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Advanced Packaging

According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like AI , 5G, and AR/VR are creating huge business opportunities. Therefore, the megatrends are directly contributing to the growth of advanced packaging industry, showing an impressive 7% CAGR to reach US$39 billion in 2023 (1). Today, megatrend applications are fueling the next generation of advanced packaging platforms including high-density FOWLP, 3D stacked TSV memory, WLCSP, and flip-chip…

In its new report, Polymeric Materials for Advanced Packaging at the Wafer Level, Yole presents 2017 – 2023 market figures and dynamics of the market, per packaging platforms integrating polymeric materials. It includes a comprehensive analysis of the existing polymeric materials used for each advanced packaging process step, along with their status. Also presented is the maturity level of each polymeric material, by advanced packaging function and a detailed technology roadmap.

The Semiconductor & Software team from Yole offers you today a deep analysis of the massive adoption of polymeric materials by the advanced packaging industry... Full article

(1) Status of the Advanced Packaging Industry report, Yole Développement, 2018




Upcoming Events

> 3D Systems Summit
(January 28 - January 30, Dresden, Germany)

> TestConX 2019
(March 3 - March 6, Mesa, Arizona, USA)

> 15th International Conference and Exhibition on DEVICE PACKAGING
(March 4 - March 7, Fountain Hills, Arizona USA)