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Murata SAW Thermo-Compensated Band 8 Filter in Low Band Front-End Module

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DMurata RFSAW flyer

Murata has introduced thermo-compensated filter technology with a ceramic substrate in the Samsung Galaxy S7’s front-end module

In the front-end filter market, Murata, along with Broadcom, Qorvo, and Skyworks, is an RF components leader. Murata has forged its empire on ceramic passive electronic components and ceramic filters. Today, this old but effective technology is still used. Murata’s recent acquisition of Peregrine Semi-conductor (which specialized in RF CMOS) has provided entry into the smartphone market. The flagship Samsung Galaxy S7 smartphone is the latest one to integrate Murata’s front-end module with the FAJ15, featuring Murata’s thermo-compensated technology.

The front-end module is located on the smartphone’s main board, where Samsung has proposed a different configuration of its LTE front end. Murata’s FAJ15 was only found in the Galaxy S7’s U.S. version, where it shares the front end with Qorvo and Broadcom.

Die Murata FAJ15 SAW filter System Plus Consulting

The FAJ15 is dedicated to LTE low band. It is made with several filter dies assembled on a ceramic substrate. The filters are either bare dies or packages molded into FEM molding. As piezoelectric for SAW technology, the substrate dies are either LN (lithium niobium oxide) or LT (lithium tantalum oxide). The FEM contains two SAW technologies: STD-SAW (standard SAW) and TC-SAW (thermally compensated SAW). This report only focuses on the duplexer for the Band 8 LTE integrated in the FEM. This band’s specification required very low thermal drift, so the thermo-compensated layers are integrated to provide better performance relating to thermal changes.

IDT Murata FAJ15 SAW filter System Plus Consulting

The complete chip fabrication process and a cost estimate of the Band 8 component are presented in this report, along with a brief substrate packaging comparison with FEMs from Qorvo and Broadcom.

  Module Murata FAJ15 SAW filter System Plus Consulting



Table of contents

Overview / Introduction


Company profile & Supply Chain


Samsung Galaxy S7 Teardown


Physical Analysis

> Physical analysis methodology
> Front-end module package
> Front-end module views
> Front-end module cross-section
> Front-end module dies
> Power amplifier die-view & dimensions
> SPDT switch die-view & dimensions
> Band 8 duplexer - SAW filter die-view & dimensions
> Band 8 duplexer - SAW filter die opening
> Band 8 duplexer - SAW filter die cross-section



































Manufacturing Process Flow

> SAW fabrication unit
> SAW wafer process
> Component packaging


Cost Analysis

> SAW filter wafer front-end cost
> SAW filter wafer front-end cost per process
> SAW filter front-end probe test, thinning, and dicing cost
> SAW filter die cost
> Band 8 duplexer Package cost analysis
> Estimated sales price


Substrate Packaging Comparison with FEMs from Qorvo and Broadcom



About the authors


Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems.

























































  • Detailed photos

  • Precise measurements

  • Material analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price

  • Package substrate comparison with Qorvo TQF6405 and Broadcom AFEM9040