Discover Apple’s key devices, advanced packaging technical choices and main suppliers.
Through a teardown of the Apple iPhone X, this report details more than 50 integrated circuit (IC) devices from the main boards.
It will help you to identify the manufacturer, packaging, including the size, type, and pitch, and function of the iPhone X’s main ICs. A physical analysis of the main substrates highlights internal structures and technologies used for the printed circuit boards (PCBs).
The report includes teardown photos, detailed package identification and descriptions and is supplied with an Excel file summarizing the iPhone X’s chipset and breakdowns by supplier, package or footprint.
Overview / Introduction
> Views and dimensions of the iphone X
> Iphone X teardown
> Electronic board high definition photos
> Main component markings and package type, dimensions, pitch, pin count and identification
> PCB surface, cross section and minimum line width
> IC package breakdown
> IC manufacturer design wins
> IC package footprint
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.
Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.
System Plus Consulting engineers are experts in:
Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.
System Plus Consulting is a sister company of Yole Développement.
More info at www.systemplus.fr
IC identification including markings, manufacturer, reference, function, package type, size and pin count
PCB characteristics including cross-section and minimum line width
Component supplier, package and footprint breakdown graphs