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Infineon CooliR²Die™ Power Module

3 290 €

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Infineon coolIR IGBT flyer

Infineon power module integrating an IGBT and diode into innovative packaging for electric vehicles. The innovative packaging shrinks the power module and enables better thermal dissipation

The CooliR²Die™ innovative power module from Infineon is an IGBT module for automotive applications integrated into different vehicles and based on the second generaon Chevrolet Volt Traction Power Inverter Module (TPIM).

The module integrates the latest packaging from International Rectifier, which is now part of Infineon, developed in the Delphi Viper project. Power module size and thermal dissipation are optimized thanks to the use of innovative materials including aluminum nitride (AlN) layers, directed bonded aluminum (DBA), and innovative gels and masks.

Infineon coolIR cross section IGBT power module system plus consulting bd

This package has no wire bonding, reducing the inductance, and no printed circuit board (PCB), which simplifies module assembly. Two DBA layers improve thermal management by allowing heat to flow out of two sides of the die. The new position of the die in the package also enhances thermal dissipation. Integrating a single IGBT and diode on a minimal footprint provides system design flexibility and lower overall cost.

This report analyzes the module structure and packaging of the IGBT and diode dies in detail. Based on a complete teardown analysis, the report also provides an estimation of the production cost of the package, IGBT and diode.

 Infineon coolIR IGBT power module system plus consulting 2













Table of contents

Overview / Introduction



Company profile



Physical Analysis

> Synthesis of the Physical Analysis
> Package Analysis
- View and dimensions
- Cross-section
> IGBT Analysis
- Dimension
> Die process
- Die cross-section
- Diode Analysis
- Dimension
- Die process
- Die cross-section

















































Manufacturing Process Flow

> Overview
> IGBT and Diode Process Flow
> Package Process Flow
> Description of Wafer Fabrication Units


Cost Analysis

> Synthesis of the Cost Analysis
> Main Economic Analysis Steps
> Yield Explanation
> Cost Analysis IGBT
- Wafer cost hypothesis
- IGBT wafer cost
- IGBT probe cost
- IGBT die cost
> Cost Analysis Diode
> Cost Analysis Module


Estimated Manufacturer Price Analysis

> Manufacturers’ ratios

> Estimated manufacturer price


About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems. Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product. System Plus Consulting engineers are experts in Integrated Circuits - Power Devices & Modules - MEMS & Sensors - Photonics – LED - Imaging – Display - Packaging - Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

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  • Detailed photos

  • Precise measurements

  • Material analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price