Advanced packaging: OSATs, foundries, and IDMs all want to be part of the game

“ Once the traditional, exclusive domain of OSATs and IDMs today a paradigm shift is occurring in the assembly / packaging segment of the semiconductor manufacturing supply chain”, asserts Santosh Kumar, Principal Analyst and Director Packaging, Assembly & Substrates, Yole Korea, part of Yole Développement (Yole). “Players from different business models, including foundries, substrate/PCB suppliers, EMS/ODMs, are entering this market and cannibalizing OSATs’ share.”

Without doubt, advanced packaging is today moving from a package substrate platform to silicon, a significant shift that is providing huge opportunities for giants like TSMC, Intel, and Samsung. These leading players can now flex their muscles in the advanced packaging market segment and emerge as key innovators of new advanced packaging technology.

In this dynamic and attractive context, Yole presents today its annual advanced packaging report, Status of the Advanced Packaging Industry. Compiled by the advanced packaging team at Yole, this analysis follows the evolution of the industry and offers an understanding of the market and key strategies of the leading advanced packaging companies. This report presents updated forecasts of the semiconductor and the advanced packaging markets. It also points out the impact of COVID-19 on all market figures. In addition, the advanced packaging study highlights the US-China trade war and the related changes within the semiconductor business and supply chain.

In this 2020 edition of the report, Yole’s experts offer an impressive financial analysis of the top 25 OSATs. They combine different parameters to analyze the market positionings and strategies of each of the leading companies, including revenue, YoY growth, R&D, CapEx, gross profit, gross margin, net income, etc.… They also consider mergers and acquisitions and deliver possible scenarios for their evolution. The market research and strategy consulting company Yole presents today one of its most strategic reports.

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In addition to a huge collection of advanced packaging reports and a dedicated quarterly market monitor, the company is covering the advanced packaging industry with its annual advanced packaging conference taking place in Wuxi, China on September 15: SYNAPS. After a successful edition with more than 140 attendees in 2019, Yole and its partner NCAP China, offer this year again an attractive program with leading advanced packaging companies, including Besi, Camtek, Corning, Evatec, HiSilicon, JCET, SPTS Technologies, Tianshui Huatian Electronic, Xiamen Sky Semi., XMC… And strategic topics including glass substrate, fan-out, high-performance applications… For one day, this both digital & onsite event will cover the overall advanced packaging industry. Be sure to be part of it and register today!

What is the status of the semiconductor industry? How has  the advanced packaging industry evolved since last year? What are today’s key market drivers? Who are the advanced packaging players to watch, and what innovative platforms are they working on? What are the economic and technological challenges, after the COVID-19 outbreak? What is the ranking of the top OSATs: who are the winners? …Yole presents today a comprehensive overview of the advanced packaging industry… Full story

Source: http://www.yole.fr

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