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Download below the presentations made available by the speakers.


Wednesday 20th of June – Short courses 

8:00 AM – 8:50 AM: Registration

8:40 AM – 9:00 AM: Welcome and Introduction

NCAP

9:00 AM – 12:00 PM: Short Courses Session

9:00 – 9:30 – Electronic Packaging Technology and Materials -  Here
CP Wong, Regents’ Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering, Georgia Institute of Technology

9:30 – 10:30 – HPC and Advanced Packaging Technology Development -  Here
Yifan Guo, VP of Engineering, ASE Group

10:30 AM – 11:00 AM: Coffee Break and Networking

11:00 – 12:00 – Accurate Package Characterization and Modeling for RFIC Design -  Here
Fujiang Lin, Professor, University of Science & Technology of China

 

12:00 PM – 1:30 PM: Lunch and Networking

 

Wednesday 20th of June – Symposium


1:00 PM – 1:30 PM: Symposium registration

1:30 PM – 1:45 PM: Welcome and Introduction

Yole Développement & NCAP

1:45 PM – 2:30 PM: KEYNOTE

1:45 – 2:30 – KEYNOTE: Impact of the Industry Trends on Advanced Packaging -  Here
Jean-Christophe Eloy, President & CEO, Yole Développement

2:30 PM – 3:20 PM: Session #1 – Advanced Power Packaging

2:30 – 2:55 – MOSFET Embedding in PCB - 
Here
Sky Ran, Key Account Manager, Schweizer Electronic (Suzhou)

2:55 – 3:20 – MultiPlate: a New Tool for Next Generation Power Semiconductors -  Here
Bobby Chen, Business Manager of Semiconductor & New Field, Atotech Taiwan and China

3:20 PM – 3:45 PM: Coffee Break and Networking

3:45 PM – 5:25 PM: Session #2 – Panel Level Packaging

3:45 – 4:10 – Is Industry Ready for Fan-Out Panel Level Packaging (FOPLP)? -  Here
Santosh Kumar, Director Packaging, Assembly & Substrates, Yole Développement

4:10 – 4:35 – From Round to Square, cost effective sputter solutions for High Volume Manufacturing (HVM) -  Here
Andreas Erhart, Senior Manager, Product Marketing Advanced Packaging, Evatec

4:35 – 5:00 – Electroplating in Advanced Packaging: Effortless Scaling from Wafer to Panels with High Speed and Excellent Uniformity -  Here
Herbert Oetzlinger, CEO, Semsysco

5:00 – 5:25 – The Convergent Future: Industries-wide Disruption through Flexible Hybrid Electronics -  Here
Chong Chan Pin, Senior Vice President, EA/APMR and Wedge Bonders Business Lines, Kulicke & Soffa

5:25 PM – 6:15 PM: Panel Session
What are the real impacts of megatrends on equipment and materials ?

6:15 PM – 6:20 PM: Thank You and Adjourn
Yole Développement and NCAP

7:00 PM – 8:30 PM: Networking Cocktail


Thursday 21st of June – Symposium

8:00 AM – 8:15 AM: Welcome and Introduction
Yole Développement and NCAP

8:15 AM – 9:00 AM: KEYNOTE

8:15 – 9:00 – KEYNOTE: The Industrialization Road of Innovative Wafer-level Fan-Out Technology: eSiFO -  Here
Dr. Daquan Yu, Vice President, Huatian Technology (Kunshan) Electronic

9:00 AM – 11:20 AM: Session #3 – Fan-Out Wafer Level Packaging

9:00 – 9:25 – Fan-out Wafer Processing in the High Density Packaging Era -  Here
David Butler, EVP General Manager, SPTS Technologies

9:25 – 9:50 – 10 years of Thermal Debonding and Warpage Adjust -  Here
Klemens Reitinger, CEO, ERS electronic

9:50 – 10:15 – Defect Inspection for Shrinking RDL Line/Space in High-Density Fan-Out Wafer Level Packaging -  Here
Stephen Hiebert, Senior Director of Marketing, KLA-Tencor

10:15 AM – 10:45 AM: Coffee Break and Networking

10:45 – 11:10 – The Status of FOWLP Development in NCAP, China -  Here
Daping Yao, Ph.D., Technical Director, NCAP China

11:10 – 11:20 – The Investment environment and Semiconductor Packaging and Testing Industry of Xuzhou Economic and Technological Development Zone -  Here
Dai Lei, Member of the CPC Work Committee and Deputy Director of the Management Committee, Xuzhou Economic and Technological Development Zone

