting Plasma Dicing for Advanced Packaging - Here
Dr. David Lishan, Principal Scientist, Plasma-Therm

 

2:00 PM – 4:15 PM: Session #5 - Applicative Packaging & Materials

2:00 – 2:25 – Developments and Innovations in IC Packaging Technologies
Yifan Guo, VP, ASE China

2:25 – 2:50 – The trends of Packaging Technologies for High Power Density Power Module - Here
Kenji Kawada, Staff Engineer, Infineon Technologies Japan

2:50 – 3:15 – CYCLOTENETM BCB Dielectric Material for RF Packaging - Here
Lianming Tong, Lead Marketing Manager, Dow Electronics Materials

3:15 – 3:40 – The Development of Alternative TFRs (Thick Resist Resists) Removing Formulations for Advanced Packaging Applications - Here
Tianniu (Rick) Chen, Vice President of SP&C (Surface Preparation & Cleans), Versum Materials

3:40 – 4:05 – Application and Reliability Analysis of BWECA-200 Conductive Adhesive - Here
Dr. GuoJun Hu, R&D Director, 38th Research Institute of China Electronics Technology Group

4:05 – 4:25 – Production-Ready Flux-free Bump Reflow System with Activated Hydrogen - Here
Tim Bao, Director of Advanced Technology, Asia Pacific, Air Products


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JULY 3rd


1:00 PM- Registration and Welcome

1:30 PM: Introduction
Yole Développement and Fraunhofer EMFT

2:00 PM to 5:20 PM - SESSION 1 : INDUSTRIAL IoT - BUILDING AUTOMATION

2:00 – 2:30 – TBD
Peter Krause, First Sensor

2:30 – 3:00 – Innovation Opportunities in IoT and Industry 4.0 through MEMS-Sensors
Kerstin Bergmann, Program Director Consumer Internet of Things, Robert Bosch GmbH

3:00 – 3:30 – TBD
STMicroeletronics
 

03:30 PM – 4:10 PM: Coffee Break and Networking


4:10 – 4:40 – From Smart to Cognitive Buildings – Energy Harvesting Sensors to Cloud
Graham Martin, Chairman & CEO, EnOcean Alliance

4:40 – 5:10 – MEMS-based Optical gas sensors for Air quality services
Yanis Caritu, CTO and co-founder, Elichens

5:10 – 5:20 – Panel introduction - "Smart strategies for smart sensors"
Harald Bauer, McKinsey


5:20 PM – PANEL SESSION: Who is the winner of this evolution?
Moderated by Yole Développement


6:00 PM - Dinner / Cocktail and Networking


JULY 4th


8:30 AM – Welcome

9:00 AM to 12:00 AM: SESSION 2 : CONSUMER IOT (health, wearables, connected home…)

9:00 – 9:30 –Low power sensor for wearables and IoT
Dr. Wolfgang Schmitt, Senior Manager Strategic Marketing, Bosch Sensortec

9:30 – 10:00 – TBD
Rainer Minixhofer, Director Solutions R&D, ams

10:00 – 10:30 –The Promise of Digital Olfaction
Dr. Tristan Rousselle, CEO, Aryballe Technologies

10:30 AM – 11:00 AM: Coffee Break and Networking

11:00 – 11:30 – What are the integration limits of Consumer MEMS technologies?
Romain Fraux, CTO, System Plus Consulting

11:30 – 12:00 –The trend for MEMS Sensors in new medical diagnostic applications – unlocking the future with machine learning algorithms
François Villeneuve, Business Deveolpment Manager, NXP Semiconductors

12:00 AM: Lunch Break and Networking

1:30 PM to 5:30 PM : SESSION 3 : FUTURE OF AUTOMOTIVE

1:30 – 2:00 –The Senses of tomorrow’s Mobility
Berthold Hellenthal, Audi

2:00 – 2:30 – TBD
Bernhard Straub, Infineon

2:30 –3:00–TBA
TBA

3:00 – 3:10 – Panel introduction
Michael Alexander, Roland Berger

3:10 PM – PANNEL SESSION: Can we manage the growth to the next sensor era
Moderated by Yole Développement

03:30 PM – 4:00 PM: Coffee Break and Networking

4:00 – 4:30 – Highest computing power and automotive robustness - a challenge or a contradiction
Harald Gossner, Senior Principal Engineer, Intel

4:30 – 5:00 –How the partly disruptive IoT era approach opens new opportunities for silicon foundries
Rainer Kaesmaier, Vice President, LFoundry

Warm up and Closing Session


Please contact Clotilde (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question.

