Yole Group of Companies had the opportunity to participate at the 3D Systems Summit organized by Semi in Dresden, Germany on January 30, 2019.
From 3D technologies to Heterogeneous Integration and High-Density Systems for different applications
The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors.
Thibault Buisson, COO at Yole Développement held a presentation on ‘Trends in Automotive Pakaging‘, and Romain Fraux, CEO at System Plus Consulting held a presentation on ‘From 2.5D/3D to SiP and FO-WLP: overview of the latest advanced packaging platforms on the market’.