Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Memory Packaging Market and Technology Report 2017
Oct.2017

yole_memory_packaging_couv
6 490 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 39% on your package – Contact us!
+

 

Description

Note from the publisher: the report will be available November 28, 2017.

Memory packaging market and technology report 2017

Wire bond is still the dominant interconnect for memory packaging, but flip-chip is making inroads into mainstream memory packaging.

THE MEMORY SEMICONDUCTOR BUSINESS IS BOOMING

The memory industry is experiencing a strong growth phase. The total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching ~$135B by 2022 – with DRAM and NAND constituting almost 95% market share. Moreover, a supply-demand mismatch is pushing memory device ASP, resulting in big memory IDMs reaping record profits.

Memory demand is coming from all sectors, particularly from the mobile and computing (mainly servers) markets. On average, DRAM memory capacity per smartphone will rise more than threefold, reaching around 6GB by 2022, while NAND capacity per smartphone will increase more than fivefold, reaching >150GB by 2022. For servers, DRAM capacity per unit will increase to a whopping >0.5TB by 2022 and NAND capacity per SSD for the enterprise market will reach >5TB by 2022. Growth in these markets is fueled by applications such as deep learning, data centers,networking, AR/VR, and autonomous driving.

The automotive market which generally use low density (low-MB) memory will see the adoption of DRAM memory led by emerging trend of autonomous driving and in-vehicle infotainment. Also, the NOR flash memory market is resurgent and expected to grow at an impressive 16% CAGR, attaining ~$4.4B by 2022 due to its application in new areas like AMOLED display, touch display driver ICs, and industrial IoTs.

On the supply side, player consolidation coupled with the difficulty in migrating to advanced nodes due to technical challenges, along with higher investment and migration from 2D to 3D NAND, has caused a shortfall in DRAM and NAND flash supply. DRAM players want to retain high ASP and profitability to justify their huge capex investment for advanced node migration, and as such are not inclined to increase capacity.

This Memory Packaging report details the market trends and roadmaps for different memory devices and furnishes market forecasts, supply chain analyses, player-by-player landscape reviews, and more. Also include is a detailed analysis of the Chinese memory landscape.

Memory packaging report, market and technology report, DRAM NAND capacity demand for Smartphones and servers 

MEMORY DEVICES USE DIVERSE PACKAGING, FROM LEAD-FRAME-BASED TO TSV

There are many different memory device packaging options, implying a wide range of packaging technologies ranging from low pin-count SOP packages to high pin-count TSV options, all depending on product requirements like density, performance, and cost. Yole Développement has identified five core memory device packaging platforms: viz lead frame, wire-bond BGA, flipchip BGA, WLCSP, and TSV. Note though that each one includes many variations, along with different terminology. Ultimately, the total memory package market is expected to grow at a 4.6% CAGR2016-2022, reaching ~$25B by 2022.

In 2016, wire-bond BGA accounted for more than 80% of the packaging market in dollar terms. Also in 2016, flip-chip began making inroads in DRAM memory packaging, and is expected to grow at a ~20% CAGR over the next five years, accounting for >10% of the total memory packaging market. Increased adoption in the DRAM PC/server segment, fueled by high bandwidth requirements, drives flipchip growth. Samsung has already converted >90% of its DRAM packaging line, SK Hynix has also started converting, and other players will begin adopting flipchip in the future. In fact, we believe that all DDR5 memory for PC/servers will eventually use flip-chip.

Memory packaging market technology report, Memory Devices use wide varieties of packages

Spurred on by high bandwidth and memory chips’ low latency demands for high-performance computing in various applications, TSV is being employed in highbandwidth memory devices. The 2016 TSV market was only <1% of the total memory market, but this will grow to a >30% CAGR, reaching ~8% of memory packaging in dollar terms by 2022. Also, WLSCP packaging is used in NOR flash and niche memory devices (EEPROMs/EPROM/ROM) and is expected to grow at a >10% CAGR, but in terms of value will remain only <1% of the market by 2022.

For mobile applications, memory packaging will mostly remain on the wire-bond BGA platform. However, it will soon begin moving towards the multi-chip package (ePoP) for high-end smartphones. NAND flash devices’ main requirement is high storage density at low cost. NAND are stacked using wire bonding in order to provide high density in a single package.

NAND flash packaging will remain in wire bond BGA form and will not migrate to flip-chip. However, Toshiba will start using TSV packaging in NAND devices to increase data transfer rate for highend applications. After Toshiba, we believe Samsung and SKHynix will bring TSV packaged NAND devices to market.

This report details the trends and roadmaps for different memory devices’ packaging, and includes market forecasts, supply chain analyses, players’ landscape, and more.

 

WHILE MEMORY PACKAGING’S VALUE IS HUGE (IN $B), IT’S CONTROLLED BY IDMS

The total 2016 memory packaging market is estimated at ~ $20B. Many OSATs are involved in the memory packaging business, and >80% of packaging (by value) is still done internally by memory IDMs. Majority of these are small OSATs and have low end packaging capability. Global-memory IDMs have considerable experience in packaging, accumulated over years of projects, and have their own sizeable internal capacity.