11:20 AM – 12:35 PM: Session #4 – High End

11:20 – 11:45 – Advanced Die Attach Technologies -  Here
Andreas Schopper, Vice President Flip Chip, Besi Switzerland

11:45 – 12:10 – Equipment and Process Challenges for the Advanced Packaging Landscape -  Here
Laura Mauer, Chief Technical Officer, Veeco

12:10 – 12:35 – High End Performance Application key Driver for Advanced Packaging -  Here
Thibault Buisson, General Manager, Yole Développement

 

12:35 PM – 1:45 PM: Lunch and Networking

 

1:45 PM – 3:25 PM: Session #5 – Equipment for Wafer Level Packaging

1:45 – 2:10 – Plasma for Wafer-On-Frame Treatment -  Here
Jack Zhao, Ph.D., Chief Scientist/Applications Director, Nordson March

2:10 – 2:35 – The Advancement of Carrier-Assisted Substrate Handling Technology for Advanced Packaging -  Here
Dongshun Bai, Ph.D., Deputy Business Development Director, Brewer Science

2:35 – 3:00 – Advanced Wafer Bonding Technologies Enabling Smart Connected Devices -  Here
Martin Eibelhuber, Deputy Head of Business Development, EV Group

3:00 – 3:25 – Laser Based Direct Exposure Tool Status in Advanced Semiconductor Packaging -  Here
Olivier Vatel, Chief Technology Officer, SCREEN

3:25 PM – 4:10 PM: Coffee Break and Networking

4:10 PM – 5:00 PM: Session #6 – Advanced Packaging Materials

4:10 – 4:35 – Introduction of Dipsol TS -3500(SnAg) Chemical for Bump Application -  Here
Atsushi Sakamoto, Manager, Dipsol Chemical

4:35 – 5:00 – TBA
Minghua Luo, General Manager, Dongguang Darbond YizTech Material


5:00 PM – 5:15 PM: Thank You and Adjourn

Yole Développement and NCAP


Download PDF files: AGENDA - SPEAKERS BIO - ABSTRACTS


PHOTOS OF THE EVENT: HERE.

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After the three last successful events, Yole Développement & NCAP have decided to continue and strengthen the collaboration to organize the Advanced Packaging & System Integration Technology Symposium for the 4th time. The unique single-meeting event will take place in one of the most dynamic places in the semiconductor: Wuxi, China, from June 20 to 21, 2018. During 2 days, all packaging aspects including Panel Level, Fan Out, System in Package, Advanced Substrates, 3D Technology will be discussed. Focus on key applications such as 5G, Automotive, Artificial Intelligence and Memory will be at the heart of the conference.


Wednesday 20th of June – Short courses 

8:00 AM – 8:50 AM: Registration

8:40 AM – 9:00 AM: Welcome and Introduction

NCAP

9:00 AM – 12:00 PM: Short Courses Session

9:00 – 9:30 – Electronic Packaging Technology and Materials
CP Wong, Regents’ Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering, Georgia Institute of Technology

9:30 – 10:30 – HPC and Advanced Packaging Technology Development
Yifan Guo, VP of Engineering, ASE Group

10:30 AM – 11:00 AM: Coffee Break and Networking

11:00 – 12:00 – Accurate Package Characterization and Modeling for RFIC Design
Fujiang Lin, Professor, University of Science & Technology of China

 

12:00 PM – 1:30 PM: Lunch and Networking

 

Wednesday 20th of June – Symposium


1:00 PM – 1:30 PM: Symposium registration

1:30 PM – 1:45 PM: Welcome and Introduction

Yole Développement & NCAP

1:45 PM – 2:30 PM: KEYNOTE

1:45 – 2:30 – KEYNOTE: Impact of the Industry Trends on Advanced Packaging
Jean-Christophe Eloy, President & CEO, Yole Développement

2:30 PM – 3:20 PM: Session #1 – Advanced Power Packaging

2:30 – 2:55 – MOSFET Embedding in PCB
Sky Ran, Key Account Manager, Schweizer Electronic (Suzhou)

2:55 – 3:20 – MultiPlate: a New Tool for Next Generation Power Semiconductors
Bobby Chen, Business Manager of Semiconductor & New Field, Atotech Taiwan and China

3:20 PM – 3:45 PM: Coffee Break and Networking

3:45 PM – 5:25 PM: Session #2 – Panel Level Packaging

3:45 – 4:10 – Is Industry Ready for Fan-Out Panel Level Packaging (FOPLP)?
Santosh Kumar, Director Packaging, Assembly & Substrates, Yole Développement

