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Advanced Packaging

One of the world’s largest outsourced assembly and test providers names AP300E™ their preferred lithography system due to Veeco’s industry-leading uptime and process performance - Veeco Instruments announced that one of the world’s largest outsourced assembly and test (OSAT) providers has purchased multiple Veeco AP300E lithography systems.

Complementing the OSAT’s previously installed Veeco tools, the AP300E was selected based on its superior uptime, lower total cost of ownership (CoO) and exceptional performance. This purchase is illustrative of continued strong market demand for Veeco’s expanding portfolio of lithography systems, given the tools’ ability to handle next-generation advanced packaging process needs including copper (Cu) pillar, wafer-level packaging (WLP), fan-out WLP (FOWLP) and 3D integrated circuit developments.

The AP300E lithography stepper’s exceptional overlay, resolution, sidewall profile performance and broadband flexibility enable highly automated, cost-effective manufacturing valued by foundries and OSATs for applications such as fan-in WLP, FOWLP, through-silicon via, silicon interposer solder and Cu pillar bumping. Given the exponential market growth expected in mobile, IoT and artificial intelligence (AI) applications, OSATs seek to ensure they are competitively positioned to drive customer acquisition and retention. According to Yole Développement, the equipment and materials market for FOWLP alone will expand at a compound annual growth rate (CAGR) of 43 percent to reach $694 million by 2021.

“Increased mobility, IoT, AI and deep learning are seeing explosive growth in step with global megatrends, all of which are enabled by technologies like 3D integration and advanced packaging,” noted Peter Porshnev, Ph.D., senior vice president and general manager of Veeco’s Ultratech business unit.As we grow our customer base, Veeco’s experienced team of technologists continues to work closely with OSATs and foundries to deliver industry-leading innovations that directly address their performance, yield and CoO challenges.”

Source: www.veeco.com 

 

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