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Last week the whole microelectronic community was in Munich. Therefore, impressive was the key word to describe the trade show, ELECTRONICA / SEMICON EUROPA this year. With 18 halls, numerous conferences and qualified audience including 73,451 trade visitors and 2,912 exhibitors, the show was the place to be in Europe. The whole microelectronic supply chain attended the show: from materials suppliers to devices markers, including equipment manufacturers, design houses, foundries and more, all players were there to meet their customers and partners. Number of business meetings taking place in Munich last week is probably remarkable and also confidential. 

This year again, Yole Group of Companies including System Plus Consulting and Yole Développement was strongly involved in ELECTRONICA / SEMICON EUROPA. The analysts attended the show to meet the experts of the electronic industry, share their vision of the latest technical innovations and understand the market evolution.

In addition of two booths, one in the SEMICON EUROPA hall and one at ELECTRONICA, Yole Group proposed a relevant program of presentations. Semiconductor manufacturing, RF electronics, batteries, power electronics & compound semiconductors, MEMS & sensors... the analysts covered a wide landscape to highlight the latest technical and market trends and point out the competititve landscape.

Who is doing what? What are the latest innovations? What is the status of this market? ... Presentations are now available on i-micronews.com. Please click on the title to download each presentation: 

Feel free to contact us for any questions. Contact: Sandrine Leroy (This email address is being protected from spambots. You need JavaScript enabled to view it.)

Photo: Images extracted from presentations - System Plus Consulting & Yole Développement's team.

Sources: www.yole.fr - www.systemplus.fr 

 

 

Upcoming Events


> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)