4:10 – 4:35 – From Round to Square, cost effective sputter solutions for High Volume Manufacturing (HVM)
Andreas Erhart, Senior Manager, Product Marketing Advanced Packaging, Evatec

4:35 – 5:00 – Electroplating in Advanced Packaging: Effortless Scaling from Wafer to Panels with High Speed and Excellent Uniformity
Herbert Oetzlinger, CEO, Semsysco

5:00 – 5:25 – The Convergent Future: Industries-wide Disruption through Flexible Hybrid Electronics
Chong Chan Pin, Senior Vice President, EA/APMR and Wedge Bonders Business Lines, Kulicke & Soffa

5:25 PM – 6:15 PM: Panel Session
TBA

6:15 PM – 6:20 PM: Thank You and Adjourn
Yole Développement and NCAP

7:00 PM – 8:30 PM: Networking Cocktail


Thursday 21st of June – Symposium

8:00 AM – 8:15 AM: Welcome and Introduction
Yole Développement and NCAP

8:15 AM – 9:00 AM: KEYNOTE

8:15 – 9:00 – KEYNOTE: The Industrialization Road of Innovative Wafer-level Fan-Out Technology: eSiFO
Dr. Daquan Yu, Vice President, Huatian Technology (Kunshan) Electronic

9:00 AM – 11:20 AM: Session #3 – Fan-Out Wafer Level Packaging

9:00 – 9:25 – Fan-out Wafer Processing in the High Density Packaging Era
David Butler, EVP General Manager, SPTS Technologies

9:25 – 9:50 – 10 years of Thermal Debonding and Warpage Adjust
Klemens Reitinger, CEO, ERS electronic

9:50 – 10:15 – Defect Inspection for Shrinking RDL Line/Space in High-Density Fan-Out Wafer Level Packaging
Stephen Hiebert, Senior Director of Marketing, KLA-Tencor

10:15 AM – 10:45 AM: Coffee Break and Networking

10:45 – 11:10 – The Status of FOWLP Development in NCAP, China
Daping Yao, Ph.D., Technical Director, NCAP China

11:10 – 11:20 – The Investment environment and Semiconductor Packaging and Testing Industry of Xuzhou Economic and Technological Development Zone
Dai Lei, Member of the CPC Work Committee and Deputy Director of the Management Committee, Xuzhou Economic and Technological Development Zone

11:20 AM – 12:35 PM: Session #4 – High End

11:20 – 11:45 – Advanced Die Attach Technologies
Andreas Schopper, Vice President Flip Chip, Besi Switzerland

11:45 – 12:10 – Equipment and Process Challenges for the Advanced Packaging Landscape
Laura Mauer, Chief Technical Officer, Veeco

12:10 – 12:35 – High End Performance Application key Driver for Advanced Packaging
Thibault Buisson, General Manager, Yole Développement

 

12:35 PM – 1:45 PM: Lunch and Networking

 

1:45 PM – 3:25 PM: Session #5 – Equipment for Wafer Level Packaging

1:45 – 2:10 – Plasma for Wafer-On-Frame Treatment
Jack Zhao, Ph.D., Chief Scientist/Applications Director, Nordson March

2:10 – 2:35 – The Advancement of Carrier-Assisted Substrate Handling Technology for Advanced Packaging
Dongshun Bai, Ph.D., Deputy Business Development Director, Brewer Science

2:35 – 3:00 – Advanced Wafer Bonding Technologies Enabling Smart Connected Devices
Martin Eibelhuber, Deputy Head of Business Development, EV Group

3:00 – 3:25 – Laser Based Direct Exposure Tool Status in Advanced Semiconductor Packaging
Olivier Vatel, Chief Technology Officer, SCREEN

3:25 PM – 4:10 PM: Coffee Break and Networking

4:10 PM – 5:00 PM: Session #6 – Advanced Packaging Materials

4:10 – 4:35 – Introduction of Dipsol TS -3500(SnAg) Chemical for Bump Application
Atsushi Sakamoto, Manager, Dipsol Chemical

4:35 – 5:00 – TBA
Minghua Luo, General Manager, Dongguang Darbond YizTech Material


5:00 PM – 5:15 PM: Thank You and Adjourn

Yole Développement and NCAP


Download PDF files: AGENDA - SPEAKERS BIO - ABSTRACTS


REGISTER NOW!