Memory Package Forecast 2016-2022 revenue

OSATs have limited opportunity to impact IDM packaging activity. However, many Chinese players are entering the memory business with a more than $50B investment committed. Unlike global IDMs, these new players lack experience in memory assembly/packaging and they will outsource most of their packaging activity to OSATs.

This report details the different OSATs involved in memory packaging, and addresses roadmaps, market share, and strategies.

 

OBJECTIVES OF THE REPORT

  • Understand the overall market trends of different memory types and the key applications driving them
  • Know the different types of memory packaging technology, along with market and technology trends
  • Grasp memory packaging’s evolution and roadmap
  • See a market forecast of the different memory packaging technologies for the coming years, along with an estimate of future trends
  • Gain insight into the latest memory packaging landscape’s developments
  • Analyze memory packaging’s supply chain and landscape

 

Table of contents

Report scope and definitions  


> Report scope
> Companies cited in this report
> Glossary

 

Executive summary      


 

Memory packaging technologies and classification


 

Memory packaging evolution and roadmap


 

Memory packaging supply chain


 

Status of memory industry 


> What’s happening in memory business?
> Revenue forecasts and market share
> Supply chain

 

Key applications driving memory market 


 

Focus on DRAM packaging 


> DRAM technology evolution & roadmap
> Packaging evolution, roadmap, and trends
> Market forecast by wafer starts, package units, and revenue

 

Focus on NAND flash packaging 


> NAND technology evolution & roadmap
> Packaging evolution, roadmap, and trends
> Market forecast by wafer starts, package units, and revenue

 

 

 

 

 

 

 

 

 

 

 

 

 

Focus on NOR flash packaging 


> NOR flash memory market trends
> Packaging evolution, roadmap, and trends
> Market forecast by wafer starts, package units, and revenue

 

Focus on 3D TSV packaging   


> Market and technology trends
> Market forecast by wafer starts, packageunits, and revenue

 

Bumping trends in memory packaging: forecast by wafers & revenue 


 

OSAT strategies   


 

Trends for Emerging Non-Volatile Memory (ENVM) technologies


> Focus on MRAM/STTMRAM, PCM, and ReRAM
> Status of industrialization, and near-term opportunities

 

China’s memory landscape 


> Status and prospects
> Announced investments

Conclusion  


 

Appendix


Companies cited

4DS
A*STAR
Acer
Adesto
Aeroflex
Altis
Apple
Apacer
ASE
Atmel
ATPAvalanche
Buffalo
CEA Leti
ChipMOS
Cisco
CNE
Crocus
Crossbar
Cypress
Dell
Ebay
EMC
Evaderis
Everspin
Facebook
Formosa Advanced Technologies
Freescale
Fujitsu
Fusion IO
Fujian Jinhua Integrated
Circuit Co. Ltd
Gemalto
Giesecke & Devrient
Gigadevice
GlobalFoundries
Google
Greatek
Electronics
Hana Micron
Hefei Chang Xin
H-Grace
HLMC
Honeywell
HP
Huawei
IBM
Imec
Infineon
Innovative Silicon
Intel
Integrated Silicon Solution (ISSI)
Intelligent Memory
ITRI
Kingston
Knowm
KYEC
LBSemicon
Lenovo
Lingsen
LG Electronics
Macronix
Maxim
Mediatek
Microchip

Micron-Elpida
Morpho
Nantero
Nanya
National Tsing Hua University
NEC
NEPES
NetApp
Nike
Nokia
Numonyx
NXP
Oberthur
Panasonic
Powertech Technology (PTI)
Qualcomm
Quantum
Rambus - Unity
Renesas
Samsung
Sandisk
Seagate
SFA Semicon
SGI
Signetics
Sino
King Technology
SK Hynix
Skyera
Smart Modular Technologies
SMIC
Sony
Spansion
SPIL
Spin Transfer Technology
Spreadtrum
STMicroelectronics
Stanford University
STEC
Sun
Symetrix
Taiwan IC Packaging Corporation
TDK
Tezzaron
TMS
Tohoku University
Toshiba
Towerjazz
TPSCO
Tsinghua Unigroup
TSMC
UTAC
UMC
Violin Memory
Walton
Weebit
Western Digital
Winbond
XMC
Yangtze River Storage Technology
and more...

 

 

 

 

 

 

 

 

 

 

KEY FEATURES OF THE REPORT

  • Memory packaging market forecast 2016 – 2022: in units, $US, and number of wafers by different packaging platform
  • Competitive landscape and market dynamics
  • Market share for memory OSATs and IDMs
  • Memory packaging roadmap
  • Segmentation, description, main technical trends per technology, main players, and roadmap for different memory packaging solutions