Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago
After a first introduction of Avago’s power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago’s LTE Mid Band Front-End Module in the iPhone 6s series.
With the acquisition of Broadcom (Apple’s Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.
Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.
The filters are hermetically wafer-level packaged with Avago’s Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
TSVs are etched in the cap two times in order to report electrical contacts. Also specific milling steps in FBAR fabrication give control of the AlN thickness.
Thanks to its design and manufacturing process, Avago device is very accurate and cost effective in respect to competitors.
The report includes comparisons with the BAW filter from Qorvo, also found in the Apple iPhone 6s Plus and the evolution of Avago’s BAW filters since 2013.
Overview / Introduction
Company profile & Supply Chain
> Physical Analysis Methodology> Front-End Module disassembly - Front-End Module Removal - Front-End Module assembly view> Front-End Module assembly - Front-End Module Views - Front-End Module Cross-Section> Front-End Module Die - Active device Die View & Dimensions - Power Amplifier Cross-section - SPDT switch Cross-Section> BAW filter Die - BAW filter Die View & Dimensions - BAW filter Die Opening - BAW filter Die packaging cross-section - BAW filter Die Copper Pillar & Cavity - BAW filter Die Cross-section - BAW filter Die membrane
Manufacturing Process Flow
> Front-End Module Die Front-End Process> Component Packaging Process > Fabrication unit> MEMS wafer process flow - SMR process Flow - Air cavity & Copper Pillar process flow> Final Test & Packaging> Synthesis of the main parts
> SMR-BAW Filter Wafer Front-End Cost> SMR-BAW Filter Wafer Front-End Cost per process> SMR-BAW Filter Front-End Probe Test, Thinning & Dicing Cost> SMR-BAW filter Die Cost> Estimated Manufacturer Price
Technology and Cost comparison with Avago’s BAW filter
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Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation
Comparison with Qorvo’s SMR BAW filter