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GaN Systems 650V GaN on Silicon HEMT AT&S ECP® Embedded Power Die Package
Jan.2015

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2 990 €

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Description

gan hemt flyerFor the first time high voltage GaN transistor (650V) embedded in optimize thin package from AT&S

The combination of GaN Systems high voltage HEMT and AT&S ECP Embedded die package is enabling optimized heat management, package thickness and high power performance at high frequency.

The GS66508P from GaN Systems is a GaN on Silicon HEMT transistor packaged in a new GaNpx Embedded Die package. It features a high-voltage breakdown voltage of 650V for a current of 30A (25°C), with lower switching losses. The transistor is optimized for AC-DC converters and high frequency, high efficiency power conversion.
The GS66508P is packaged is an innovative embedded die package developed by AT&S (ECP process). This package has no wire bonding to reduce the inductance and a design to increase the heat management using the two sides of the die.

The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layers structure is used to reduce the stress and the dislocation. This is completed by a thick superlattice structure clearly visible in the TEM analysis.

This full reverse costing analysis has been conducted to provide insight on technology data, manufacturing cost and selling price of the GaN Systems transistor and the Embedded Die Package of AT&S.

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COMPLETE TEARDOWN WITH:

  • Detailed photos and identification
  • TEM analysis of the epitaxy layers
  • Embedded power die packaging from AT&S
  • Analysis of the adaptation AT&S ECP package for high voltage power
  • Manufacturing process flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation
 

Table of contents

Overview / Introduction

Companies Profile


Physical Analysis


> Physical Analysis Methodology

GaNpx Package (AT&S ECP®)
  • Package Views & Dimensions
  • X-Ray
  • Package Cross-Section
  • ECP Process Characteristics
  • Adaptation of AT&S ECP embedded die package for high power devices

Redistribution

GaN Transistor Analysis
  • Guard Ring
  • Metal Layers
  • Source and Gate
  • Source Cross-Section
  • Substrate and Epitaxy Layers
  • TEM Cross-Section
  • GaN Transistor Characteristics
Manufacturing Process Flow

> Global Overview
> GaN Transistor Process Flow
> Package Process Flow

Cost Analysis


> Main steps of economic analysis
> Yields Hypotheses
> GaN Transistor Front-End Cost Analysis
  • Epitaxy Cost
  • Wafer Cost
  • Cost per process steps
  • Equipment Cost per Family
  • Material Cost per Family
  • Probe Test Cost
> Redistribution & Dicing Cost
> GaN Transistor Die Cost
> GaNpx Package Cost Analysis
  • ECP® Panel Efficiency
  • ECP® Panel Cost
> GS66508P Final Test Cost
> GS66508P Component Cost

Price Estimation

 


SYSTEM PLUS CONSULTING


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.