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Infineon RRN7745P & RTN7735P eWLB Fan-Out Package - 77GHz Radar Dies

2 990 €

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infineon ewlb flyer New Receiver & Transmitter components with a SiGe:C HBT technology from Infineon

The new MRR1Plus 77GHz automotive radar from Bosch integrates receiver and transmitter components from Infineon. These components use the latest SiGe:C HBT technology from Infineon and an effective eWLB / Fan-Out package.

The two RF dies are packaged in the last version of the eWLB, the Fan-Out Wafer level Package developed and manufactured by Infineon. This package has no wire bonding to reduce the inductance and a specific design to increase the heat management using solder balls close to the power RF transistors.
The eWLB package is robust enough to be installed in front automotive module only protected by a plastic lid without underfill. Only a specific pad structure in gold is added on the die.
The RF transistors are newest generation SiGe:C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers.

infineon ewlb img

The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding process, equipment and materials. The SiGe HBT are equally analyzed.
The report also features a short comparison with the first eWLB process in order to understand the evolution of technology choices.



Analysis performed with our costing tools SYSCost

Defining the cost of an electronic system requires an estimation of all component costs, including PCB, housing and connectors, and a simulation of the cost of the assembly and test process at the board and system level.

The costing modules included in SYScost+ answer all these requirements and help costing engineers get accurate calculations.

SYScost+ is flexible in order to be used in multiple applications.


Table of contents

Overview / Introduction

GS66508T Characteristics


Physical Analysis

  • Bosch MRR1Plus Radar
  • Fan-Out Wafer Level Package

> RRN7745P Package

> RTN7735P Package

> Die Bond

> eWLB Cross-Section

> Redistribution Layer

> Comparison eWLB


  • RRN7745P Die

View, Dimensions & Marking

Area Overview




  • RTN7735P Die

Die Cross-Section

Bipolar Cross-Section

SiGe:C HBT Cross-Section

Metal layer Cross-Section




























Manufacturing Process Flow 

Global Overview

SiGe die Process Flows

SiGe die Wafer Fabrication Unit

eWLB Process Flows

eWLB Wafer Fabrication Unit



Cost Analysis

Main steps of economic analysis

Yields Hypotheses

SiGe Wafer Front-End Cost

SiGe die Front-End Cost

eWLB Wafer Front-End Cost

Component Cost 


Price Estimation

Manufacturer Financial Ratios

RRN7745P Estimated Selling Price



Cost Comparison with bottom-side cooling

System Plus Consulting

Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.









  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • eWLB comparison
  • Manufacturing Cost Analysis
  • Selling Price Estimation