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4 executive forums to get the opportunity to learn from
and network with the key players of the photonics industry

Registrations open and sponsorships opportunities available

 

Encouraged by five consecutive years of successful forums, which attracted more than 100 participants on average, Yole Développement is proud to collaborate with CIOE to organize in 2018 4 different forums on: Laser Manufacturing, InfraRed Imaging, LiDAR and 3D Sensing.
They will take place on September 5, 6 and 7, 2018 in Shenzhen, alongside the 20th China International Optoelectronic Exposition 2018. These events present market and technologies within the photonics industry. Discover more about each of them below.

Executive Forum on Laser Technologies - Sept. 5 PM, 2018
The forum will discuss laser technologies' applicability in the semiconductor field, address the status of laser methods and materials processing, and highlight the latest technological trends. This half-day forum mainly welcomes all laser industry executives such as laser equipment vendors, laser source suppliers as well as integrators and users managers to network and discover the future laser trends. More information HERE.


Executive Forum on LiDAR for Automotive - Sept. 6 AM, 2018
The forum will present applications and technologies within the LiDAR industry, and more specifically automotive-oriented solutions. LiDAR offers high-resolution cloud-point images serving as a key to the development of automated driving technology, especially robotics cars. This development is happening now, and is the first step to the disruption of the transportation market. More information HERE.


Executive Forum on 3D Sensing for Consumers - Sept. 6 PM, 2018
The forum will present applications and technologies within the 3D sensing industry, and more specifically consumer-oriented solutions. The full consumer electronics industry is now in motion to adopt 3D sensing as a new user interface - even though many questions are still unanswered about which is the best technology. More information HERE.


Executive Forum on Infrared Imaging Forum - Sept. 7 AM, 2018
The forum will present applications and technologies within the infrared imaging industry. The future for uncooled IR imagers is bright, with large potential areas of expansion such as automotive night vision, industry, consumer electronics and defense. More information HERE.


Early bird registration open
Register orange 3D Sensing Forum 2018Each of the Yole Développement & CIOE's forums will bring together a worldclass panel of manufacturers, integrators and users experts and allow participants to get valuable insights into the status and future of the different industries covered as well as provide unprecedented opportunities for meeting with industry leaders. Discounted rates available if you register to more than 1 forum:

o 1 forum: 155€ Early Bird - 195€ Standard Rate
o 2 forums: 225€ Early Bird - 265€ Standard Rate
o 3 forums: 335€ Early Bird - 395€ Standard Rate
o 4 forums: 450€ Early Bird - 525€ Standard Rate

Benefit from our Early Bird Registration rate registering before August 4 here.


Sponsorship opportunities available
Take advantage of creating and enhancing your brand awareness to an audience which could form your next client base. Generating direct new business opportunities from keen delegates who have significant budgets to utilize. You have the possibility to sponsor several forums.

Discover our sponsorship offers now.


Please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question or application.

 

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12:45 PM – 1:20 PM: Registration: badge collection

1:20 PM – 1:30 PM: Welcome and Introduction
Yole Développement and CIOE

1:30 PM – 5:40 PM: Forum
1:30 – 2:00 – Opening presentation: Yole Développement

Photo AmandinePizzagalli YOLE 2018

Amandine Pizzagalli, Technology & Market Analyst, Equipment & Materials - Semiconductor Manufacturing, Semiconductor & Software division
Amandine Pizzagalli is a Technology & Market Analyst, Equipment & Materials - Semiconductor Manufacturing, at Yole Développement (Yole). Amandine is part of the development of the Semiconductor & Software division of Yole with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes.
Previously, Amandine worked as Process engineer on CVD and ALD processes for semiconductor applications at Air Liquide. Amandine was based in Japan during one year to manage these projects.
Amandine graduated from CPE Lyon (France), with a technical expertise in Semiconductor & Nano-Electronics and has a master focused on Semiconductor Manufacturing Technology, from KTH Royal Institute of Technology (Sweden).
She has spoken in numerous international conferences and has authored or co-authored more than 10 papers.

