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Through-silicon via (TSV) technology has been forecasted to impact the memory and logic industry for years. Die partitioning was developed to optimize technology nodes and improve device yields for high performance technology. Super high memory density to satisfy the need for high bandwidth data transfer between memory and logic devices was also a key driver. TSVs’ role became noticeable a few years ago with the launch of the hybrid memory cube (HMC) interface and high bandwidth memory (HBM), however they only entered small volume production.

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Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices and CMOS image sensors. EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has achieved an industry milestone with more than 1100 EVG wafer bonding chambers installed at customer facilities worldwide to date.

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An article from Jim Edwards for Business Insider - Shares in  Dialog Semiconductor stock plunged last week after a note from Karsten Iltgen, an analyst at Bankhaus Lampe, which said, "There is strong evidence that Apple is developing its own power-management integrated circuits and intends to replace the chip made by Dialog at least in part." The stock dropped 35% at one point. Dialog is based in Reading, England.

A number of other companies' stocks declined too, as investors began to realise that  Apple has the ability to "insource" aspects of its manufacturing previously done elsewhere.

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With the apparition of 4G and complexification leading to increasing demand for filters, RF is restructuring the MEMS industry. A new MEMS player has entered the Top 3: with US$910 million in 2016, the US-based company Broadcom, acquired by Avago Technologies in May 2015, has shifted from #4 in 2015 to #2 in 2016 with its MEMS filter activities.
Yole Développement, part of the Yole Group, today released its annual MEMS manufacturer ranking. This analysis is based on 2016 revenues and is part of Yole’s MEMS & Sensors annual report, Status of the MEMS Industry.

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The power packaging materials is today the main part of the power module cost. Therefore, in 2016 almost 40% of the total cost is due to the cost of materials for packaging. “To understand the evolution of the power packaging market, it is now essential to look in details the selected materials and design and evaluate each innovation”, comments Mattin Grao Txapartegi, Technology & Market Analyst, Power Electronics at Yole Développement (Yole), part of Yole Group of Companies (1) .

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The Firefly System with Clearfind Technology helps manufacturers find defects earlier in the process – improving reliability of devices. Rudolph Technologies announced that two of the industry’s suppliers of advanced packaging services have purchased multiple Firefly Inspection Systems. The Firefly System, with Rudolph’s patented Clearfind Technology, can detect defects that are almost impossible to find using conventional imaging techniques – helping to significantly reduce yield-robbing failures in both the front- and back-end of the semiconductor manufacturing process.

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