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AMD World’s First HBM-Powered Product SK Hynix 3D TSV High-Bandwidth Memory

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AMD HBM flyer AMD Radeon R9 Fury X High Bandwidth Memory, the first ever 3D IC combining DRAM & GPU with TSV & Silicon Interposer Packaging

Yole Développement is pleased to release a complete report on the world’s first HBM integrated on chip featured in the latest AMD graphic card Radeon™ R9 Fury X performed by our partner System Plus Consulting.

Led by AMD and SK Hynix, this 3D & 2.5D component integrates HBM memories (DRAM dies & Logic dies connected with via-middle TSV and micro-bumps) and GPU stacked onto a silicon interposer (including also via-middle TSV).

The HBM delivers 60% more memory bandwidth, 3x the performance per watt and consumes 94% less PCB area than GDDR5.


AMD HBM img5

The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding process and equipment (wafer bonding, via etching, via filling, bumping, underfill…) and materials.

Also, the complete manufacturing supply chain has been identified (GPU foundry, Interposer foundry, HBM Foundry, PCB substrate manufacturer, OSAT product integrator) in order to provide a detailed description of the manufacturing process with manufacturing cost calculation.

 AMD HBM img6

The report also features a comparison with Samsung 3D TSV DRAM stacking process in order to understand the different technology choices made by the different players.


  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation

Table of contents

Overview / Introduction


Physical Analysis

  • Physical Analysis Methodology
  • AMD Graphic Card Teardown

> Graphic Card Opening


  • Package

> View, Dimensions & Marking
> Dies Size


  • DRAM Die

> View, Dimensions & Marking
> µBumps & TSVs


  • Logic Die

> View, Dimensions & Marking
> µBumps & TSVs


  • Cross-Section

> Package Cross-Section
> PCB & Frame Cross-Section
> Interposer Cross-Section
> GPU µBumps Cross-Section
> HBM Stack Cross-Section (Side Mold, µBumps, Underfill, TSV)
> Comparison with Samsung 3D TSV DRAM stacking process

Manufacturing Process Flow


  • Global Overview
  • GPU Process Description & Foundry
  • Interposer Process Flow & Foundry
  • HBM Stack Process Flow (TSV & TCB) & Foundry
  • Flip-Chip & Stacking Process Flow & Assembly Unit


Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • GPU Front-End & Die Cost
  • Interposer Wafer & Die Cost
  • DRAM Front-End Cost
  • TSV Manufacturing Cost
  • TSV Manufacturing Cost per Process Steps
  • Micro-Bumping Manufacturing Cost
  • Micro-Bumping Cost per Process Steps
  • DRAM Die Cost
  • Logic Die Cost
  • HBM Stack Cost
  • Final Assembly Manufacturing Cost
  • Final Component Cost


System Plus Consulting

Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.