 

The microelectronic industry, including semiconductor devices and PCB processing, is continuously driven by the further miniaturization of consumer devices like smartphones, tablets, wearable technologies, personal computers, mobile computing devices, video game systems, and high-definition televisions.
Over the last several years, the laser industry has found new opportunities and garnered significant interest in the semiconductor field by providing greater flexibility in terms of processing diverse materials, high-speed processing, greater reliability, and improved production yield

Various laser technologies have started integrating into major semiconductor processes, including laser cutting, drilling, welding, marking, patterning, marking (driven by motherboards), HDI PCBs, and IC packaging applications.
Choosing the most suitable laser processing type strongly depends on the material to be processed, the related processing parameters, and the manufacturing process steps
The presentation will review the different type of laser that could be applied for semiconductor processing steps including via cutting, drilling,, patterning, annealing...and which one is the most suitable solution. We will also present an overview of the key laser equipment and laser source suppliers involved in the field of semiconductor segmented by application.


2:00 – 2:25 – Fs (Femtosecond) Laser as Unique Tool in Semiconductor Manufacturing

Quentin MOCAER Amplitude

Quentin Mocaer, Segment Line Manager- Semiconductor, ALG (Amplitude Laser Group)

Femtosecond lasers are now broadly used in industry such as Display or Consumer Electronics, while they are just emerging in the semicon field. From full-wafer dicing and low-k material removal, to Through Glass Via drilling and wafer metrology, industrial femtosecond lasers are opening great opportunities while catching up with the industry demanding throughputs.

 

 
2:25 – 2:50 – Advanced Laser Processes in Mobile Devices

direk muller coherent

Dirk Müller, Director of Strategic Marketing, Coherent

Despite the fact that the number of mobile devices sold every year seems to have stabilized, the number of laser-based processes in this field seem to grow rapidly as lasers are playing an increasing role in more-and-more manufacturing steps flowing into mobile devices. The display technology is progressing at breathtaking speed and we are becoming used to stunning picture quality of mobile devices. Flexible OLED displays have created a big wave in the market and several emerging display technologies are on the horizon that will bring e.g. ultimate power efficiency, highest ppi for AR/VR, or super-large high-resolution cinema.

Today’s high resolution and brilliant displays would not be possible without lasers. Laser processing plays a vital role in display manufacturing in order to make the “perfect cut”, for patterning, LTPS- Annealing (ELA), Laser Lift-Off (LLO) and Laser Induced Forward Transfer (LIFT) to name just a few. Similarly, inside mobile devices a variety of components, such as sensors, logic, memory and batteries, benefit from a laser’s ability to impinge energy of a very controlled dosage with micron precision. Advanced packaging of ICs are increasingly benefitting from laser processes that help interconnect devices as well as shrink their size. We will demonstrate how lasers enable the most advanced flexible OLED displays and where lasers are poised to play a role in future display concepts.

In addition we will give an update on the most advanced packaging processes such as micro-via drilling, redistribution layer structuring and wafer dicing. When spanning the gamut between displays and IC packaging, similarities as well as differences between these seemingly unrelated technology segments are highlighted.


2:50 – 3:15 – The laser – A versatile tool for smart manufacturing

Koitzsch TRUMPF

Dr. Matthias Koitzsch, Director Technical Sales Support, TRUMPF

This presentation elaborates the role of lasers as smart production tools within the advent of the Industry 4.0 revolution. Core aspects of Industry 4.0 can be described via the horizontal and the vertical approach of industrial production:

  • Horizontal approach: The focus is on the complete value chain forming an efficient process flow from order entry via order management, procurement, production and finally delivery. Main aspects of the horizontal approach are traceability of individual orders, stability and flexibility of the whole production process and high utilization of the production line.
  • Vertical approach: The focus of the vertical approach is on individual production systems, such as laser joining processes. Sensors on process and tool level as well as additional smart services based on process and machine data are taken into consideration resulting in an intelligent integration and networking of production tools. Main aspects of the vertical approach are availability and energy efficiency of production tools, transparency within the pool of equipment and eventually asset management.

We will present why and how the laser as a versatile production tool perfectly fits for Industry 4.0 applications. Latest developments will be highlighted that even further improve the laser as the tool of choice for smart manufacturing, such as condition based services and intelligent process sensor systems. We will also discuss main fields of applications the laser is currently being used in industrial production, such as e-mobility applications and 3D metal printing.


3:15 PM – 4:00 PM: Coffee Break and Networking

4:00 – 4:25 – Laser Based Micro Fabrication Systems for Electronics Packaging

Haibin Zhang ESI

Dr. Haibin Zhang, Director of Strategic Marketing, Electro Scientific Industries, Inc.

As devices and packages shrink in size, advanced packaging has become a critical avenue in semiconductor and consumer electronics manufacturing industry. Laser based micro-fabrication systems provide benefits in quality, speed, cost, and are playing important roles as the feature sizes in packages shrinks at an increasing rate. In this presentation, we will review several laser based key applications in packaging, including via drilling, wafer cutting, patterning. We also discuss the key technologies for high precision laser systems that enables next generation feature minimization with extremely high speed and low overall cost.


