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Apple iPhone 6s Plus Teardown & Physical Analyses of Key Components

3 490 €

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murata flyerDiscover and understand Apple’s technical choices and main suppliers

The Apple iPhone 6s Plus holds many IC components which are listed and reviewed in the report. All these ICs (more than 60 references) have been opened in order to measure the real silicon area consumption. A special focus has been made to highlight the component structure and understand the manufacturing process on “noteworthy” components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging. True innovations have been observed in the sensors components like a new process for the MEMS microphone improving the SNR or a 3D packaging with TSV in the fingerprint sensor and many more.

Also a technological comparison with the Samsung Galaxy S6 has been made in order to understand choices made by both smartphone makers.


iphone6s review img1


Key inspected components:

  • MEMS/Sensors components
      - Fingerprint sensor – new generation: new packaging, new processes (includes TSV)
      - eCompass – new supplier, custom product which has never been used in a
  • iphone6s review img2 smartphone
      - Microphone – new process improving the SNR
      - 6-Axis IMU – new reference, custom design
      - Ambient light sensor – new reference, wafer-level package
  • Imaging components
      - Front and rear camera modules
      - Flash LED – flip-chip integration
  • Packaging components
      - Apple A9 Processor – advanced Package-on-Package (PoP) structure
      - Qualcomm Snapdragon – multi-chip, smallest pitch on the board
      - Dialog Power management – largest ball count WLP (380-ball)
  • RF component
    - Wi-Fi & Bluetooth combo module
    - Power Amplifier Module

Table of contents

Executive Summary

Reverse Technology Methodology

Apple iPhone 6s Plus Teardown

Electronic Board

  • High Resolution Pictures
  • ICs Identification

> ICs Identification (mfr., ref., fcn., pkg. type, size & pin count)
> ICs Silicon Area
> Repartition by package type 
> Mfr. Design wins ranking 
> ICs Package footprint & Silicon Area ranking

  • PCB Characteristics

> PCB Cross-Section
> PCB min. line width



Advanced Packaging

  • Apple A9 PoP

> Package views & dimensions
> Package Cross-Section
> Package Opening & dies measurement

  • Qualcomm Snapdragon

> Package views & dimensions
> Package Cross-Section
> Package Opening & dies measurement

  • Dialog WLP Power Management

> Package views & dimensions
> Package Cross-Section




  •  Fingerprint Sensor

> Button Assembly View
> Fingerprint sensor views & dimensions
> Cross-Section Sensor die measurement

  • 3-Axis eCompass

> Package views & dimensions 
Package Opening & Die measurement
> Package Cross-Section 

  • Microphone

> Package views & dimensions 
Package Opening & Die measurement
> Package Cross-Section 

  • 6 Axis IMU

> Package views & dimensions 
> Package Opening & Die measurement
> Cross-Section
> MEMS Opening & sensor details

  • Ambient Light Sensor

> Package views & dimensions 
> Package Opening & Die measurement
> Package Cross-Section 



RF Devices

  • 5G Wi-Fi & Bluetooth Combo Chip

> Package views & dimensions 
> Package Opening & Dies measurement
> Package Cross-Section 

  • Power Amplifier Module

> Package views & dimensions 
> Package Opening & Dies measurement
> Package Cross-Section 



Camera Modules & Flash LED

  •  12Mp Rear Camera Module

> Module views & dimensions 
> Module Opening & CIS die measurement 
> Module Cross-Section

  • 5Mp Front Camera Module

> Module views & dimensions 
> Module Opening & CIS die measurement 
> Module Cross-Section

  • Flash LED

> Package views & dimensions Package 
> O
pening & LED die measurement
> Package Cross-Section 



Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click  here .


  • Smartphone Teardown

  • ICs identification (manufacturer, reference, function, package type, size, pitch & pin count)

  • ICs Silicon Area (dies size)

  • PCB Characteristics (cross-section, min. line width)

  • Physical Analyses (decap-sulation, cross-section, optical & SEM pictures, measurement)