Download the AGENDA and the ABSTRACTS  

  

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Why should you sponsor the 3rd Advanced Packaging & System Integration Technology Symposium?

Sponsoring the Advanced Packaging & System Integration Technology Symposium is a prime opportunity to put your company in front of more than 100 of the key industry players and decision makers of the industry. The symposium is the unique single-meeting event in China exclusively dedicated to advanced packaging, where you will be able to meet and talk with key players.

  • Increase your organization's visibility before, during and after the symposium
  • Enhance relationships with existing customers and generate new leads
  • Promotion to thousands of email subscribers
  • Meet customers and partners from 15+ different countries
  • Senior management networking opportunities
  • Get free pass (depending on the selected package)

 

Different levels of opportunities to suit your needs

 

PLATINUM SPONSORSHIP

 

Forum

  • 1 free full pass registration
  • Proceedings of all shared presentations

Visibility and brand exposure

  • Sponsors announced by the organiser during the symposium
  • Logo on all the communication tools (web and print)
  • 1 poster/banner to be displayed in the conference room
  • Company name board will be placed on tables during the coffee breaks, the lunches and the cocktail
  • Logo and description of your organisation on the Sponsors webpage
  • Opportunity to provide one quote for pre-event press release
  • Corporate leaflets or giveaways inserted in the attendees' bag
  • Opportunity to distribute brochures at the Sponsors Corner

Platinumrate NCAP2017

 

LUCKY DRAW SPONSORSHIP

 

Forum

  • 1 free full pass registration
  • Proceedings of all shared presentations

Visibility and brand exposure

  • Sponsor announced by the organiser during the symposium and during the lucky draw finale
  • Logo on all the communication tools (web and print)
  • 1 poster/banner to be displayed in the conference room
  • Company name board will be placed near the bowl for the business cards
  • Access to all the business cards at the end of the event
  • Logo and description of your organisation on the Sponsors webpage
  • Opportunity to provide one quote for pre-event press release
  • Corporate leaflets or giveaways inserted in the attendees' bag
  • Opportunity to distribute brochures at the Sponsors Corner

SoldOut NCAP2017

 

ATTENDEES BAG SPONSORSHIP

 

Forum

  • 1 free full pass registration
  • Proceedings of all shared presentations

Visibility and brand exposure

  • Your attendees bag to be distributed to each delegate(bags provided by the sponsor)
  • Logo and description of your organisation on the Sponsors webpage
  • Opportunity to distribute brochures at the Sponsors Corner

SoldOut NCAP2017

 

BADGE SPONSORSHIP

 

Forum

  • 1 free full pass registration
  • Proceedings of all shared presentations

Visibility and brand exposure

  • Logo on the attendee badge
  • Logo and description of your organisation on the Sponsors webpage
  • Opportunity to distribute brochures at the Sponsors Corner

SoldOut NCAP2017

 

GIVEAWAYS & BROCHURES SPONSORSHIP

 

Forum

  • 1 free full pass registration
  • Proceedings of all shared presentations

Visibility and brand exposure

  • Giveaways or brochures inserted in the attendees bag (items provided by the sponsor)
  • Logo and description of your organisation on the Sponsors webpage
  • Opportunity to distribute brochures at the Sponsors Corner

Giverate NCAP2017

 

SOLE PROMOTIONAL OPPORTUNITIES

 

Logo opportunities

  • Corporate logo as sponsor featured on all conference promotional materials
  • Logo and description of your organisation on the Sponsors webpage

 

SoldOut NCAP2017

Paper & pencil opportunities

  • Paper & pencil (provided by the sponsor)
  • Logo and description of your organisation on the Sponsors webpage

 

Paperrate NCAP2017

Poster opportunities

  • 1 poster/banner to be displayed in the breaks room
  • Logo and description of your organisation on the Sponsors webpage

Posterrate NCAP2017


Please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question or application.

 

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