4:25 – 4:50 – Laser Applications of Semiconductor Devices

Koichi Shigematsu DISCO

Koichi Shigematsu, Global Technology SolutionsDept., DISCO Corp.

Laser technology is an important technology that bringing science to our comfortable living. General introduction of laser applications for semiconductor market. DISCO’s experience of various devices/materials processing examples.



 

4:50 – 5:15– TBA
TBA

5:15 – 5:40– TBA
TBA

5:40 – 6:00 – Thank you and adjourn
Yole Développement and CIOE


Discover the complete agenda with abstracts: here


REGISTER NOW!

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Our partners 

SEMI LOGO

SEMI
Founded in 1970, Semiconductor Equipment and Materials International (SEMI®) is an international trade association representing more than 2,300 member companies that develop, manufacture and supply the technology, equipment, materials and services used to manufacture semiconductors, photovoltaic, and flat panel displays (FPDs). Currently a more than $100 billion global market, the equipment and materials industry provides critical technologies that enable the development and manufacture of advanced semiconductors and displays that in turn enable the more than $1 trillion global electronics industry. SEMI maintains a presence in every significant semiconductor and FPD manufacturing region in the world, with eleven offices in North America, Europe, Russia, Japan and Asia-Pacific. More info

   

 

Please contact Julie (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question or application. PDF form is available here.

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Why should you sponsor the 1st Executive Forum on LiDAR for Automotive?
 

Sponsoring the Executive Forum on LiDAR for Automotive is a prime opportunity to put your company in front of more than 80 of the key industry players and decision makers of the industry. The forum is the unique single-meeting event in China exclusively dedicated to LiDAR, where you will be able to meet and talk with key players.

  • Increase your organization's visibility before, during and after the forum
  • Enhance relationships with existing customers and generate new leads
  • Promotion to thousands of email subscribers
  • Meet customers and partners from different countries
  • Senior management networking opportunities
  • Get free pass (depending on the selected package)

 

Different levels of opportunities to suit your needs

 

GOLD SPONSORSHIP - COFFEE BREAKS 

  • A 3-minute presentation before the first break
  • 1 free full pass registration
  • Proceedings of all shared presentations
  • Logo on the communication tools (web and print)
  • Company name board placed on each coffee break table
  • 2 posters to be displayed in the coffee breaks room
  • Logo and description of your organization on the Sponsors webpage
  • Corporate leaflets or giveaways inserted in the attendees' bag
  • Opportunity to distribute brochures at the Sponsors Corner

4500 exclu sponsor vert

 

ATTENDEES BAG SPONSORSHIP

  • 1 free full pass registration
  • Proceedings of all shared presentations
  • Your attendees bag to be distributed to each delegate (bags provided by the sponsor)
  • Logo and description of your organization on the Sponsors webpage
  • Opportunity to distribute brochures at the Sponsors Corner

2500 exclu sponsor vert

 

BADGE SPONSORSHIP

  • 1 free full pass registration
  • Proceedings of all shared presentations
  • Logo on the attendee badge
  • Logo and description of your organization on the Sponsors webpage
  • Opportunity to distribute brochures at the Sponsors Corner

1500 exclu sponsor vert

 

GIVEAWAYS & BROCHURES SPONSORSHIP

  • 1 free full pass registration
  • Proceedings of all shared presentations
  • Giveaways or brochures inserted in the attendees bag (items provided by the sponsor)
  • Logo and description of your organization on the Sponsors webpage
  • Opportunity to distribute brochures at the Sponsors Corner

1500 nonexclu sponsor vert

 

ADVERTISMENT SPONSORSHIP

  • 1 full page ad in the Conference Guide created for the 4 different forums Yole Développement and CIOE organized
  • Giveaways or brochures inserted in the attendees bag (items provided by the sponsor)
  • Conference guides distributed during CIOE show 2018

2800 nonexclu sponsor vert

 


Please contact Julie (This email address is being protected from spambots. You need JavaScript enabled to view it.) for any question or application. PDF form is available here.

 

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Upcoming events


> Flash Memory Summit 2018
(August 7 - August 9, Santa Clara, USA)

> Hot Chips 2018
(August 19 - August 21, Cupertino, California, USA)

> IMID 2018
(August 28 - August 31, Busan, Korea)

Webcast

No events