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Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band
Jan.2018

sp18374_-_qualcomm_qca9500_60_ghz_chipset_1
3 990 €

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Description

SP18374 Qualcomm QCA9500 60 GHz Chipset couv flyerDisruptive double side molded system-in-package-based chipset for millimeter-wave applications targeting consumer devices, including integrated antennae

2018 will be a key milestone in the journey towards 5G communication. Several areas, from semiconductor to packaging, will improve their technologies to be suitable for 5G deployment. We now know that the 5G frequency will be in the millimeter wave (mmWave) range. In this band, the IEEE has already licensed a Wifi 802.11 protocol, known as WiGig. Using 7 GHz of bandwidth in the 60 GHz band, it allows gigabit data-rates similar to wired communication. Only two main players share this upcoming market, Intel and Qualcomm. And as a pioneer in 5G development, Qualcomm is now offering a WiGig chipset. It provides an early glimpse of 5G mobile user experiences and technologies using an innovative System in Package (SiP) approach in the VIVE® QCA9500.

 

SP18374 Qualcomm QCA9500 60 GHz Chipset 1

 

This complete solution serves both mobile computer devices and access points, specifically routers. The module comes with two boards linked by a coaxial connection. The first board features a radio frequency integrated circuit (RFIC) and innovative antennae, and the second features an advanced SiP with a double sided molding configuration. The SiP integrates a baseband (BB) processor along with a switch, a regulator, a crystal, memory and more than 60 surface mounted device (SMD) components, all in a single package smaller than 40 mm². This is the first double side molded device we found in the market, and it could be a key milestone for 5G SiP technology.

Developed by Wilocity, which has been a Qualcomm subsidiary since 2014, the RFIC features up to four transceivers controlling up to 32 antennas, both patch and quasi-Yagi-type, for the beamforming at 60 GHz. The SiP uses non-conventional molded packaging developed by Amkor. It has innovative interconnections, enabling the redistribution of the BB processor signal to the printed circuit board (PCB). Copper pillars inside the molding and a very thin confined PCB substrate complete the signal distribution structure.

This report includes a full investigation of the module, featuring a detailed study of the SiP and the antenna board including die analyses, processes and board cross-sections. Finally, it contains a complete cost analysis and a selling price estimation of the system.

 

 

 

 

Table of contents

Overview / Introduction



Company profile & WiGig technology


 

TP-LINK Talon AD7200 Teardown


 

Physical Analysis


> Physical analysis methodology

> Module analysis
- Module view and dimensions
- Module marking and block diagram

 

> Baseband board analysis
- Board disassembly
- Board bill of material
- Board cross-section

 

> Baseband SiP analysis
- Package view and dimensions
- Package opening: Copper pillar, bill of material
- Package cross-section: PCB, copper pillar, dimensions
- Package process analysis

 

> Die analysis: Baseband processor, switch, regulator, memory
- Die view and dimensions
- Die cross-section
- Die process

 

> Physical analysis comparison
- SiP vs discrete

 

> Antenna board analysis
- Board disassembly
- Board bill of material
- Board cross-section

 


 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

> Die analysis: RFIC
- Die view and dimensions
- Die cross-section
- Die process

 

 

Manufacturing process flow


> Die fabrication unit: Baseband processor, RFIC

 

> Packaging fabrication unit

 

> SiP package process flow

 

 

Cost analysis


> Overview of the cost analysis

 

> Supply chain description

 

> Yield hypotheses

 

> Die cost analyses: Baseband processor, RFIC
- Front-end cost
- Wafers and die costs

 

> SiP Package cost analysis
- SiP Front-end cost
- SiP Cost by process step

 

> Final test cost

 

> Final assembly

 

> Component cost

 

 

Estimated Price Analysis


 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

  

 

 

 

 

 

 

 

 

 

 


About the authors

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos and cross-sections

  • Precise measurements

  • Material analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price