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Bosch LRR4 77GHz Long Range Radar Sensor

2 990 €

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Bosch LLR4 RF flyer

The fourth generation of Bosch long range radar sensor sets new standards for a more elegant, compact and cost effective module

The LLR4 is a monostatic multimodal radar in a very compact and elegant housing and uses, like its predecessors, the 77 gigahertz (GHz) frequency band. The main innovation in this fourth generation is the number of radar beams used, with six fixed radar antennas instead of four for the third generation. The LRR4 can detect other vehicles at a distance of roughly 250 meters. It enables Adaptive Cruise Control (ACC) at speeds of more than 160km/h, which can make up for large differences in speed without any intervention by the driver. The radar is equipped with a heated lens which ensures full sensor availability, even in poor weather conditions, such as snow and ice.

The system integrates two electronic boards, including NXP Semiconductor and STMicroelectronics microcontrollers and Bosch power management ICs. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.

Infineon 77GHz SiGe Monolithic Microwave Integrated Circuits (MMICs) are used as high-frequency transmitter and receiver. The two RF dies are packaged in the latest version of the eWLB Fan-Out Wafer Level Package developed and manufactured by Infineon.
Based on a complete teardown analysis of the Bosch radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor as well as a comparison with Continental’s ARS4-A and Bosch’s MRR1Plus modules.

A complete physical analysis and manufacturing cost estimation of the Infineon MMICs is available in a separate report.


Bosch LLR4 Radar Global View System Plus Consulting 2017      Bosch LLR4 MCU board global view System Plus Consulting 2017




























Table of contents

Overview / Introduction

> Executive Summary
> Company Profile
> Reverse Costing Methodology



Physical Analysis

> Global view of the Radar
> Views and Dimensions of the Radar
> Radar Opening

> Radar Dome Opening
> Electronic Boards
> MCU Board
> Overview
> High Definition Photo
> Component Markings and Identification
> RF Board
> Overview
> High Definition Photo
> Component Markings and Identification
> RF Chipset Analysis
> Comparison with Continental ARS4-A and Bosch MMR1































Cost Analysis

> PCB Cost
> RF Board Cross Section and EDX Analysis
> Estimation of the Cost of the NXP Semiconductor MCU
> BOM Cost – MCU Board
> BOM Cost - RF Board
> BOM Cost - Housing
> Material Cost Breakdown
> Accessing the Added Value (AV) Cost
> MCU Board Manufacturing Flow
> RF Board Manufacturing Flow
> Details of the Housing Assembly and Functional Test Costs
> Added Value Cost Breakdown
> Manufacturing Cost Breakdown




Estimated Price Analysis

> Estimation of the Manufacturing Price




















About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.


Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.


System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.


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  • Detailed photos

  • Material analysis

  • MMIC die views and RF chipset analysis

  • Comparison with Continental ARS4-A and Bosch MRR1Plus

  • PCB cross-sections

  • MCU physical analysis and cost estimate

  • Complete and priced bill-of-materials

  • Manufacturing process flow

  • Manufacturing cost analysis

  • Estimated cost and sales price