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AT&S ECP® Embedded Power Die Package GaN Systems GaNpx Top Cooled
Oct.2015

gs66508t__image2
2 490 €

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Description

Icone ATS Power ECP Top Cooled Package Flyer.pdf Adobe Acrobat Standard

Latest GS66508T power transistor of GaN Systems packaged with a top-side cooling.

GaN Systems offers for GS66508T (650V, 30A) a top-side cooling using AT&S ECP® embedded die packaging process. Compared to the bottom-side cooling approach, this new power packaging process allows to reduce the package footprint by 60% for a cost 40% cheaper!

The GS66508T is packaged is an innovative embedded die package developed by AT&S (ECP® process). This package has no wire bonding to reduce the inductance and a design to increase the heat management using the two sides of the die.

The new position of the die in the package allows to enhance the thermal dissipation. Moreover a simplification of the process reduces the time and the cost of manufacturing.

 

GS66508T image

The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding process, equipment and materials.

The report also features a comparison with GaNpx bottom-side cooled packaging and with AT&S first generation ECP® process in order to understand the different technology choices made.

The GaN-on-Silicon die analysis is not included, but is available in the previous GaN Systems published report: GS66508P(bottom-side cooled).

ANALYSIS PERFORMED WITH OUR COSTING TOOLS 3D PACKAGE COSIM+ 

SC Analysis Performed

 

 

 

 

Table of contents

Overview / Introduction


GS66508T Characteristics


Physical Analysis


Physical Analysis Methodology
Package
  • Views & Dimensions
  • Marking
  • Top-Side Delayering
  • Bottom-Side Delayering

Package Cross-Section

  • Overview
  • Through-Vias Cross-Section
  • Micro-Vias Cross-Section
  • EDX Material Analysis

Die

  • Redistribution Cross-Section
  • Die Views & Dimensions

GaNpx – ECP® technology
Adaptation of AT&S ECP® package for high voltage power
Comparison with GaNpx Bottom-Side Cooling

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


Global Overview
GaNpx Packaging Fabrication Unit
GaNpx Packaging Process Flow

 

Cost Analysis


Main steps of economic analysis
GaNpx package

  • Yields Hypotheses
  • ECP Panel Efficiency
  • GaNpx package Cost
  • GaNpx package Cost per process steps

GS66508T Component

  • GS66508T Final Test Cost
  • GS66508T Component Cost

Price estimation


Cost Comparison with bottom-side cooling

 

System Plus Consulting


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.

 

 

 

 

 


COMPLETE TEARDOWN WITH

  •  Detailed Photos
  •  Precise Measurements
  •  Material Analysis
  •  Manufacturing Process Flow
  •  Manufacturing Cost Analysis
  •  Selling Price Estimation
  •  Comparison with bottom cooled and ECP® first generation