World’s first ‘7-Axis’ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others.
This year, with the acquisition of Sensirion’s barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first ‘7-axis’ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package.
Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
The pressure sensor’s MEMS capacitive architecture provides the industry’s lowest noise at the lowest power. Combined with the motion-tracking 6-axis inertial sensor in a small footprint, the device is ideal for a wide range of motion tracking applications.
The inertial MEMS sensor is fabricated with a minimal number of masks and is directly assembled on the application-specific integrated circuit (ASIC) by eutectic bonding.
Using knowledge obtained by acquiring Sensirion’s pressure sensor division, InvenSense was able to design its own pressure sensor. The device is shipped in a 4 mm x 4 mm x 1.37 mm land grid array (LGA) package.
This report includes a detailed technology and cost analysis of the ICM-20789 7-axis motion tracking device. A comparison with the previous generation of combo sensors from InvenSense is also included in the report.
Overview / Introduction
Company Profile and Supply Chain
> Package- Package views and dimensions, opening and cross-section> Pressure Sensor Die - View, dimensions, and marking- Delayering and process- Cross-section> MEMS Die - View, dimensions and marking- Cap removed- Sensing area - Cross-sections of the sensor, cap, and seal> ASIC Die- View, dimensions, and marking- Delayering and process- Cross-section
Manufacturing Process Flow
> ASIC front-end process and wafer fabrication unit> Pressure sensor process flow and wafer fabrication unit> MEMS process flow and wafer fabrication unit> Packaging process flow and assembly unit
> Yield hypotheses> Pressure sensor front-end cost> Pressure sensor back-end 0: probe test and dicing> Pressure sensor front-end cost per process steps> Pressure sensor wafer and die cost> ASIC front-end cost> ASIC back-end 0: probe test and dicing> ASIC wafer and die cost> MEMS front-end cost> MEMS back-end 0: probe test and dicing> MEMS front-end cost per process steps> MEMS wafer and die cost> Back-end: packaging cost> Back-end: packaging cost per process steps> Back-end: final test cost> IMU component cost
Estimated Price Analysis
Comparison with InvenSense IMU MP-67B, Sensor Hub ICM-30360 and iPhone 7 Plus OIS IMU
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Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Estimated sales price
Comparison between InvenSense’s previous custom IMUs in the iPhone 7, in the iPhone 6S and the ICM-30630 device